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Built-in circuit device assembly and its manufacturing method

A technology of circuit devices and manufacturing methods, which is applied in the fields of printed circuit manufacturing, multilayer circuit manufacturing, semiconductor/solid-state device manufacturing, etc., and can solve the problems of reduced reliability of built-in circuit device components, low thermal conductivity, and insufficient heat dissipation, etc.

Inactive Publication Date: 2004-07-07
PANASONIC CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] However, the existing substrates using the internal via hole connection method have a problem of low thermal conductivity because they are made of resin materials.
In the built-in circuit device assembly, the higher the mounting density of the circuit device is, the higher the requirement for heat dissipation of the heat generated by the device is, but sufficient heat dissipation cannot be performed in the existing substrate, so there is a problem that the built-in circuit device The problem of reduced reliability of components

Method used

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  • Built-in circuit device assembly and its manufacturing method
  • Built-in circuit device assembly and its manufacturing method
  • Built-in circuit device assembly and its manufacturing method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0123] First, an example of a method for producing an electrically insulating substrate composed of a mixture containing an inorganic filler and a thermosetting resin when producing the circuit device built-in module of the present invention will be described.

[0124] In the present example, an electrically insulating substrate was prepared according to the compounding ratio shown in Table 1. Meanwhile, a comparative example is shown as sample number 1.

[0125] sample

Numbering

Inorganic filler

thermosetting resin

other additives

(wt%)

Thermal conductivity

(W / mK)

Linear expansion coefficient

(ppm / °C)

Dielectric constant

1MHz

Dielectric loss

1MHz(%)

Dielectric strength (AC)

KV / mm

type

Amount (wt%)

type

Amount (wt%)

1

Al 2 o 3

60

liquid epoxy resin

WE-2025

39.8

Kabosobratsuku

(0.2)

0.52

45

3.5

...

Embodiment 2

[0146] Embodiment 2 is an example of manufacturing a circuit component built-in module by the method described in Embodiment 2.

[0147] The composition of the electrically insulating substrate used in this example is: 90% by weight of Al 2 o 3 (Showa Denko Co., Ltd., AS-40, spherical shape, average particle diameter 12 μm), 9.5% by weight of liquid epoxy resin (Nippon Recco (Co., Ltd.) product, EF-450), 0.2% by weight of carbon black ( Toyo Ka-bon Co., Ltd.), 0.3% by weight of coupling agent (Ajinomoto Co., Ltd., titanate type, 46B).

[0148] The above-mentioned material was processed under the same conditions as in Example 1 to produce a plate-like body (thickness: 500 μm). The plate-shaped body was cut into a predetermined size, and a through hole (0.15 mm in diameter) for connecting the inner via hole was formed with a carbon dioxide gas laser (see FIG. 2( b )).

[0149] A conductive resin composition is filled in the through holes by screen printing (see FIG. 2( c )). ...

Embodiment 3

[0158] Embodiment 3 is an example of manufacturing a circuit component built-in module by the method described in Embodiment 3.

[0159] First, in the same manner as in Example 2, a plate-like body (500 μm in thickness) in which the through-holes were filled with the conductive resin composition was fabricated (see FIG. 3( c )).

[0160] Then, a copper foil having a thickness of 35 μm was adhered to a release film (made of polyphenylene sulfide, 150 μm thick) with an adhesive. This copper foil is roughened on one side, and the glossy side is the adhesive side at the time of bonding.

[0161] Next, the copper foil on the release film is etched through a photolithography process and an etching process to form a wiring pattern. Further, a semiconductor device is mounted on the wiring pattern by flip-chip bonding using solder bumps (see FIG. 3( d )).

[0162] Next, a sealing resin is injected into the gap between the semiconductor device mounted on the wiring pattern and the wir...

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Abstract

A circuit component built-in module of the present invention includes an insulating substrate (401) formed of a mixture comprising 70wt% to 95wt% of an inorganic filler and a thermosetting resin, a plurality of wiring patterns (402a, 402b, 402c and 402d) formed on at least a principal plane of the insulating substrate (401), a circuit component (403) arranged in an internal portion of the insulating substrate and electrically connected to the wiring patterns, and an inner via (404) formed in the insulating substrate for electrically connecting the plurality of wiring patterns (402a, 402b, 402c and 402d). Thus, a highly reliable circuit component built-in module having high-density circuit components can be obtained.

Description

technical field [0001] The present invention relates to a built-in circuit device assembly, and more particularly to a built-in circuit device assembly in which, for example, active devices are arranged inside an electrically insulating substrate. Background technique [0002] In recent years, along with demands for higher performance and smaller size of electronic equipment, higher density and higher functionality of circuit devices have been further demanded. Therefore, there is a need for a circuit substrate corresponding to high density and high functionality of circuit devices. [0003] As a method of increasing the density of circuit devices, a method of multilayering the circuit can be considered, but in the conventional glass epoxy substrate, it is difficult to implement high-density mounting because a through-hole structure must be used. Therefore, as the best method for achieving higher circuit density, the inner via hole connection method that can connect the wir...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G06F17/30H01L21/56H01L23/14H01L23/31H01L25/065H01L25/10H04L29/08H05K1/18H05K3/20H05K3/40H05K3/46
CPCH01L2225/1058H05K2201/10378H01L2924/01046H01L23/3121H05K3/4617Y10S428/901H01L21/56H01L2924/01025H01L2224/16H05K3/4069H05K2201/0209H01L2924/01019H01L2924/19041H05K1/187H01L25/0652H05K3/4652H05K3/4658H04L29/08072G06F17/3089H01L2225/1035H01L2924/01079H01L25/105H04L69/329H01L23/145H01L2924/01078H01L2924/3025H01L25/16H05K1/188H05K3/20H01L2224/45144G06F16/958Y10T156/109Y10T428/24917Y10T428/24893H01L2924/00H01L25/065
Inventor 中谷诚一平野浩一
Owner PANASONIC CORP
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