Reinforced heat radiation type chip down embedded ball type array carrying board structure and making method thereof

Abstract

This invention discloses a strengthening radiation chip embedded downward ball array load plate structure and process method on the bases of method panting plates to meet the needs of matching IC package wieh mtal panting plates, thickness of which is flexiblly adjusted to provide a support angle plate, wane and increases operation of radiation power design. The surface process technology of plating nickel / gold can be used for this invented structure design in which wiring design of not using plating conducting wire to plate gold on full plate process of wireless plate nickel / gold surface process techonlogy and using the way of drilling microdown hole to make lead holes by nicreasing layer by laser to reduce wiring space of laser plate wire.

Description

technical field [0001] The invention relates to a structure and a manufacturing method of a chip facing down ball array carrier plate used in semiconductor packaging technology to strengthen heat dissipation by laser drilling, which can solve the problem of heat dissipation and cooling of IC packaging, and interference noise and noise caused by backtracking signals at the end of electroplating wires. Issues that add additional I / O layout requirements. Background technique [0002] Due to the trend of thin and small electronic products, coupled with the continuous increase in functions, and the continuous increase in the functions of electronic products, the number of I / Os of ICs in electronic products has increased rapidly, so its relative packaging technology must also be constantly improved. Updated to meet actual needs, so in line with the rise of flip-chip packaging with the latest technology in high-end products, the ball grid array (BGA) with high I / O density has becom...

AI Technical Summary

Problems solved by technology

[0002] Due to the trend of thin and small electronic products, coupled with the continuous increase in functions, and the continuous increase in the functions of electronic products, the number of I / Os of ICs in electronic products has increased rapidly, so its relative packaging technology must also be constantly improved. Updated to meet actual needs, so in line with the rise of flip-chip packaging with the latest technology in high-end products, the ball grid array (BGA) with high I / O density has become the mainstream in today's packaging technology, so many high-power ICs also use Ball grid array (BGA) packaging process, but the I / O packaging density of the ball grid array (BGA) is higher than other packaging methods, so that many high-power ICs will accumulate a lot of heat for a long time, and must be additionally Only by designing a heat dissipation and cooling structure can the normal operation of high-power IC functions be maintained

[0003] Known ways to improve the heat dissipation of high-power ICs are to attach fin-type heat sinks to the back of ceramics or organic substrate chips, and to provide some BGA packaging structures with heat dissipation effects. However, due to these known methods, Both require an additional manufacturing process, which increases the cost of the package, and the chip is not directly in contact with the heat dissipation fins, so that the heat dissipation effect is not good

In addition, the SUPER BGA launched by AmKor / AnAm, the world's largest packaging factory, and the USTAR BG of Texas Instruments (IT) are similarly designed with HEAT SINK and embedded downwards, trying to enhance their heat dissipation effect. They are basically BT materials. PBGA, and use mechanical drilling as the via hole (aperture ф250μm), and need to pull electroplated nickel / gold conductive wire, but still can not achieve the laser drill micro via hole (aperture ф50- -ф150μm) capacity

Images