Lead-free low-smelting point glass

A low melting point glass, glass technology, applied in electrical components, circuits, transportation and packaging, etc., can solve problems such as heat shrinkage and substrate deformation

Inactive Publication Date: 2006-06-14
CENT GLASS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, its firing temperature is usually higher than 630°C, and thus may cause substrate deformation and thermal shrinkage problems

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1-10 and comparative example 1-10

[0036] In each example, paste-like low-melting glass powder was prepared as follows. First, the raw materials of low-melting glass powder are mixed together. The formed mixture was put into a platinum crucible, and then heated in an electric furnace at a temperature of 1000-1100° C. for 1-2 hours, thereby obtaining the glass compositions shown in Tables 1-4. In fact, fine quartz sand powder, boric acid, alumina, zinc white, barium carbonate, magnesium carbonate, calcium carbonate, strontium carbonate, bismuth oxide, lithium carbonate, sodium carbonate, potassium carbonate, red lead, orthophosphate, indium oxide, Tin oxide, copper oxide, and silver nitrate were used as SiO for glass compositions, respectively. 2 , B 2 o 3 、Al 2 o 3 , ZnO, BaO, MgO, CaO, SrO, Bi 2 o 3 , Li 2 O, Na 2 O, K 2 O, PbO, P 2 o 5 、In 2 o 3 , SnO, CuO and Ag 2 O raw material. A portion of the resulting glass composition was poured into a mold, and the resulting glass block was used to mea...

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Abstract

The present invention relates to a lead-free low-melting glass for coating substrates. This glass contains 0.1-25wt% SiO 2 , 1-50wt% B 2 o 3 , 1-45wt% ZnO, 20-90wt% Bi 2 o 3 , 0.1-40wt%V 2 o 5 , 0-5wt% Nb 2 o 5 , 0-20wt%R 2 O, where R is Li, Na, or K, and 0-20 wt% RO, where R is Mg, Ca, Sr, or Ba. The coefficient of thermal expansion of this glass in the range of 30-300°C is 65×10 -7 / °C to 100×10 -7 / °C; and its softening point is not higher than 630°C.

Description

technical field [0001] The invention relates to a lead-free low-melting point glass for coating a substrate, in particular for coating a transparent electrode pattern or a bus electrode pattern deposited on a plasma display panel (PDP) substrate. This glass is used as an electrical insulating film for a PDP substrate. Background technique [0002] Transparent glass substrates are usually used as substrates for electronic components. Examples of such glass substrates are soda-lime-silicate glass and similar glasses (high strain point glasses) and alumino-lime-borosilicate glasses with low or almost no alkali content. In the range of 30-300 ℃, their thermal expansion coefficients are about 65×10 -7 / °C to about 100×10 -7 / °C. If the transparent glass substrate has a film having a coefficient of thermal expansion significantly different from that of the glass substrate, there is a possibility that defects such as peeling of the film and warping of the glass substrate may oc...

Claims

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Application Information

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IPC IPC(8): C03C3/066C03C4/00H01J11/02C03C8/24
CPCC03C3/066C03C8/24Y10T428/24802C03C3/068
Inventor 早川直也下冈泰真
Owner CENT GLASS CO LTD
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