Oligomer containing fluorine and phthalonitrile, condensate and preparation method thereof

A technology of phthalonitrile and nitrophthalonitrile, which is applied in the field of oligomers containing fluorine and phthalonitrile and their cured products and preparation, can solve the problems of poor dielectric properties and achieve Low softening point, improved dielectric properties, good solubility in acetone

Active Publication Date: 2017-10-20
INST OF CHEM CHINESE ACAD OF SCI +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] However, the dielectric properties of the phthalonitrile-containing resins reported above are poor and cannot be well applied to the field of functional composite resins.

Method used

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  • Oligomer containing fluorine and phthalonitrile, condensate and preparation method thereof
  • Oligomer containing fluorine and phthalonitrile, condensate and preparation method thereof
  • Oligomer containing fluorine and phthalonitrile, condensate and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0064] Mix 1 mol of m-fluorophenol with 0.4 mol of formaldehyde aqueous solution in a reaction vessel, heat up to 60°C, and add 0.005 mol of oxalic acid. After the oxalic acid was completely dissolved, the temperature was raised to 90°C and kept at 90°C for 3 hours. After the reaction is completed, the temperature of the reaction system is lowered to room temperature, the catalyst is washed away with distilled water at 50° C., and the distilled water is removed by vacuum distillation to obtain a fluorine-containing novolak resin. Under the protection of nitrogen at room temperature, the above-mentioned fluorine-containing novolac resin was dissolved in 150mL N,N-dimethylformamide (DMF), and 0.75mol 4-nitrophthalonitrile and 1.2mol anhydrous carbonic acid were added to it. Potassium, raise the temperature of the system to 80°C. Keep the reaction at 80°C for 8 hours. After the reaction is completed, cool the reaction system to room temperature, remove the reaction solvent in t...

Embodiment 2

[0068] Mix 1 mol m-trifluoromethylphenol with 0.4 mol formaldehyde aqueous solution in a reaction vessel, heat up to 60°C, and add 0.005 mol oxalic acid. After the oxalic acid was completely dissolved, the temperature was raised to 90°C and kept at 90°C for 3 hours. After the reaction is completed, the temperature of the reaction system is lowered to room temperature, the catalyst is washed away with distilled water at 50° C., and the distilled water is removed by vacuum distillation to obtain a fluorine-containing novolak resin. Under the protection of nitrogen at room temperature, the above-mentioned fluorine-containing novolak resin was dissolved in 150mol N,N-dimethylformamide (DMF), and 0.75mol 4-nitrophthalonitrile and 1.2mol anhydrous potassium carbonate were added to it , the temperature of the system was raised to 80°C. Keep the reaction at 80°C for 8 hours. After the reaction is completed, cool the reaction system to room temperature, remove the reaction solvent in...

Embodiment 3

[0071] Mix 1 mol m-trifluoromethylphenol with 0.4 mol formaldehyde aqueous solution in a reaction vessel, heat up to 60°C, and add 0.005 mol oxalic acid. After the oxalic acid was completely dissolved, the temperature was raised to 90°C and kept at 90°C for 3 hours. After the reaction is completed, the temperature of the reaction system is lowered to room temperature, the catalyst is washed away with distilled water at 50° C., and the distilled water is removed by vacuum distillation to obtain a fluorine-containing novolak resin. Under nitrogen protection at room temperature, dissolve the above-mentioned fluorine-containing phenolic resin in 150mol N,N-dimethylformamide (DMF), and add 0.55mol 4-nitrophthalonitrile and 1.2mol anhydrous potassium carbonate to it , the temperature of the system was raised to 80°C. Keep the reaction at 80°C for 8 hours. After the reaction is completed, cool the reaction system to room temperature, remove the reaction solvent in the system by rot...

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Abstract

The invention discloses an oligomer containing fluorine and phthalonitrile, a condensate and a preparation method thereof. The method comprises the following steps: firstly, adopting fluorine-containing phenol and formalin for preparing a fluorine-containing linear phenolic resin; and by utilizing 4-nitro phthalonitrile to react with a phenolic hydroxyl group of the fluorine-containing linear phenolic resin, introducing a phthalonitrile group into the side chain thereof, thereby acquiring the oligomer containing fluorine and phthalonitrile. The oligomer can self-catalytically cure under the condition of no catalyst. The introduction of the fluorine-containing group can effectively reduce the dielectric constant and dielectric loss of the condensate. Compared with a fluoride-free phthalonitrile-containing phenolic oligomer, the oligomer disclosed by the invention has the advantages of lower softening point and better acetone solubleness; the dielectric property of the condensate formed by the oligomer is improved; the thermal performance and the mechanical property are basically kept; the oligomer can be used as a high temperature resisting wave-transmitting material which can be applied to the fields of aerospace or copper-clad plate, electronic packaging, and the like.

Description

technical field [0001] The invention relates to the technical field of thermosetting resins, in particular to an oligomer containing fluorine and phthalonitrile, its cured product and a preparation method. Background technique [0002] Thermosetting resin is a kind of advanced composite material resin matrix with relatively mature application, which is mainly divided into structural composite material resin matrix and functional composite material resin matrix. Among them, the resin matrix of structural composite materials includes epoxy resin, bismaleimide resin and polyimide resin, etc.; the resin matrix of functional composite materials mainly includes phenolic resin and cyanate resin. Among these two types of resins, only polyimide resins can be used at temperatures exceeding 300°C. However, small molecules are released during the curing process of polyimide resins. The curing process requires high temperature and high pressure, which requires high equipment. Therefore,...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C07C255/54C07C253/30C07C39/367C07C37/20C09K3/00
Inventor 李峥周恒郭颖韩悦赵彤
Owner INST OF CHEM CHINESE ACAD OF SCI
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