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Polyphenyleneoxide-based composite resin composition for IC tray

A technology of composite resin and polyphenylene oxide, which is applied in the direction of circuits, electrical components, packaging, etc., can solve problems such as heat resistance temperature cannot withstand baking temperature, mold shrinkage rate does not match, dimensional stability decreases, etc., to achieve excellent Effect of linear thermal expansion coefficient and mechanical strength, smooth surface and appearance, enhanced heat resistance

Inactive Publication Date: 2003-01-22
GE POLYMERLAND
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0010] However, without the addition of carbon black or carbon fibers, the dimensional stability is significantly reduced
Moreover, the heat-resistant temperature cannot withstand the baking temperature, and the shrinkage rate of the existing mold does not match, resulting in the problem that the mold for injection molding of the integrated circuit tray must be discarded or must be completely repaired.
In addition, it costs a lot of money

Method used

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Examples

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Comparison scheme
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Embodiment Construction

[0017] The best way to carry out the invention

[0018] Each component of the polyphenylene oxide composite resin composition according to the present invention will be described in detail below.

[0019] (1) Polyphenylene oxide or polyphenylene ether

[0020] Generally, polyphenylene oxides or polyphenylene ethers (hereinafter will be referred to as polyphenylene ethers) were first developed by GE Plastics in the United States. The present invention uses more than two kinds of polyphenylene ethers developed by GE Plastics Company of the United States used alone or in combination. The copper content of the polyphenylene ether is below 10ppm, and the toluene content is below 2000ppm.

[0021] In the present invention, polyphenylene ethers with an intrinsic viscosity of 0.1-0.4, 0.41-1.0, or higher are preferably used alone or in combination. At this time, polyphenylene ether with high intrinsic viscosity is used to suppress the exposure of glass fiber, mica and other filler ...

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PUM

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Abstract

The present invention relates to polyphenylene-based composite resin composition for IC TRAY, which comprises polyphenyleneoxide or polyphenylene ether at the amount of 20 to 98 wt% of total composition weight; one or more resins selected from the group consisting of polystylene, polyphenylene sulfide, polyetherimide, polycarbonate and polyethylene (including HDPE, LDPE, LLDPE, VLDPE) at the amount of 1 to 40 wt% of total composition weight; and glass fiber or inorganic fillers at the amount of 1 to 40 wt% of total composition weight. In addition, the composition of the present invention has excellent mechanical strength, dimensional stability, low linear fever expansion coefficient, and a good outlook for a product. The composition of the present invention is appropriate for IC TRAY in view that it does not deflect due to contraction, linear expansion coefficient and heat, thus having excellent dimensional stability.

Description

technical field [0001] The present invention relates to a polyphenyloxy composite resin composition for IC TRAY. In more detail, the present invention relates to polyphenylene oxide-based composite resins for integrated circuit trays having excellent heat resistance, good product surface quality, excellent injection moldability, and excellent shrinkage and linear expansion coefficients combination. In order to obtain excellent dimensional stability and warpage resistance for IC trays using polyphenylene oxide composite resin compositions in new IC tray injection molds or existing IC tray injection molds And heat resistance, these factors play a very important role. Background technique [0002] In the past, for the manufacture of integrated circuit trays, it was mainly to combine acrylic butadiene styrene copolymer (ABS), polyphenylene oxide or polyphenylene ether (PRO or PPE), polysulfone or polyethersulfone resin with carbon fiber or conductive carbon black And mixed wi...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B65D85/86C08J5/00C08K3/00C08K3/04C08K3/26C08K5/00C08K7/04C08L23/04C08L25/04C08L25/06C08L69/00C08L71/12C08L79/08C08L81/02C08L101/00
CPCC08L69/00C08L25/06C08L81/02C08L71/12C08L79/08C08L2666/14C08L2666/02
Inventor 金光燮朴明雨
Owner GE POLYMERLAND
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