Silver-plated copper powder and its prepn process

Abstract

The present invention discloses one high performance silver-plated copper powder and its preparation process. Copper powder after being acid pickled is dispersed in dispersant solution, silver nitrate solution complexed with organic amine compound is added under stirring and at certain temperature for reaction, and through further water washing, filtering to separate, vacuum drying, silver-plated copper powder with silver content of 4.5-30 wt% is produced. Compared with available technology, the present invention has the features of stable and high conductivity, and the silver-plated copper powder may be used widely in conducting adhesive, conducting paint and other fields needing conducting and electrostatic conducting material.

Description

technical field

[0001] The invention relates to a high-performance silver-plated copper powder and a preparation method thereof. The silver-plated copper powder has excellent anti-oxidation and anti-migration properties, and can be widely used in various conductive adhesives, conductive coatings, and conductive rubbers that require electrical conductivity. Especially suitable for environments with high conductivity requirements, such as conductive adhesives for surface assembly. Background technique

[0002] Due to the advancement of integrated circuit packaging technology, the traditional soldering technology can no longer meet the demand. High-performance conductive adhesives are gradually replacing soldering tin as the main connecting material. Nowadays, silver-based conductive adhesives are widely used, but silver plays a role in DC bias. Under the environment, it is easy to migrate and cause a short circuit, which greatly reduces the safety factor of the application. ...