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Silver-plated copper powder and its prepn process

A technology of silver-plated copper powder and copper powder, applied in liquid chemical plating, coating, metal material coating process, etc., can solve the problem of failing to meet the conductivity requirements of conductive adhesive, high powder resistivity, and no mention of powder Conductivity and other issues, to achieve the effect of strong anti-migration ability, high conductivity and saving silver

Inactive Publication Date: 2003-03-19
WUHAN UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Invention patent application [publication number: CN1262043A] discloses a method for preparing silver-coated copper powder by substitution reaction. The anti-oxidation performance of the powder prepared by this method is improved, and it is a high-efficiency antibacterial agent, but the powder is not mentioned in the article. conductivity
The literature [Electroless Silver Plating of Copper Powder and Its Properties] also introduces a preparation method of composite powder, but the resistivity of the obtained powder is relatively high, and the resistivity of the powder is 3×10 -3 More than Ω.cm, failing to meet the conductivity requirements required for surface mount conductive adhesives

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0011] Embodiment 1: Get 15 grams of copper powder and add 5% dilute sulfuric acid solution, stir repeatedly, after the oxide compound on the surface of copper powder is completely removed, rinse copper powder with distilled water, wash away sulfuric acid, copper powder is transferred to the solution containing 5% In the sodium citrate solution, keep the solution temperature at 50°C, stir, add 0.15mol / L silver nitrate solution complexed with ethylenediamine 50ml, continue to stir for 10 minutes, wash the obtained powder with water repeatedly, filter, and vacuum dry at 80°C to obtain Required silver-plated copper powder. The silver plating efficiency is 90%, and the silver content is 4.7%. The powder was mixed with E-51 epoxy resin and curing agent, wherein the weight ratio of powder and polymer component was 75:25. The properties of the prepared conductive adhesive and the properties of the powder are listed in Table 1.

Embodiment 2

[0012] Embodiment 2: get copper powder 50 grams and add 5% nitric acid solution, stir to after the oxide compound on copper powder surface is removed completely, rinse copper powder with distilled water, the copper powder that will wash is changed in the sodium acetate solution of 10%, Keep the solution temperature at 25°C, stir, add 100ml of 0.6mol / L silver nitrate solution complexed with a mixture of diethylenetriamine and polyethylenepolyamine, and continue stirring for 12 minutes. The obtained powder is washed, filtered, and dried to obtain the required silver plating. copper powder. The silver plating efficiency is 87%, and the silver content is 10%. Glue is made with embodiment 1, and the properties of gained conductive glue and powder are listed in Table 1.

Embodiment 3

[0013] Embodiment 3: get copper powder 30 grams and add 10% formic acid solution, after stirring to the oxide compound on copper powder surface completely remove, rinse copper powder with distilled water, the copper powder that will wash is changed over to 5% sodium oxalate and 5% In the methylcellulose mixed solution, keep the solution temperature at 40°C and stir, add 80ml of 0.7mol / L silver nitrate solution complexed with ethanolamine, and continue stirring for 10 minutes. The obtained powder is washed repeatedly, filtered, and dried to obtain silver-plated copper powder. . The silver plating efficiency is 85%, and the silver content is 26%. Glue is made with embodiment 1, and the properties of gained conductive glue and powder are listed in Table 1.

[0014] The dispersant in the above examples is replaced by one or a mixture of sodium malate, disodium ethylenediaminetetraacetic acid, glycine, gelatin, gum arabic, and ethyl cellulose, and the amine compound is replaced by...

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PUM

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Abstract

The present invention discloses one high performance silver-plated copper powder and its preparation process. Copper powder after being acid pickled is dispersed in dispersant solution, silver nitrate solution complexed with organic amine compound is added under stirring and at certain temperature for reaction, and through further water washing, filtering to separate, vacuum drying, silver-plated copper powder with silver content of 4.5-30 wt% is produced. Compared with available technology, the present invention has the features of stable and high conductivity, and the silver-plated copper powder may be used widely in conducting adhesive, conducting paint and other fields needing conducting and electrostatic conducting material.

Description

technical field [0001] The invention relates to a high-performance silver-plated copper powder and a preparation method thereof. The silver-plated copper powder has excellent anti-oxidation and anti-migration properties, and can be widely used in various conductive adhesives, conductive coatings, and conductive rubbers that require electrical conductivity. Especially suitable for environments with high conductivity requirements, such as conductive adhesives for surface assembly. Background technique [0002] Due to the advancement of integrated circuit packaging technology, the traditional soldering technology can no longer meet the demand. High-performance conductive adhesives are gradually replacing soldering tin as the main connecting material. Nowadays, silver-based conductive adhesives are widely used, but silver plays a role in DC bias. Under the environment, it is easy to migrate and cause a short circuit, which greatly reduces the safety factor of the application. ...

Claims

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Application Information

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IPC IPC(8): B22F1/02C23C18/42
Inventor 朱华甘复兴
Owner WUHAN UNIV
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