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Method for bonding and encapsulating plastic biochip and its device

A biochip and packaging method technology, which is applied in biochemical equipment and methods, microbial determination/inspection, biological testing, etc. It is difficult to guarantee and other problems to achieve the effect of easy computer automatic control, easy automatic control and simple structure

Inactive Publication Date: 2004-03-10
HUAZHONG UNIV OF SCI & TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, this method is complicated in technology, increases the process of depositing micro-heaters, and is difficult to control the heating time and temperature, and it is difficult to ensure that the power of the micro-heaters is equally divided.
This method, as well as the above-mentioned several traditional methods, are used for the packaging of biochips, and there are possible pollution problems

Method used

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  • Method for bonding and encapsulating plastic biochip and its device
  • Method for bonding and encapsulating plastic biochip and its device
  • Method for bonding and encapsulating plastic biochip and its device

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Embodiment Construction

[0022] The specific content and embodiments of the present invention will be further described in detail below in conjunction with the accompanying drawings.

[0023] Take the typical biochip plastic microfluidic chip as an example. In FIG. 1( a ), the chip 10 and the cover 11 are fabricated separately using existing microfabrication techniques or replication techniques. The cover 11 is used to seal the microfluidic channel 12 on the chip 10 to prevent the fluid from flowing through or leaking to other areas, and at the same time play the role of isolating and protecting the chip from the outside world and providing an observation window. In order to control the accuracy of bonding and packaging, matching alignment marks 13 and 14 are respectively made on the chip 10 and the cover 11 to facilitate bonding alignment. Figure 1(B) shows a schematic diagram of the laser-bonded microfluidic channel. Laser bonding is used to bond the area around the microfluidic channel 12 in the ...

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Abstract

The method includes following steps: (1) aligning chip with close over and making plastic parts to be bonded contact tightly; (2) guiding laser beam to penetrate through transparent plastic layer to reach the location to be bonded, laser irradiation making plastic layer and coating layer be melted; (3) controlling time and intensity of laser energy, making congruent melting between two materials. The device includes laser light source system, laser beam transformation system, workpiece alignment platform, offset table, servo controller and microcomputer main control system. The advantages of the invention are fast heating up and small heat affected zone, easy to be controlled by computer, high efficiency and reliability.

Description

technical field [0001] The invention belongs to the technical field of micro-electromechanical systems (MEMS), and in particular relates to a method for bonding and packaging plastic biochips and a device thereof. Background technique [0002] The processing technology based on non-silicon plastic materials has been paid more and more attention in the research of microfluidic chips and biochip MEMS, forming a new class of bioMEMS devices. Plastic polymer materials not only have the advantages of being chemically compatible with biomolecules, but also have a wide variety of plastics, are inexpensive, and are easy to achieve large-scale and low-cost production through molding, injection molding, and other replication techniques, overcoming the challenges of silicon or glass materials. The processing technology to produce bioMEMS is limited by the high cost and low yield. [0003] As the cost of biochip manufacturing decreases, the proportion of packaging costs has increased s...

Claims

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Application Information

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IPC IPC(8): C12Q1/68G01N27/22G01N27/30G01N33/50G01N33/68G01N35/00
Inventor 赖建军易新建刘胜连崑
Owner HUAZHONG UNIV OF SCI & TECH
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