Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Chemical plating nickel conductive film on polymer thin film surface and method for preparing the same

A polymer film, chemical nickel plating technology, applied in the field of chemical plating, can solve problems such as difficulty in plating nickel, achieve the effects of lightweight shielding materials, reduce electromagnetic pollution, and reduce interference

Inactive Publication Date: 2004-11-17
NANJING UNIV
View PDF0 Cites 19 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, it is quite difficult to plate nickel on non-metallic materials, especially for large-area thin-film polymer materials. Due to its unique surface inertia, it is difficult for nickel metal to adhere well on the surface of this type of thin film. Therefore, it has not been used before. see the report

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Chemical plating nickel conductive film on polymer thin film surface and method for preparing the same
  • Chemical plating nickel conductive film on polymer thin film surface and method for preparing the same
  • Chemical plating nickel conductive film on polymer thin film surface and method for preparing the same

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0028] Such as figure 1 The preparation method of the electroless nickel-plated conductive film on the surface of a polymer film shown, adopts 2 * 5cm 2 , a polyethylene terephthalate (PET) film with a thickness of 120m as the substrate, immersed in a 30g / L NaOH solution at 60°C for 30min, washed with water, immersed in a solution containing 10g / L stannous chloride, 0.5g / L Palladium chloride, in 20g / L 37% hydrochloric acid solution for 1min, washed with water, immersed in 20g / L hydrochloric acid solution for 1min, washed with water to complete pretreatment and pretreatment. Then immerse in the 80°C plating solution for 1min, the formulation of the plating solution is nickel chloride 25g / L, sodium hypophosphite 15g / L, sodium citrate 120g / L, ammonium chloride 40g / L, pH value 9. A nickel-plated PET conductive film is obtained, the thickness of the coating is about 1 μm, and the coating is dense under microscope observation.

Embodiment 2

[0030] Such as figure 1 The preparation method of the electroless nickel-plated conductive film on the surface of a polymer film shown, adopts 2 * 5cm 2 , a polyethylene terephthalate (PET) film with a thickness of 120 μm is the substrate, and the pretreatment and pretreatment are completed as in Example 1. Then immerse in a 45°C plating solution for 10 minutes. The difference is that the formulation of the plating solution is nickel sulfate 45g / L, sodium hypophosphite 30g / L, sodium pyrophosphate 50g / L, triethanolamine 15g / L, and pH 9.5. A nickel-plated PET conductive film was obtained, the thickness of the coating was about 5 μm, and the coating was dense under microscope observation.

Embodiment 3

[0032] Such as figure 1 The preparation method of the electroless nickel-plated conductive film on the surface of a polymer film shown, adopts 2 * 5cm 2 , a polyethylene terephthalate (PET) film with a thickness of 120 μm is the substrate, and the pretreatment and pretreatment are completed as in Example 1. Then immerse in the plating solution at 85°C for 1.5 minutes. The difference is that the formulation of the plating solution is nickel chloride 25g / L, sodium hypophosphite 15g / L, sodium glycolate 60g / L, lead nitrate 0.001g / L, twelve Sodium alkyl sulfate 0.02g / L, pH 5. A nickel-plated PET conductive film was obtained, the thickness of the coating was about 2 μm, and the coating was dense under microscope observation.

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
Thicknessaaaaaaaaaa
Thicknessaaaaaaaaaa
Thicknessaaaaaaaaaa
Login to View More

Abstract

The invention discloses a chemical plating nickel conductive film on polymer thin film surface and method for preparing the same, wherein the conductive film is prepared through the steps of, (1) a pretreatment step of cleaning the surface of the polymer film, (2) carrying out activating and / or sensitization to the polymer film obtained in steps (1), water scrubbing for use later, throwing the polymer film obtained in step (2) into chemical plating liquid, water scrubbing for use later, (4) drying and heat treatment at 120-220 deg. C.

Description

technical field [0001] The invention relates to a conductive film obtained by attaching a layer of metal coating on the surface of a polymer film and a preparation process thereof, in particular to a conductive film obtained by plating nickel on the surface of a polymer and a preparation process thereof, and belongs to the technical field of chemical plating. Background technique [0002] With the widespread use of electronic and electrical products, while bringing convenience to people's lives, it also brings about the problem of electromagnetic pollution. These electromagnetic pollution often cause greater interference to other electronic equipment, and also affect people's health. . At the same time, in the military, the shielding of radar waves is an important part of military equipment stealth. Existing shielding materials often directly use metal sheets, metal mesh, etc., which have a problem of large specific weight, which limits the application in some areas that re...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): C23C18/20C23C18/28C23C18/36
Inventor 张弢蒋正生章维益
Owner NANJING UNIV
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com