Full-para-polyfiber amide paper, and its preparing method and use

A technology of aramid amide paper and aramid, applied in papermaking, textiles and papermaking, synthetic cellulose/non-cellulose material pulp/paper, etc., can solve the problems of harsh production process, general dimensional stability, limited use, etc. problems, achieve excellent low temperature performance, good controllable dielectric properties, and improve the effect of tensile strength

Inactive Publication Date: 2005-12-21
SOUTH CHINA UNIV OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, since the meta-aramid fibrids used as adhesives require high temperature and high pressure processing conditions, and the dimensional stability under high humidity is

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0042] The para-aramid fiber paper is made by mixing 95% (weight percentage) of para-aramid short fiber and 5% (weight percentage) of para-aramid pulp by wet forming. The para-aramid staple fiber is Kevlar29, obtained from Dupont Ltd, 3.33dtex, and 9mm in length. The para-aramid pulp is Twaron, available from Akzo Ltd.

[0043] With a beater, the above-mentioned aramid short fibers are dispersed in the aqueous solution, and 0.15% of octadecylamine (concentration in the aqueous solution) and 0.01% of cationic polyacrylamide (PAM) (concentration in the aqueous solution) are added in the aqueous solution as Dispersing aid to obtain a uniformly dispersed suspension. Use a beater to disperse the aramid pulp in the aqueous solution, and add carboxymethylcellulose sodium (CMC) 0.01% (concentration in the aqueous solution) as a dispersing aid to the aqueous solution to obtain a uniformly dispersed suspension. The two liquids were mixed and stirred uniformly to obtain a slurry with a...

Embodiment 2

[0049] By wet forming, para-aramid fiber paper is produced by mixing 80% (weight percentage) of para-aramid short fibers and 20% (weight percentage) of para-aramid pulp. The para-aramid short fiber is Kevlar29, obtained from Dupont Ltd, 3.33dtex, and 6mm in length. The para-aramid pulp is Twaron, available from Akzo Ltd.

[0050] Use a beater to disperse the above-mentioned aramid short fibers in an aqueous solution, and add 0.002% sodium dodecylbenzenesulfonate (concentration in the aqueous solution) into the aqueous solution as a dispersing aid to obtain a uniformly dispersed suspension. Use a beater to disperse the aramid pulp in the aqueous solution, add carboxymethylcellulose sodium (CMC) 0.002% (concentration in the aqueous solution) as a dispersing aid in the aqueous solution, and obtain a uniformly dispersed suspension. The two liquids were mixed and stirred uniformly to obtain a slurry with a concentration of 0.0002% (concentration in aqueous solution).

[0051] It ...

Embodiment 3

[0056] Through wet forming, para-aramid fiber paper is produced by mixing 60% (weight percentage) of para-aramid short fibers and 40% (weight percentage) of para-aramid pulp. The para-aramid short fiber is Kevlar29, obtained from Dupont Ltd, 3.33dtex, and 6mm in length. The para-aramid pulp is Twaron, available from Akzo Ltd.

[0057] With a beater, the above-mentioned aramid short fibers are dispersed in the aqueous solution, and 0.15% of octadecylamine (concentration in the aqueous solution) and 0.01% of cationic polyacrylamide (PAM) (concentration in the aqueous solution) are added in the aqueous solution as Dispersing aid to obtain a uniformly dispersed suspension. Use a beater to disperse the aramid pulp in the aqueous solution, and add carboxymethylcellulose sodium (CMC) 0.01% (concentration in the aqueous solution) as a dispersing aid to the aqueous solution to obtain a uniformly dispersed suspension. The two liquids were mixed and stirred uniformly to obtain a slurry...

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Abstract

The invention relates to preparation technique of full para position Fanglun amide paper which includes: adding in water para position aromatic amide short fiber, para position aromatic poly-amide cream, disperse assistant, acquire cream material by dispersing the raw material; the cream confection on net; dehydrate, squeezing, drying; dipping in para position aromatic poly-amide solution to get fiber paper, processing with heat or cold pressing, the coagulation liquor shapes, washing off dissolvent, dehydrating, squeezing and drying to get para position Fanglun amide paper. The paper is of high stretch resistance tearing resistance, abrading resistance and fine flexibility, can be applied as structure material, insulation material for power generator, motor, and potential transformer, honeycomb material, heat insulation material, fire retardant material, filter material or electric material; it is of low wet heat expanding factor, fine controllable dielectric properties, fine heat stability and laser processability, can be applied to produce special purpose paper for high temperature or layer pressing plate of satellite communication line and high speed transmitting circuit.

Description

technical field [0001] The invention relates to papermaking technology, in particular to a full para-aramid paper and its preparation method and application. Background technique [0002] Compared with other conventional fiber papers made of aramid materials, aramid paper has the advantages of high strength, high modulus, excellent dielectric properties, excellent solvent resistance and thermal dimensional stability, and light weight. It can be widely used in aerospace, transportation, electronics and other industries as structural materials, insulating materials, wave-transmitting and filtering materials. The preparation method of such synthetic fiber paper is disclosed in Japanese Laid-Open Patent Application No. Hei 1 [1989]-281790. Aramid fiber paper made of organic resin binder and p-aramid fiber such as Composition of p-phenylene terephthalamide / oxydiphenylene diamine copolymer fibers (Technora, Teijin Ltd.) and poly-p-phenylene terephthalami...

Claims

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Application Information

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IPC IPC(8): D21H13/26
Inventor 胡健王宜梁云杜杨
Owner SOUTH CHINA UNIV OF TECH
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