Electromagnetic noise suppressor, article with electromagnetic noise suppression function, and their manufacturing methods

A technology for noise suppression and manufacturing method, which is applied to magnetic objects, circuits, magnetic materials, etc., and can solve the problems of insufficient sturdiness, softness, light weight, and large thickness of electromagnetic wave interference suppressors.

Inactive Publication Date: 2006-01-18
SHIN-ETSU POLYMER CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0021] However, in this EMI suppressor, since the EMI suppressor itself is thick and contains a large number of magnets over the entire range of the insulating magnetic layer, it is too heavy to achieve weight reduction.
In addition, since the amount of the organic binder is small, the firmness and flexibility are not sufficient, and it is not satisfactory for realizing high-density assembly.

Method used

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  • Electromagnetic noise suppressor, article with electromagnetic noise suppression function, and their manufacturing methods
  • Electromagnetic noise suppressor, article with electromagnetic noise suppression function, and their manufacturing methods
  • Electromagnetic noise suppressor, article with electromagnetic noise suppression function, and their manufacturing methods

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0285] In a polyethylene terephthalate film (hereinafter referred to as PET) with a thickness of 12 μm as a substrate (shear modulus of 3.8×10 9 (Pa), carbon dioxide transmittance is 1×10 -11 [cm 3 (STP)cm / (cm 2 ×s×cmHg)], the average surface roughness is 1.8μm), and the Mn-Zn system high magnetic permeability ferrite with a converted film thickness of 3nm is sputtered by the facing target magnetron sputtering method to form a composite layer. The surface resistance of the composite layer was carefully measured by the DC 4-terminal method. In addition, this film was adjusted to a desired size, a polyester-based adhesive was inserted and laminated in the middle of ten films, and they were integrated by vacuum press molding to obtain an electromagnetic wave noise suppressor with a total thickness of 138 μm. . Next, specific gravity and electromagnetic wave noise suppression characteristics were measured. The results are shown in Table 1.

Embodiment 2

[0287] On the PET film with a thickness of 25 μm as a support layer, a silicon (oxygen) rubber (shear modulus of 1×10) with a thickness of 20 μm is set as a substrate. 7 (Pa), the transmittance of carbon dioxide gas is 2.2×10 -7 [cm 3 (STP)cm / (cm 2 ×s×cmHg)]), on which, by facing the target magnetron sputtering method, the Fe-Ni system soft magnetic metal with a film thickness of 20nm is sputtered to form a composite layer. The surface resistance of the composite layer was carefully measured by the DC 4-terminal method. Furthermore, this thin film was adjusted to a desired size to obtain an electromagnetic wave noise suppressor with a total thickness of 45 μm. Next, specific gravity and electromagnetic wave noise suppression characteristics were measured. The results are shown in Table 1.

Embodiment 3

[0289] On a PET film with a thickness of 25 μm as a support layer, a polyurethane gel (shear modulus of 1.7×10 6 (Pa), carbon dioxide transmittance is 5.3×10 -8 [cm 3 (STP)cm / (cm 2 ×s×cmHg)]) on it by magnetron sputtering method (non-facing target type), sputtering a Fe-Si-Al system soft magnetic metal with a conversion film thickness of 15nm to form a composite layer. The surface resistance of the composite layer was carefully measured by the DC 4-terminal method. Furthermore, 2 μm of urethane gel was coated on the composite layer, and sputtering was performed again. By repeating this process to set three composite layers, an electromagnetic wave noise suppression body with a total thickness of 79 μm was obtained. Next, specific gravity and electromagnetic wave noise suppression characteristics were measured. The results are shown in Table 1.

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Abstract

An electromagnetic noise suppressor is disclosed in the present invention, which includes a base material(2) containing a binding agent and a composite layer(3) formed by integrating the binding agent that is a part of the base material 2 and the magnetic material. This electromagnetic noise suppressor has high electromagnetic noise suppressing effect in the sub-microwave band, and enables it to reduce the space requirement and weight. The electromagnetic noise suppressor can be manufactured by forming the composite layer 3 on the surface of the base material 2 by physical vapor deposition of the magnetic material onto the surface of the base material 2. The article with an electromagnetic noise suppressing function of the present invention is an electronic component, a printed wiring board, a semiconductor integrated circuit or other article of which at least a part of the surface is covered by the electromagnetic noise suppressor of the present invention.

Description

technical field [0001] The invention relates to an electromagnetic wave noise suppression body, an article with the electromagnetic wave noise suppression function and a manufacturing method thereof. Background technique [0002] In recent years, with the popularization of the use of the Internet, personal computers, information appliances, wireless LAN, Bluetooth, optical modules, mobile phones, portable information terminals, advanced road information systems, etc. Electronic devices using CPUs and high-frequency buses, and information communication equipment using radio waves are also becoming popular, and a society that requires high-performance devices utilizing high-speed digitization and low-voltage drives is ushered in. However, with the popularization of these machines, the electromagnetic waves radiated by these machines cause problems of electromagnetic wave interference such as misoperation of itself or other electronic machines, and effects on the human body. T...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K9/00H01F1/00
Inventor 川口利行藤木弘直谷口敦权田贵司田原和时
Owner SHIN-ETSU POLYMER CO LTD
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