Metal micro member batch processing method

Abstract

Disclosed is a method for batch preparation of metallic microelement, belonging to the technique field of Micro Electro-Me-chanical Systems. Firstly preparing die according to the form of re-prepared microelement, stamping the macromolecular polymer substrate with the die to batch prepare macromolecular polymer die, surface conductive treatment to the macromolecular polymer, micro-electroforming the macromolecular polymer die, rubbing the extra metal on the surface, and removing the macromolecular polymer substrate, then the needed metallic microelement is prepared. In the invention, it decreases the complexity of batch preparation of metallic microelement, accelerates the technique flow, and solves the problem of preparing metallic microelement in low cost and with batch production. The preparation method is characterized in that the technique is simple, the flexibility and uniformity is perfect, the cost is low, and it is suit for mass production.

Description

technical field [0001] The invention relates to a processing method in the field of micro-electromechanical technology, in particular to a batch processing method for metal micro-components. Background technique [0002] The wide application of micro-electromechanical systems (MEMS: Micro Electro Mechanical Systems) devices has led to the vigorous development of various micro-processing technologies. At present, there are two main types of micromachining technologies used in the manufacture of microelectromechanical systems in the world: one is surface silicon micromachining technology and bulk silicon micromachining technology developed based on microelectronics technology. Some silicon micromachines have been successfully developed by using this technology, such as micro accelerometers, micro pressure sensors, micro motors, and micro pumps, but this technology can only micro process silicon materials, which greatly limits its application range. The second process is the u...

AI Technical Summary

Problems solved by technology

Some silicon micromachines have been successfully developed by using this technology, such as micro accelerometers, micro pressure sensors, micro motors, micro pumps, but this technology can only micro process silicon materials, which greatly limits its application range

The second process is the use of LIGA technology (German Li thografie, G alvanoformung, A bformung, representing three main processes: X-ray deep lithography process, micro-electroforming process and micro-replication technology), the advantage of this technology is that it can manufacture three-dimensional metal or plastic micro-mechanical devices, and the obtained devices have a large depth Wide ratio and fine structure, steep side walls, flat surface, is the perfect combination of X-ray deep lithography, micro-electroforming and micro-replication process, but it requires expensive synchrotron radiation X-ray source and X-ray mask, and processing The cycle time is long, so its application is also limited

The disadvantage is that the SU-8 glue process is more complicated, the cycle is longer, and each time the glue is removed is a more difficult process. Therefore, in mass production, the prepared metal components are used as molds, and compression molding technology, Micro-electroforming technology for micro-replication, that is: first prepare a conductive substrate, then coat a layer of plastic on it, obtain a plastic mold on the substrate through a molding process, and then perform micro-electroforming on the sample to remove the conductive substrate and plastic. get metal products

The disadvantage of this technology is that the micro-replication process is cumbersome, and it is necessary to prepare a conductive substrate each time, and then coat the plastic in a fluid state; it is also necessary to accurately control the thickness of the coated plastic according to the height of the metal device; and the microstructure of the plastic after molding. Forming a plastic residual layer, the electroformed part cannot be completely conductive, and the residual layer needs to be etched away. The process is relatively complicated and the cost is high