Heat radiation seat using graphite as base and method for prepn. of said graphite

Abstract

A heat radiator with graphite base for electronic device is prepared by plating a metal layer on the graphite base. Its graphite base is prepared from natural graphite through pulverizing to obtain micron-particles, mixing with adhesive, granulating, mixing, high-, cold-, or hot-pressure vibrating to become block, immersing it in liquid-phase asphalt, and graphitizing.

Description

technical field [0001] The present invention provides a heat sink with graphite as the base and a method for manufacturing the same, especially using cold pressing, hot pressing and vibration to form spherical graphite into a block, and immersing it in liquid phase pitch to fill the gaps, and After another graphitization, the density and strength of graphite can be increased, and it can have excellent three-dimensional thermal conductivity. Background technique [0002] With the vigorous development of high technology, the volume of electronic components tends to be miniaturized, and the density per unit area is getting higher and higher, and their performance is continuously enhanced. Under these factors, the total calorific value of electronic components is It is increasing almost year by year. If there is no good heat dissipation method to remove the heat generated by electronic components, these excessively high temperatures will cause electron ionization and thermal str...

AI Technical Summary

Problems solved by technology

[0002] With the vigorous development of high technology, the volume of electronic components tends to be miniaturized, and the density per unit area is getting higher and higher, and their performance is continuously enhanced. Under these factors, the total calorific value of electronic components is It is increasing almost year by year. If there is no good heat dissipation method to remove the heat generated by electronic components, these excessively high temperatures will cause electron ionization and thermal stress in electronic components, resulting in a decrease in overall stability and shortening of the electronic components themselves. Therefore, how to remove the heat to avoid overheating of electronic components has always been a problem that cannot be ignored

[0003] However, future semiconductors and electronic devices will tend to have higher power and higher density. Correspondingly, heat dissipation is a problem that developers will continue to face in the future. Currently, the high energy emitted by electronic components during work The high-density heat brought by high power density, the current heat dissipation method uses pure copper as the basic material of the heat spreaders, or further embeds the heat pipe (Heat Pipe) into the foundation In order to speed up the speed of thermal diffusion, but the cost of this method is relatively increased, and with the progress and improvement of electronic components, the density per unit area is also getting higher and higher, making it necessary to make The speed of thermal diffusion is also accelerated, and ...

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