Surface adhesive broadband microwave single-layer chip capacitor and manufacturing method thereof

Abstract

This invention relates to a surface-pasted broadband microwave single layer sheet condenser including a single layer ceramic medium, an up electrode and a down electrode, in which, said up electrode and down electrode are adhered on the two opposite surfaces of the ceramic medium characterizing that said down electrode is divided into two and an electrode clearance is remained between them and a method is also disclosed.

Description

technical field [0001] The invention relates to a capacitor, in particular to a surface-mounted broadband microwave single-layer chip capacitor. This capacitor has only one layer of ceramic dielectric in terms of structure, and is a chip capacitor, which is suitable for surface mount technology ( Surface Mounted Technology, referred to as SMT), is mainly used in broadband radio frequency and microwave circuits; the present invention also relates to the manufacturing method of this surface mounted broadband microwave single-layer chip capacitor. technical background [0002] Single layer capacitor (Single Layer Capacitor, referred to as SLC) is a new type of ceramic capacitor developed to meet the requirements of high frequency, high integration, miniaturization, low power consumption and high reliability of electronic components. Compared with Ceramics Capacitor (MLCC for short), due to the small number of electrodes, the current loop between the dielectric layers is greatly...

AI Technical Summary

Problems solved by technology

With the development of 3G mobile communication and the rapid development of Global Positioning System (Global Position System, referred to as GPS), there are more and more occasions where the operating frequency is 1-10GHz, and most of these use occasions adopt SMT assembly technology. The use of SLC components is limited

[0005] Existing SLC components need to use Au-Sn solder for bottom welding and gold wire welding for the upper electrode, which has high cost and low efficiency, is not suitable for mass production, and requires special equipment. Gold wire will also bring distributed inductance, and its distributed inductance is about 1nH / 1mm

General welding is also required to be carried out in a nitrogen atmosphere, which is not only difficult to assemble, but also difficult to maintain

The chip soldering process is related to the substrate and the type of soldering material. It is a specialized technology. Improper handling can easily cause problems such as component cracking and affect the assembly yield

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