Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Surface adhesive broadband microwave single-layer chip capacitor and manufacturing method thereof

A single-layer chip and manufacturing method technology, applied in the field of capacitors, can solve the problems of component cracking, SLC component usage restrictions, high cost, etc., and achieve the effects of increased working voltage, improved reliability, and fewer electrodes

Inactive Publication Date: 2006-09-13
广州翔宇微电子有限公司
View PDF1 Cites 11 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

With the development of 3G mobile communication and the rapid development of Global Positioning System (Global Position System, referred to as GPS), there are more and more occasions where the operating frequency is 1-10GHz, and most of these use occasions adopt SMT assembly technology. The use of SLC components is limited
[0005] Existing SLC components need to use Au-Sn solder for bottom welding and gold wire welding for the upper electrode, which has high cost and low efficiency, is not suitable for mass production, and requires special equipment. Gold wire will also bring distributed inductance, and its distributed inductance is about 1nH / 1mm
General welding is also required to be carried out in a nitrogen atmosphere, which is not only difficult to assemble, but also difficult to maintain
The chip soldering process is related to the substrate and the type of soldering material. It is a specialized technology. Improper handling can easily cause problems such as component cracking and affect the assembly yield

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Surface adhesive broadband microwave single-layer chip capacitor and manufacturing method thereof
  • Surface adhesive broadband microwave single-layer chip capacitor and manufacturing method thereof
  • Surface adhesive broadband microwave single-layer chip capacitor and manufacturing method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1-9

[0039] Such as Figure 1-9 The surface-mounted broadband microwave single-layer chip capacitor shown includes a single-layer ceramic dielectric 2, an upper electrode 1 and a lower electrode 3, and the upper electrode 1 and the lower electrode 3 are respectively attached to two opposite sides of the ceramic dielectric 2. On one surface, the lower electrode 3 is divided into two, and an electrode gap 4 is left between the two lower electrodes 3 .

Embodiment 1

[0042] Such as figure 1 As shown, there is no border between the upper electrode 1 and the lower electrode 3 and the surface of the ceramic medium 2 to which they are attached.

Embodiment 2

[0044] Such as figure 2As shown, there is a margin 5 around the bottom electrode 3 and the surface of the ceramic medium 2 to which it is attached.

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
thicknessaaaaaaaaaa
thicknessaaaaaaaaaa
thicknessaaaaaaaaaa
Login to View More

Abstract

This invention relates to a surface-pasted broadband microwave single layer sheet condenser including a single layer ceramic medium, an up electrode and a down electrode, in which, said up electrode and down electrode are adhered on the two opposite surfaces of the ceramic medium characterizing that said down electrode is divided into two and an electrode clearance is remained between them and a method is also disclosed.

Description

technical field [0001] The invention relates to a capacitor, in particular to a surface-mounted broadband microwave single-layer chip capacitor. This capacitor has only one layer of ceramic dielectric in terms of structure, and is a chip capacitor, which is suitable for surface mount technology ( Surface Mounted Technology, referred to as SMT), is mainly used in broadband radio frequency and microwave circuits; the present invention also relates to the manufacturing method of this surface mounted broadband microwave single-layer chip capacitor. technical background [0002] Single layer capacitor (Single Layer Capacitor, referred to as SLC) is a new type of ceramic capacitor developed to meet the requirements of high frequency, high integration, miniaturization, low power consumption and high reliability of electronic components. Compared with Ceramics Capacitor (MLCC for short), due to the small number of electrodes, the current loop between the dielectric layers is greatly...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): H01G4/005H01G4/12H01G13/00
Inventor 庄严梁颖光朱卓雄李壮举蔡杨杨俊锋冯毅隆
Owner 广州翔宇微电子有限公司
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com