Flame retardant adhesive composition, and adhesive sheet, coverlay film and flexible copper-clad laminate using same

A technology for covering films and compositions, applied in the direction of adhesive types, film/sheet adhesives, lamination, etc., can solve the problem of poor migration resistance, expensive nitrile rubber, and materials that are impossible to use on a large scale and other problems, to achieve the effect of good flame retardant performance

Inactive Publication Date: 2006-10-18
SHIN ETSU CHEM IND CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0005] Known materials meeting the above requirements include, for example, adhesive compositions comprising epoxy resins, aromatic phosphate esters, curing agents, and high-purity nitrile rubber, and flexible copper-clad laminates and laminates using the adhesive compositions. cover layer (see patent reference 1), but high-purity nitrile rubber is very expensive, which means that the material is not likely to be used on a large sc

Method used

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  • Flame retardant adhesive composition, and adhesive sheet, coverlay film and flexible copper-clad laminate using same
  • Flame retardant adhesive composition, and adhesive sheet, coverlay film and flexible copper-clad laminate using same

Examples

Experimental program
Comparison scheme
Effect test

Example Embodiment

[0134] [Example 1]

[0135] Combine each component of the adhesive composition according to the ratio shown in the column of Example 1 in Table 1, and then add a mixed solvent of methyl ethyl ketone and dioxolane to the resulting mixture to obtain an organic solid component and an inorganic solid component. The total concentration of the dispersion is 35% by mass.

[0136] The above dispersion was applied to the surface of polyimide film A (trade name: Kapton H, manufactured by DuPont Toray Co., Ltd., thickness: 25 μm) using an applicator, and the applied amount was sufficient to make the coating thickness after drying The thickness is 10 μm, and then the coating layer is dried in a forced-air oven at 120° C. for 10 minutes to change the composition to a semi-cured state. Then the surface of the dispersion-coated polyimide film A and the surface of the rolled copper foil were bonded together by thermocompression bonding using a roll laminator at 120°C and a linear pressure of 2 kg...

Example Embodiment

[0137] [Example 2]

[0138] A flexible copper-plated laminate was prepared in the same manner as in Example 1, except that each component of the adhesive composition was combined in the ratio shown in the column of Example 2 in Table 1. The characteristics of the flexible copper-plated laminate were also measured in accordance with Test Method 1 below. The results are shown in Table 1.

Example

[0139] [Comparative Examples 1 and 2]

[0140] A flexible copper-plated laminate was prepared in the same manner as in Example 1, except that each component of the adhesive composition was combined in the ratio shown in the columns of Comparative Examples 1 and 2 in Table 1, respectively. The characteristics of the flexible copper-plated laminate were also measured in accordance with Test Method 1 below. The results are shown in Table 1.

[0141] 【Test Method 1】

[0142] 1-1. Peel strength

[0143] The peel strength is measured in accordance with JIS C6481 by forming a circuit with a 1mm width pattern on a flexible copper-plated laminate, and then measuring the copper foil ( The above circuit) is the minimum force required for peeling at a speed of 50 mm / min, and this measured value is used as the peel strength.

[0144] 1-2. Soldering heat resistance (normal conditions)

[0145] The soldering heat resistance was measured in accordance with JIS C6481 by cutting a 25mm square from ...

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Abstract

Provided is a flame retardant adhesive composition including (A) a halogen-free epoxy resin, (B) a thermoplastic resin and/or a synthetic rubber, (C) a curing agent, (D) an organophosphinate compound, and (E) a curing accelerator. Also provided are an adhesive sheet having a layer including the above composition, and a protective layer for covering the layer including the composition; a coverlay film having an electrically insulating film, and a layer including the above composition provided on top of the film; and a flexible copper-clad laminate having an electrically insulating film, a layer including the above composition provided on top of the film, and copper foil. Further provided are a process for producing the adhesive sheet, a process for producing the coverlay film, and a process for producing the flexible copper-clad laminate. The halogen-free adhesive composition yields a cured product, on curing, that exhibits excellent flame retardancy and electrical characteristics (anti-migration properties). The composition can be used for producing an adhesive sheet, a coverlay film, and a flexible copper-clad laminate.

Description

technical field [0001] The present application relates to an adhesive composition which is halogen-free and gives a cured product which exhibits excellent flame retardancy once cured, and also relates to adhesive sheets, cover films and Flexible copper-clad laminate. Background technique [0002] Adhesives commonly used for electronic materials such as semiconductor sealing materials and glass epoxy-based copper-clad laminates include bromine-containing epoxy resins or phenoxy resins or the like to ensure an excellent level of flame retardancy. However, since these compounds containing halogens such as bromine release toxic gases when burned, such as dioxin-based compounds, the use of halogen-free materials in adhesives has been a research hotspot in recent years. [0003] On the other hand, flexible copper-clad laminates that are thinner than the above-mentioned glass-epoxy-based copper-clad laminates and can provide additional soft properties are being widely used, and as...

Claims

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Application Information

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IPC IPC(8): C09J163/00B32B15/088B32B37/12C09J7/02C09J109/02C09J133/00C09J167/00
Inventor 中西畅近藤和纪星田繁宏天野正
Owner SHIN ETSU CHEM IND CO LTD
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