Thermostable benzoxazine resin compound and its preparation method and uses

A technology of resin compound and benzoxazine, which is applied in the field of heat-resistant benzoxazine resin compound and its preparation, can solve the problems of expensive monomer, limited application, and insignificant improvement of heat resistance, etc., and achieves Effects of increasing cross-linking density, improving heat resistance, and increasing carbon residue rate

Inactive Publication Date: 2006-12-27
SICHUAN UNIV
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, the application of this method is still limited due to the hig

Method used

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  • Thermostable benzoxazine resin compound and its preparation method and uses
  • Thermostable benzoxazine resin compound and its preparation method and uses
  • Thermostable benzoxazine resin compound and its preparation method and uses

Examples

Experimental program
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Example Embodiment

[0043] Example 1 Preparation of terephthalaldehyde (TPA) / diamine benzoxazine (B-BOZ) complex

[0044] Mix 90g of diamine-type benzoxazine (B-BOZ) and 10g of terephthalaldehyde (TPA) at a temperature of 90°C and stir and mix uniformly, and then vacuumize at a vacuum of 0.05~0.095MPa at a temperature of 130°C for 0.5 hours. 2 hours at 140°C, 3 hours at 150°C, 1 hour at 160°C, 1 hour at 170°C, 1 hour at 180°C, 1 hour at 190°C, 1 hour at 200°C, at 220°C The cured product is obtained at 1 hour at ℃, the glass transition temperature is 240℃, the tensile strength is 75MPa, the tensile modulus is 4.7Gpa, the elongation at break is 1.8%, the flexural strength is 115MPa, and the flexural modulus is 4.7GPa. . The mass ablation rate is 0.0201g / s. The cured product has undergone TGA thermal analysis, and the test results are shown in Table 1.

Example Embodiment

[0045] Example 2 Preparation of aldehyde group-containing monocyclic benzoxazine (AS-BOZ) / diamine type benzoxazine (B-BOZ) complex

[0046] Combine 77 g of diphenylmethane diamine benzoxazine (B-BOZ) with 3-phenyl-6-aldehyde-3,4-dihydro-2H-1,3-benzoxazine (AS-BOZ) 23g is mixed uniformly at a temperature of 90°C, and then vacuumed at a vacuum degree of 0.05~0.095MPa at a temperature of 130°C for 0.5 hours, at 140°C for 1 hour, at 150°C for 2 hours, at 160°C for 1 hour, at 170°C After curing for 1 hour, at 180°C for 1 hour, at 190°C for 1 hour, at 200°C for 1 hour, and at 220°C for 1 hour. After TGA thermal analysis, the test results are shown in Table 1

Example Embodiment

[0047] Example 3 Preparation of furfural and diamine benzoxazine (B-BOZ) complex

[0048] Mix 91g of diamine benzoxazine (B-BOZ) and 9g of furfural (Furfural) at a temperature of about 90℃, stir and mix uniformly, and then vacuumize at a vacuum of 0.05~0.095MPa at a temperature of 130℃ for 0.5 hours, and then at 130℃. 3 hours at ℃, 1 hour at 140°C, 1 hour at 150°C, 1 hour at 160°C, 1 hour at 170°C, 2 hours at 180°C, 1 hour at 200°C, 1 hour at 220°C to cure Then, after TGA thermal analysis, the test results are shown in Table 1

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Abstract

The invention relates the heat-durability benzoxazine resin compound and preparing method, comprising the following steps: dissolving 50-95wt% benzoxazine resin intermediate, 0-50wt% aromatic compounds liquid resin with aldehyde group and 0-50wt% benzoxazine resin with aldehyde group into solvent between room temperature and 50Deg.C, getting heat-durability benzoxazine resin compound solvent, carrying out coating or dipping technology, getting prepreg, or mixing and getting solid resin compound, forming at 150Deg.C, carrying out heat treatment at 180Deg.C, and getting the product.

Description

technical field [0001] The invention relates to a heat-resistant benzoxazine resin compound and a preparation method thereof, and belongs to the field of thermosetting resins and high-performance composite material matrix resins and the preparation thereof. Background technique [0002] Benzoxazine is a kind of benzo six-membered heterocyclic ring system composed of oxygen atom and nitrogen atom. It has the characteristics of ring-opening polymerization, no small molecules are released during polymerization, and a network structure similar to phenolic resin is formed after polymerization. Small curing shrinkage, low porosity, excellent mechanical properties, electrical properties and flame retardant properties. In the 1940s, foreign countries conducted systematic research on the reaction of phenolic intermediates, amine intermediates and formaldehyde, and synthesized intermediates containing benzoxazine ring structures: [0003] [0004] Since the 1970s, foreign countrie...

Claims

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Application Information

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IPC IPC(8): C08L79/00C09K3/10C09K5/14H01B3/30
Inventor 顾宜田巧冉起超李曹成晓情盛兆碧
Owner SICHUAN UNIV
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