Polyamide membrane self-assembling structure

Abstract

The invention relates to a self-assembling structure for polyimide film, comprising: at least a micro-structured unmovable part and at least a micro-structured movable part, where the two parts use polyimide film as flexible contact, it generates surface tension at the flexible contact by return-welding making process, and rotationally lifts the movable part. And it can be widely applied to the self-assembling technique for multiple micromation industries, and has simple making steps, low cost and high accuracy.

Description

Technical field [0001] The invention relates to a self-assembled structure of a polyimide film, which is a self-assembled planar technology applied to miniaturization technology, which has the characteristics of simplicity, rapidity and low cost, and can solve the shortcomings of traditional conventional technologies. Background technique [0002] The research and application of miniaturization technology is one of the two major trends in modern science, especially the self-assembly technology, which is the mainstream method of microstructure assembly in the microcosm in recent years. [0003] For the micro fan (Micro Fan) made by Micro electromechanical Systems (MEMS) technology, the Scratch Drive Actuator (SDA) of the micro fan must be self-assembled with the micro blade structure. Technology and multi-user (MEMS) steps (Multi-User MEMS Processes; MUMPs) can be completed. [0004] The so-called self-assembly technology means that the microstructure assembly mechanism will posit...

AI Technical Summary

Problems solved by technology

[0010] l. Lead pollution: tin-lead alloy balls are mixed with tin and lead metals (63Sn / 37Pb), so there is lead pollution between the machine and the environment during reflow soldering

[0011] 2. High cost: Most of the microstructures use polysilicon (Poly-si) as the main structure. If tin-lead alloy balls are to be attached to it, a layer of gold pad (Gold Pad) must be plated on the surface of the polysilicon first. The bonding interface between tin-lead alloy balls, this extra step makes the manufacturing process difficult and increases the cost

[0012] 3. Poor accuracy: When calculating the lifting angle or displacement value of the microstructure, the size of the sphere must be accurately grasped, but the tin-lead alloy ball has a volume error of up to 25%, so that the lifting angle or displacement value cannot be accurately controlled

[0014] 5. Cannot be miniaturized: the size of the existing tin-lead alloy balls cannot be smaller than 100 μm, which makes the minimum size of the flexible contact relatively limited

[0016] The steps of making flexible contacts with photoresist are not as complicated as tin-lead alloy balls, and the cost is lower, but it must be released by dry or wet etching to release the cantilever of the microstructure

[0017] The dry etching method uses liquid carbon dioxide to release the cantilever of the microstructure and replace the water molecules in it to avoid the sticking effect of the cantilever. However, the carbon dioxide supercritical machine (Super criticalCO2 Dry Release) equipment used in this method is expensive , so the relatively high cost

[0018] The wet etching method does not require additional manufacturing equipment, so the cost is low, but after the sacrificial layer is etched with a solution such as hydrofluoric acid (HF) or buffered hydrofluoric acid (BOE), it must be made with isopropyl alcohol (IPA) Molecules evaporate quickly to release the cantilevers, and isopropanol has the property of dissolving photoresist, thus destroying the previously made flexible joints

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