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Fluorine-containing phenol resin derivative and its composition and preparation method

A technology of phenolic resin and its derivatives, which is applied in the direction of electrical components, circuits, and electrical solid devices, can solve the problems of phenolic resins being easy to absorb and viscosity increase, and achieve low dielectric constant, low water absorption, and low dielectric loss. Effect

Inactive Publication Date: 2007-05-16
INST OF CHEM CHINESE ACAD OF SCI
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

But the obtained phenolic resin is easy to oxidize, and its viscosity will increase rapidly with the prolongation of storage time

Method used

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  • Fluorine-containing phenol resin derivative and its composition and preparation method
  • Fluorine-containing phenol resin derivative and its composition and preparation method

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Experimental program
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Effect test

preparation example Construction

[0038] Preparation of the first part of fluorine-containing phenolic resin derivatives

[0039] The resin provided by the present invention, when R is H, is a fluorine-containing phenolic resin, which can be prepared by condensation reaction of fluorine-containing phenol of formula IV, phenol and biphenyl derivatives of formula V under acid catalysis; When R is an epoxy substituent of formula III, it is a fluorine-containing phenolic epoxy resin, which can be prepared by epoxidizing the fluorine-containing phenolic resin and halogenated propylene oxide. What the method of the present invention prepares is a kind of random copolymer or pure resin containing only structural units of formula I. When it is a random copolymer, various chain unit units are randomly arranged in the polymer main chain.

[0040] In the preparation process of fluorine-containing phenolic resin, a water separator can be used to separate and remove water, alcohol and the like generated during the reaction...

Embodiment 1

[0043] Add 242 grams of 4,4'-bis(methoxymethyl)biphenyl and 528 grams of 3-trifluoromethylphenol in the flask equipped with thermometer, nitrogen inlet, water trap, condenser, stirrer, Heating under the protection of nitrogen, and starting to stir, all the solids are dissolved to form a homogeneous liquid. Slowly add 1 g of p-toluenesulfonic acid to the above reaction liquid so that the liquid temperature does not exceed 50°C. Heating to raise the reaction temperature to 120°C, during which the color of the reaction solution deepened and began to boil. The by-product methanol formed during the reaction was separated and removed by a water separator, and the reaction was stirred at 120° C. for 5 hours. After the reaction is complete, cool to room temperature; add 1000 grams of methyl isobutyl ketone to the reaction solution, mix and stir evenly; in a separatory funnel, wash the organic liquid with 300 grams of deionized water. Repeat washing until the washing liquid is neutra...

Embodiment 2

[0045] Add 396 grams of 4,4'-bis(methoxymethyl)biphenyl and 528 grams of 4-trifluoromethylphenol in the flask equipped with thermometer, nitrogen inlet, water separator, condenser, stirrer, Heating under the protection of nitrogen, and starting to stir, all the solids are dissolved to form a homogeneous liquid. Slowly add 3 ml of 37% hydrochloric acid to the above reaction solution so that the temperature of the solution does not exceed 50°C. Heating to raise the reaction temperature to 120°C, during which the color of the reaction solution deepened and began to boil. The by-product methanol formed during the reaction was separated and removed by a water separator, and the reaction was stirred at 120° C. for 5 hours. After the reaction is complete, cool to room temperature; add 1000 grams of methyl isobutyl ketone to the reaction solution, mix and stir evenly; in a separatory funnel, wash the organic liquid with 300 grams of deionized water. Repeat washing until the washing ...

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Abstract

The invention discloses a fluophena resin derivant and composition and preparing method with structural unit as formula I and II, wherein the chain unit number of formula I and II is 1-10 or the repeating unit is homopolymer with structure I with chain unit at 1-10; the softening point of fluophena resin derivant is 45-140 Deg C, wherein R is H or substituted radical in the formula III.

Description

technical field [0001] The invention relates to a fluorine-containing phenolic resin derivative, its composition and a preparation method. Background technique [0002] With the rapid development of integrated circuits (ICs) toward high performance, multi-function, low cost, and green direction, microelectronic packaging materials are also developing toward high heat resistance, high adhesion, broadband, low dielectric, and low moisture absorption. , Lead-free and bromine-free greening and other directions. As one of the main packaging materials for IC circuits, epoxy molding compounds must find alternatives to traditional packaging materials while improving heat resistance to adapt to lead-free technology and packaging process performance to adapt to high-density, ultra-thin, and complex-structure IC circuit packaging. The method of containing bromine flame retardant in epoxy molding compound, and developing a new type of bromine-free flame retardant epoxy molding compound...

Claims

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Application Information

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IPC IPC(8): C08G61/00C08G59/00C08K5/09H01L23/29
Inventor 杨士勇丁佳培范琳陶志强
Owner INST OF CHEM CHINESE ACAD OF SCI
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