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Method of manufacturing chemical mechanical polishing pad and polishing pad

A chemical machinery, polishing pad technology, applied in surface polishing machine tools, manufacturing tools, grinding/polishing equipment, etc., can solve problems such as unsatisfactory polishing rate and polishing surface state

Active Publication Date: 2010-09-29
JSR CORPORATIOON
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Although the design of the chemical mechanical polishing pad is described in detail in the above-mentioned patent document JP-A 11-70463, the polishing rate and the state of the polishing surface are still not satisfactory

Method used

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  • Method of manufacturing chemical mechanical polishing pad and polishing pad
  • Method of manufacturing chemical mechanical polishing pad and polishing pad
  • Method of manufacturing chemical mechanical polishing pad and polishing pad

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0151] (1) Manufacture of chemical mechanical polishing pads

[0152] 80 parts by volume (equal to 72 parts by weight) of 1,2-polybutadiene (manufactured by JSR Corporation under the trademark JSR RB830) and 20 parts by volume (equal to 28 parts by weight) of β-cyclodextrin (manufactured by Bio Research Corporation of Yokohama, under the trademark Dexy Pearl β-100, with an average particle diameter of 20 µm) were stirred together. Add 1.0 parts by volume of Percumyl D40 (trademark, manufactured by NOF Corporation, containing 40% by mass of dicumyl peroxide) (equal to 0.44 parts by weight of pure dicumyl peroxide) as dicumyl peroxide and in Stirring together with the above stirring product at 120° C. to obtain pellets of the composition for forming a chemical mechanical polishing pad. The pellets were fed into a mold and heated at 170° C. for 18 minutes to crosslink them, so that a disk-shaped molded product (cushion) having a diameter of 600 mm and a thickness of 2.5 mm was o...

Embodiment 2

[0163]28.2 parts by weight of polytetramethylene glycol (manufactured by Mitsubishi Chemical Co., Ltd., trademarked as PTMG650) and 21.7 parts by weight of 4,4'-diphenylmethane diisocyanate (made by Sumika BayerUrethane Co., . Ltd., the trademark is Sumidule 44S) into the reactor and stirred at 90 ° C for 3 hours to react, and then cooled to obtain a prepolymer having isocyanate groups at both ends, wherein the polytetramethylene glycol It has two hydroxyl groups at both ends of the molecule and has a number average molecular weight of 650.

[0164] 14.5 parts by weight of β-cyclodextrin (manufactured by Bio Research Corporation of Yokohama, under the trademark Dexy Pearl β-100, with an average particle diameter of 20 μm) was dispersed as water-soluble particles into 21.6 parts by weight of polypropylene glycol (made by manufactured by NOF Corporation under the trade name Uniol TG300, an addition reaction product of glycerin and propylene oxide) and 6.9 parts by weight of PTMG...

Embodiment 3

[0170] After forming the first set of grooves in the pad of Example 1, four linear grooves (with a width of 1.0 mm) extending from the center of the pad to the peripheral end were formed by a cutting machine equipped with a drive unit capable of indexing angles and positioning and a depth of 1.0 mm) as a second set of grooves, these grooves contact each other at the center of the pad polishing surface and the angle between adjacent linear grooves is 90°. four slots with Figure 9 The second set of four grooves that touch each other at the center correspond. Four slots are formed using one milling cutter. In addition, 28 pairs of linear grooves (with a pitch of 2 mm between grooves) extending from a point 25 mm from the center of the pad to the peripheral end of the pad were formed by the same cutting machine as above, and the angle between adjacent linear grooves is 11.25°. 28 pairs of slots with Figure 9 The 28 pairs of slots shown correspond. These pairs of grooves wer...

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Abstract

The present invention relates to a method of manufacturing a chemical mechanical polishing pad which provides a chemical mechanical polishing pad which fully suppresses the occurrence of a scratch on the polished surface and has an excellent polishing rate. The method comprising either one of a group of steps (A) and a group of steps (B), the group of steps (A) including (A1) the step of preparing a composition for forming a chemical mechanical polishing pad; (A2) the step of molding the composition for forming a chemical mechanical polishing pad into a pad-like form; (A3) the sep of mountingthe pad-like form on the round table of a cutting machine having at least a milling unit equipped with a milling cutter, a drive unit capable of angle indexing and positioning and a round table journaled by the drive unit; (A4) the step of forming the second group of grooves with the milling cutter; and (A5) the step of forming the first group of grooves, and the group of steps (B) including (B1)the step of preparing a composition for forming a chemical mechanical polishing pad; (B2) the step of molding the composition for forming a chemical mechanical polishing pad into a pad-like form having the second group of grooves by using a metal mold having projections corresponding to the shapes of the second group of grooves; and (B3) the step of forming the first group of grooves.

Description

technical field [0001] The present invention relates to methods of making chemical mechanical polishing pads that can be conveniently used in chemical mechanical polishing processes. Background technique [0002] In the manufacture of semiconductor devices, chemical mechanical polishing (CMP) has drawn much attention as a polishing technique capable of forming a very flat surface. Chemical mechanical polishing is a technique for polishing by allowing an aqueous dispersion used in chemical mechanical polishing, for example, an aqueous dispersion of abrasive grains, to flow down onto the surface of a chemical mechanical polishing pad while the polishing pad and the surface to be polished The surfaces are in sliding contact with each other. It is known that polishing performance is greatly influenced by the performance characteristics and characteristics of the polishing pad in chemical mechanical polishing. [0003] Heretofore, chemical mechanical polishing has been performe...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B24D18/00B24D17/00B24B29/02H01L21/304B23C3/30B23C5/08B23Q1/52B24B37/20B24D99/00
CPCB24B37/26H01L21/304
Inventor 保坂幸生田野裕之西村秀树志保浩司
Owner JSR CORPORATIOON
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