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Supersonic method of lowering internal stress of electroplated copper film

A technology of electroplating copper and ultrasonic waves, applied in the field of materials, can solve the problems of high equipment requirements, reducing the internal stress of electroplating copper film, and not yet found, and achieve the effect of reducing internal stress

Inactive Publication Date: 2007-06-06
SHANGHAI JIAO TONG UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Its disadvantages are: the use of high-frequency ultrasound requires high equipment requirements, and it is difficult for ordinary ultrasonic bath equipment to meet this requirement
In further searches, no relevant reports have been found on the use of ordinary low-frequency ultrasonic bath equipment to reduce the internal stress of electroplated copper films

Method used

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  • Supersonic method of lowering internal stress of electroplated copper film
  • Supersonic method of lowering internal stress of electroplated copper film
  • Supersonic method of lowering internal stress of electroplated copper film

Examples

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Effect test

example 1

[0024] Prepare an electroplating solution containing 100 g / L copper sulfate and 100 g / L sulfuric acid without adding any additives. The electroplating tank containing 500 ml of electroplating solution is placed in an ultrasonic bath, the ultrasonic power is 120W, the operating frequency is 40kHz, and the water level in the ultrasonic bath is slightly higher than the liquid level of the electroplating solution in the electroplating tank. The anode is copper sheet, the substrate is aluminum alloy, the temperature is controlled at 30-35 degrees Celsius, and the current density is 8A / dm 2 . The electroplating time is 2, 5, 10, 30, 60 minutes respectively, and the copper coatings with thicknesses of 2, 8, 15, 30, 60 microns are obtained respectively. The specific method of temperature control of the plating solution is: use the drainage hole of the ultrasonic bath to drain the water, and at the same time, introduce water lower than 25 degrees Celsius into the ultrasonic bath until...

example 2

[0026] Prepare an electroplating solution containing 100 g / L copper sulfate, 100 g / L sulfuric acid, 2 g / L thiourea and 2 g / L polyethylene glycol. The electroplating tank containing 500 ml of electroplating solution is placed in an ultrasonic bath, the ultrasonic power is 120W, the operating frequency is 40kHz, and the water level in the ultrasonic bath is slightly higher than the liquid level of the electroplating solution in the electroplating tank. The anode is copper sheet, the substrate is aluminum alloy, the temperature is controlled at 30-35 degrees Celsius, and the current density is 8A / dm 2 . The electroplating time was 2, 5, 10, 30, and 60 minutes respectively, and copper coatings with a thickness of 3, 8, 14, 32, and 57 microns were obtained. The coatings showed a good metallic luster without burrs, bulges and other defects. The method for bath temperature control is the same as described in Example 1. Figure 3 shows the measurement results of internal stress of co...

example 3

[0028] Prepare an electroplating solution containing 100 g / L copper sulfate and 100 g / L sulfuric acid without adding any additives. The electroplating tank containing 500 ml of electroplating solution is placed in an ultrasonic bath, the ultrasonic power is 120W, the operating frequency is 40kHz, and the water level in the ultrasonic bath is slightly higher than the liquid level of the electroplating solution in the electroplating tank. The anode is copper sheet, the substrate is Ni-P amorphous coating, the temperature is controlled at 30-35 degrees Celsius, and the current density is 8A / dm 2. The electroplating time was 2, 5, 10, 30, and 60 minutes respectively, and copper plating layers with a thickness of 3, 11, 18, 26, and 59 microns were obtained. The method for bath temperature control is the same as described in Example 1. Figure 4 shows the measurement results of internal stress of copper films with different thicknesses. Compared with the electroplated copper film ...

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Abstract

The present invention relates to material technology, and is especially supersonic method of lowering internal stress of electroplated copper film. Through compounding electroplating solution, setting the electroplating bath inside with electroplating solution one supersonic bath, and electroplating for time depending on the thickness of the electroplated copper film in the electroplating solution temperature controlled in 30-35 deg.c and the current density of 4-16 A / sq dm, electroplated copper film is prepared. It is shown by means of X-ray diffraction measurement that the supersonic effect can reduce the internal stress of electroplated copper film effectively.

Description

technical field [0001] The invention relates to a method in the technical field of materials, in particular to a method for ultrasonically reducing the internal stress of an electroplated copper film. Background technique [0002] Electroplated copper layer has a wide range of uses. As an inner layer, copper plating layer can provide a guarantee for obtaining a series of outer plating layers that meet quality requirements and reduce production costs; copper plating layer has excellent electrical conductivity and is used in the electronics industry. But in the electroplating process, it will involve the issue of coating stress. Most metal coatings have internal stress. The internal stress of the coating often causes the substrate to deform, the coating itself produces cracks, and sometimes the coating is peeled off, which not only loses the function of the coating, but also has a negative impact on the substrate. At present, the methods to reduce or eliminate the internal st...

Claims

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Application Information

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IPC IPC(8): C25D5/20C25D3/38
Inventor 洪波姜传海王新建董显平王家敏
Owner SHANGHAI JIAO TONG UNIV
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