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Flame-retardant epoxy resin composition

一种环氧树脂、组合物的技术，应用在运输和包装、印刷电路、薄料处理等方向，能够解决无法表现出阻燃性等问题，达到优异耐热性的效果

Inactive Publication Date: 2007-06-27
ASAHI KASEI E-MATERIALS CORPORATION
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, although these resin compositions satisfy the standards required for heat resistance, they cannot exhibit sufficient flame retardancy when the thickness of the laminate is increased

Method used

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  • Flame-retardant epoxy resin composition
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  • Flame-retardant epoxy resin composition

Examples

Experimental program
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Effect test

preparation example Construction

[0046] The preparation of component (A) can also be carried out in the presence of a suitable solvent capable of dissolving component (A). If a solvent is used, preferred examples include inert solvents such as N,N-dimethylformamide, N,N-diethylformamide, N-methyl-2-pyrrolidone, dimethylsulfoxide, methylethyl Ketones, xylene, toluene, methyl cellosolve, tetrahydrofuran, etc. These solvents may be used alone or in combination of two or more.

[0047] In the preparation of component (A), a predetermined amount of epoxy resin raw material is charged into a reaction vessel, and then the reaction vessel is heated and adjusted at a prescribed temperature. Next, the catalyst is added mixed with water or a suitable solvent. The addition of the catalyst is carried out at a temperature ranging from 20°C to 200°C, preferably at 80°C to 200°C, more preferably at 110°C to 180°C. It is preferable to add the catalyst at a temperature greater than or equal to 20°C, because the reaction bet...

preparation example 1

[0095] 0.04 parts of tetrabutylammonium bromide were added to 100 parts of bisphenol A epoxy resin (epoxy equivalent: 189 g / equivalent). The resulting solution was heated with stirring to an internal temperature of 175°C. To this solution was added 16.1 parts of Coronate T-80 over a period of 120 minutes TM (TDI, manufactured by Nippon Polyurethane Industry Co., Ltd.; approximately 80% of 2,4-toluene diisocyanate, approximately 20% of 2,6-toluene diisocyanate). Immediately after the addition was complete, the resulting solution was stirred for 4 hours while maintaining the reaction temperature at 175° C., thereby obtaining epoxy resin I containing an oxazolidinone ring.

preparation example 2

[0097] 0.04 parts of tetrabutylammonium bromide were added to 100 parts of bisphenol A epoxy resin (epoxy equivalent: 189 g / equivalent). The resulting solution was heated with stirring to an internal temperature of 175°C. To this solution was added 30.9 parts of MR-200 over a period of 120 minutes TM (diphenylmethane diisocyanate manufactured by Nippon Polyurethane Industry Co., Ltd.). Immediately after the addition was complete, the resulting solution was stirred for 4 hours while maintaining the reaction temperature at 175° C., thereby obtaining epoxy resin II containing an oxazolidinone ring.

[0098] The properties of epoxy resins I and II containing oxazolidinone rings are shown in Table 1. In Table 1, "n=0 component" means an unreacted monomer component in the bisphenol A type epoxy resin raw material.

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Abstract

Disclosed is a flame-retardant epoxy resin composition characterized by containing (A) an epoxy resin containing 0.5-10 equivalent / kg of oxazolidone rings, (B) an epoxy group-containing phosphazene compound, (C) at least one compound selected from the group consisting of phosphates, condensed phosphates, quinone derivatives of phosphine compounds, and polyphenylene ethers, and (D) at least one curing agent selected from the group consisting of guanidine derivatives, phenol novolacs, bisphenol A novolacs, cresol novolacs and naphthol novolacs.

Description

technical field [0001] The present invention relates to a non-halogen flame-retardant epoxy resin composition having excellent heat resistance, prepreg storage stability, and multi-layer board flame retardancy, a prepreg and a non-halogen flame-retardant epoxy resin composition using the same A copper-clad laminate formed by laminating the prepreg. Background technique [0002] In the field of materials for electronic devices, thermosetting resins generally having epoxy resins as a main component are widely used to improve electrical reliability such as heat resistance, insulation, adhesiveness, and the like. Among these resins, in terms of heat resistance, electrical properties, and mechanical properties, brominated epoxy resins are based on brominated epoxy resins and have a glass transition temperature (Tg) designed to be 130°C to 140°C in line with FR4 (NEMA Standard) resins are widely used. [0003] However, in recent years, demands for making electrical products smal...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L63/00C08G59/14C08J5/24C08K5/52C08K5/5399
CPCC08G59/28Y10T428/31529Y10T428/2915C08K5/49C08L71/12C08K5/5399H05K1/0326C08L63/00C08G59/3236Y10T428/31511C08G59/304C08L2666/14C08K5/52
Inventor 浦川政明新井雄史
Owner ASAHI KASEI E-MATERIALS CORPORATION
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