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Method for plating resin material

a resin material and surface technology, applied in the field of methods, can solve the problems of high cost of palladium, significant price fluctuations, and large environmental burden, and achieve the effects of improving adhesion strength, reducing cost, and increasing density

Inactive Publication Date: 2006-03-02
TOYOTA JIDOSHA KK
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

The present invention is about improving the adhesion strength of a plated layer on a resin material and reducing the cost of plating. The technical effects of the invention include the use of ozone water treatment in combination with a specific metal catalyst, which increases the adhesion strength of the plated layer on the resin material. The method also involves a step of permitting the resin material to adsorb the metal catalyst before carrying out chemical plating or electroplating. The use of ozone water with a high ozone content is preferred for activation of the surface of the resin material. The method can be carried out without the need for a chromic acid treatment, which is environmentally unsustainable. Overall, the invention provides a more efficient and cost-effective way to plate resin materials.

Problems solved by technology

A conventional plating technique that involves a combination of chromic acid treatment and palladium plating is problematic in the following respects: the adhesion strength of a plated layer is as low as approximately 1 kgf / cm; the burden on the environment is considerable due to the use of chromic acid; and palladium, which is expensive and experiences significant price fluctuations, is used.

Method used

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  • Method for plating resin material
  • Method for plating resin material
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Examples

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Effect test

example 1

[0038] An ABS resin substrate was treated with ozone water of 50 to 100 ppm for 2 to 10 minutes (step 01). The substrate was then subjected to alkaline degreasing in a 50 g / l aqueous solution of NaOH at 60° C. for 13 minutes (step 02). If the resin substrate is sufficiently clean, this step of alkaline degreasing can be omitted. Subsequently, the substrate was subjected to a catalytic bath of Ag in a 0.5 g / l aqueous solution of an Ag catalyst at 30° C. for 30 minutes (step 03). The substrate was then subjected to chemical plating with copper in a plating solution containing 3 g / l of copper sulfate, 2 g / l of formalin, and 2 g / l of NaOH at 30° C. for 10 minutes (step 04). Further, the substrate was subjected to electroplating of 2.0 A / dm2 in a plating solution containing 200 g / l of copper sulfate, 50 g / l of sulfuric acid, 0.125 g / l of hydrochloric acid, and additives at 30° C. for 30 minutes (step 05). A copper-plated layer with a thickness of 100 μm was deposited on the ABS resin sub...

example 2

[0041] Copper plating was carried out in the same manner as in Example 1, except that an epoxy resin substrate was used instead of an ABS resin substrate.

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Abstract

This invention provides a method for plating a resin material that improves adhesion strength between a resin material and a plated metal layer and reduces the cost incurred by plating. This method comprises a step of treating a resin material with ozone water and a step of permitting the resin material to adsorb at least one metal catalyst selected from the group consisting of silver, cobalt, nickel, ruthenium, cerium, iron, manganese, and rhodium catalysts.

Description

TECHNICAL FIELD [0001] The present invention relates to a method for plating the surface of a resin material that improves plate adhesion. BACKGROUND ART [0002] Electroless plating has been known as a method for imparting electric conductivity or metallic luster to resin materials. This electroless plating refers to a method of forming a metal coating on the surface of a material via chemical reduction and deposition of a metal ion in a solution. Unlike electroplating that allows electrolytic deposition with the aid of electric power, a metal coating can be formed on an insulator such as a resin. Also, electroplating can be applied to a resin material having a metal coating formed thereon, and applications of such material can be expanded. Accordingly, electroless plating has been extensively adopted as a method for imparting metallic luster or electric conductivity to a resin material that is used in the fields of automobile decorative parts, household electrical goods, and the lik...

Claims

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Application Information

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Patent Type & Authority Applications(United States)
IPC IPC(8): C25D5/34C25D3/46C25D3/12
CPCC23C18/1653C23C18/2006C23C18/2086H05K2203/0796H05K3/181H05K3/381C25D5/56
Inventor YOSHINAGA, FUMITAKABESSHO, TAKESHI
Owner TOYOTA JIDOSHA KK
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