Method for plating resin material

Abstract

This invention provides a method for plating a resin material that improves adhesion strength between a resin material and a plated metal layer and reduces the cost incurred by plating. This method comprises a step of treating a resin material with ozone water and a step of permitting the resin material to adsorb at least one metal catalyst selected from the group consisting of silver, cobalt, nickel, ruthenium, cerium, iron, manganese, and rhodium catalysts.

Description

TECHNICAL FIELD [0001] The present invention relates to a method for plating the surface of a resin material that improves plate adhesion. BACKGROUND ART [0002] Electroless plating has been known as a method for imparting electric conductivity or metallic luster to resin materials. This electroless plating refers to a method of forming a metal coating on the surface of a material via chemical reduction and deposition of a metal ion in a solution. Unlike electroplating that allows electrolytic deposition with the aid of electric power, a metal coating can be formed on an insulator such as a resin. Also, electroplating can be applied to a resin material having a metal coating formed thereon, and applications of such material can be expanded. Accordingly, electroless plating has been extensively adopted as a method for imparting metallic luster or electric conductivity to a resin material that is used in the fields of automobile decorative parts, household electrical goods, and the lik...

AI Technical Summary

Benefits of technology

[0010] The present invention is directed to improving adhesion strength between a resin material and a plated metal layer when plating a resin material. Also, the present invention is directed to considerably reducing the cost required for plating.

[0013] The step of treating resin materials with ozone water is carried out by immersing various types of resin materials in ozone water or spraying ozone water on the surface of such resin materials. In general, ozone water comprises water as a solvent; however, it preferably comprises an organic or inorganic polar solvent. This can further shorten the time necessary for treatment. The step of permitting the resin material to adsorb a metal catalyst is carried out by immersing a resin material in a catalyst bath containing a salt of a metal catalyst selected from the group consisting of silver, cobalt, nickel, ruthenium, cerium, iron, manganese, and rhodium catalysts.

[0015] Preferably, the method for plating a resin material according to the present invention further comprises a step of alkaline degreasing of the surface of the resin material between the step of treating the resin material with ozone water and the step of permitting the resin material to adsorb a metal catalyst. By carrying out the step of alkaline degreasing, stains on the surface of the resin material can be removed, wettability can be improved, and metal catalyst adhesion can be enhanced.

[0016] An alkaline compound that is used in the step of alkaline degreasing of the present invention is capable of dissolving the surface of the resin material at a molecular level and removing an embrittled layer on the surface of the resin material so as to allow more functional groups to appear. Thus, plate adhesion can be enhanced. An alkaline compound that can dissolve the surface of the resin material at a molecular level and remove the embrittled layer can be employed. Examples thereof include sodium hydroxide, potassium hydroxide, and lithium hydroxide. A treatment solution that is employed in the step of alkaline degreasing preferably comprises at least either an anionic or nonionic surfactant.

[0022] The method for plating a resin material according to the present invention can be applied to a wide variety of fields. Specifically, the second aspect of the present invention concerns automobile parts, electrical parts, and printed circuit boards plated by the aforementioned method according to the present invention. More particularly, the method for plating a resin material according to the present invention is effective for producing printed circuit boards. Adoption of the method of the present invention for plating the through holes or via holes of the printed circuit boards eliminates the need for the step of surface roughening. Thus, printed circuit boards of higher density can be obtained. Since this method does not involve the use of palladium, which is expensive and experiences significant price fluctuations, the cost can be reduced. Further, the foundation layer of a silver printed circuit board is prepared via chemical plating with the adoption of ozone water treatment in combination with the use of a silver catalyst according to the present invention. Thus, a strong silver printed circuit board comprising a foundation layer integrated with a wiring layer with the aid of a silver component can be obtained.

[0023] Adoption of ozone water treatment in combination with the use of a specific metal catalyst for plating a resin material improves the adhesion strength between a resin material and a plated metal layer and significantly reduces the cost incurred by plating.

Problems solved by technology

A conventional plating technique that involves a combination of chromic acid treatment and palladium plating is problematic in the following respects: the adhesion strength of a plated layer is as low as approximately 1 kgf / cm; the burden on the environment is considerable due to the use of chromic acid; and palladium, which is expensive and experiences significant price fluctuations, is used.

Images