Plasma processing apparatus and method for controlling the same
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[0045] The overall structure of a plasma processing apparatus according to the present invention will now be described with reference to the schematic cross-sectional view of FIG. 1.
[0046] The plasma processing apparatus has a vacuum vessel 1 formed of conductive material such as aluminum, and in the vacuum vessel are attached an antenna 2 and a shower plate 3 via shower plate support flanges 5 and 6, respectively. The vacuum vessel 1 is grounded. Gas is supplied from the atmospheric side of the vessel through a process gas introduction pipe 7 to the space between the antenna 2 and the shower plate 3, and the gas is ejected into the vacuum vessel 1 through the many fine pores formed to the shower plate 3. Of course, the antenna 2 is formed of a conductive material, but the shower plate 3 can be formed of a conductive material, a dielectric material or a semiconductor material. When the shower plate 3 is formed of either conductive or semiconductor material, the shower plate 3 funct...
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