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Method of manufacturing gold thin film by using electroless-plating method

a technology of electroless plating and gold, applied in the direction of liquid surface applicators, coatings, metal material coating processes, etc., can solve the problems of a few intrinsic weaknesses of vapor deposition methods, not only a long time taken for such electric contact, and laborious and expensive equipment, etc., to achieve the effect of improving the activity of raman scattering

Inactive Publication Date: 2015-02-26
FOUND OF SOONGSIL UNIV IND COOP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

The invention provides a way to make a thin film of gold that has the added benefit of enhancing the detection of rare materials through a process called surface enhancement Raman scattering. This method uses a technique called electroless-plating, which is not only costly but also requires additional steps to perform. The invention provides a simpler and more efficient way to produce these thin films of gold.

Problems solved by technology

In the electro-deposition method, elaborate and expensive equipment is required to guarantee deposition at an accurate ratio and a suitable electric potential.
In addition, not only a long time is taken for such an electric contact if an integrated circuit (IC) having a very complex circuit pattern, specially a certain high density, is used.
Also, even the vapor deposition method has a few intrinsic weaknesses.
In various application fields, elaborate and high vacuum equipment is required, and a large amount of Au metal is consumed during an evaporation process.
In addition, it is difficult to attach evaporated Au only to a selected area in a plated surface.
In other words, it is not easy to design a pattern having Au by using the vapor deposition method.

Method used

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  • Method of manufacturing gold thin film by using electroless-plating method

Examples

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example 1

Manufacturing Au Thin Film

[0032]A cover glass having a diameter of 18 mm (manufactured by Marienfeld) was soaked in an alkaline cleaning solution (pH=9.2; and 0.5% Hellmanex II, Hellma) for 3 hours and then was sonicated in distilled water for 10 minutes. Next, the cover glass was washed with ethanol and then was finally dried in an oven at a temperature of 60° C. for 30 minutes. The washed cover glass was dipped in a reaction mixture and then the reaction mixture was vigorously stirred at a temperature of 50° C. Here, the reaction time was varied from 20 minutes to 80 minutes. The reaction mixture was obtained by mixing an aqueous solution containing 0.5 mL of 0.1 M HAuCl4 and 1 mL of 1 M K2CO3 with 8.5 mL of methanol solution, and at this time, the pH of the reaction mixture was adjusted to 11 to 12. An Au-coated glass obtained as such was washed with ethanol and then dried in air.

[0033]For self-assembly of BT on the Au-coated glass, the Au-coated glass was immersed in a 10 mM met...

example 2

Analyzing Properties of Au Thin Film

[0034]1. Methods of Analyzing Properties

[0035]UV-vis spectra were obtained by using a spectrum analyzer (Avantes 3648), and field emission scanning electron microscopic (FE-SEM) images were obtained by using a field emission scanning electron microscope (JSM-6700F) that operated at 5.0 kV.

[0036]XRD was analyzed by using an X-ray diffractometer (Rigaku Model MiniFlex powder diffractometer) using Cu Kα radiation. Also, XPS measurements were performed by using an AXISH model using Mg Kα X-ray as a light source.

[0037]SERS was analyzed by using a spectroscope (Renishaw Raman System Model 2000) equipped with an integral microscope (Olympus BH2-UMA). The 632.8 nm line from a 17 mW He / Ne laser (Spectra Physics Model 127) was used as an excitation source. A Raman band of a silicon wafer at 520 cm−1 was used to calibrate the spectroscope. Accuracy of a measured spectrum value was at least 1 cm−1.

[0038]Atomic force microscopic (AFM) images were obtained by u...

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Abstract

Provided is a method of manufacturing a gold (Au) thin film on a dielectric surface by using an electroless-plating method, the method including: manufacturing a reaction mixture by adding an Au chloride compound and an alkaline compound to an alcohol-water mixed solution; and forming an Au thin film by putting a substrate in the reaction mixture and stirring the reaction mixture. Accordingly, compounds that are relatively low toxic may be used as raw materials, and an Au thin film having a surface enhancement Raman scattering (SERS) effect may be conveniently and stably formed on a dielectric surface without having to use expensive additional equipment, such as a vacuum device.

Description

CROSS-REFERENCE TO RELATED PATENT APPLICATION[0001]This application claims the benefit of Korean Patent Application No. 10-2013-0100496, filed on Aug. 23, 2014, in the Korean Intellectual Property Office, the disclosure of which is incorporated herein in its entirety by reference.BACKGROUND OF THE INVENTION[0002]1. Field of the Invention[0003]The present invention relates to a method of manufacturing a gold (Au) thin film on a dielectric surface, and more particularly, to a method of manufacturing an Au thin film on a glass surface, which has increased activity of surface enhanced Raman scattering (SERS) by using an electroless-plating method.[0004]2. Description of the Related Art[0005]Generally, a gold (Au) thin film is manufactured by using one of three methods, i.e., an electroplating or electro-deposition method, a vapor deposition method, and an electroless-plating method.[0006]In the electro-deposition method, elaborate and expensive equipment is required to guarantee deposit...

Claims

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Application Information

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Patent Type & Authority Applications(United States)
IPC IPC(8): C23C18/44C23C18/16
CPCC23C18/44C23C18/1641C23C18/1664C23C18/166C23C18/1639C23C18/1676C23C18/1893C23C18/2086C23C18/31
Inventor SHIN, KUAN SOOCHO, YOUNG KWANPARK, MYUNG CHAN
Owner FOUND OF SOONGSIL UNIV IND COOP