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Composite electroforming preparing process for nano aluminium oxide particle reinforced copper base composite material

A copper-based composite material, nano-alumina technology, applied in electroforming, electrolytic coating, electrolytic process, etc., to achieve the effect of low cost, uniform distribution, good physical and mechanical properties

Inactive Publication Date: 2007-10-24
SHANGHAI JIAOTONG UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0003] The purpose of the present invention is to address the deficiencies in the prior art, and propose a new preparation method of nano-alumina particle-reinforced copper-based composite material—composite electroforming preparation method, under the condition that the cost is relatively low and the operating temperature is not high , to prepare copper-based composite materials with uniform distribution of nanoparticles, larger overall thickness than ordinary electroplating coatings, high strength and high ductility, which can be used alone as functional structural materials

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0009] Process steps: the anode material used is domestic phosphor copper plate, and stainless steel sheet is selected as the cathode deposition body. Prepare copper sulfate electroforming plating solution in the electroplating tank, its composition is: copper sulfate (CuSO 4 ·5H 2 O): 220g / L; sulfuric acid (H 2 SO 4 ): 70g / L. The particle size of alumina particles is 20nm, and the addition amount in the electroforming bath is 35g / L. Formamide is selected as the co-deposition accelerator, and the addition amount in the electroforming plating solution is 1.5mL / L. Selected process parameters: cathode current density is 8A / dm 2 ; The bath temperature is 25°C; the stirring frequency is 60 rpm, and the electroforming time is 30 hours.

[0010] Before the alumina particles are added to the electroforming plating solution, distilled water is used to mix and dissolve the co-deposition accelerator, and then the alumina particles are put into it for ultrasonic stirring and manual ...

Embodiment 2

[0014] Process steps: the anode material is a domestic phosphor copper plate, and the stainless steel sheet is used as a cathode deposition body. The composition of copper sulfate electroforming plating solution is: copper sulfate (CuSO 4 ·5H 2 O): 200g / L; sulfuric acid (H 2 SO 4 ): 65g / L. The particle diameter of alumina particles is 20nm, and the addition amount in the electroforming bath is 35g / L. The co-deposition accelerator component is a fluorocarbon cationic surfactant, and the addition amount in the electroforming plating solution is 0.1g / L. Selected process parameters: cathode current density is 10A / dm 2 ; The bath temperature is 30°C; the stirring frequency is 65 rpm, and the electroforming time is 30 hours.

[0015] Before the alumina particles are added to the electroforming plating solution, distilled water is used to mix and dissolve the co-deposition accelerator, and then the alumina particles are put into it for ultrasonic stirring and manual stirring to...

Embodiment 3

[0018] Process steps: The anode material used is a domestic phosphor copper plate, and the stainless steel sheet is used as a cathode deposition body. Prepare copper sulfate electroforming plating solution in the electroplating tank, its composition is: copper sulfate (CuSO 4 ·5H 2 O): 220g / L; sulfuric acid (H 2 SO 4 ): 70g / L. The particle size of alumina particles is 50nm, and the addition amount in the electroforming plating solution is 35g / L. The co-deposition accelerator is selected from fluorocarbon cationic surfactant, and the addition amount in the electroforming plating solution is 0.05g / L. Selected process parameters: cathode current density is 12A / dm 2 ; The bath temperature is 35°C; the stirring frequency is 60 rpm, and the electroforming time is 30 hours.

[0019] Before the alumina particles are added to the electroforming plating solution, distilled water is used to mix and dissolve the co-deposition accelerator, and then the alumina particles are put into ...

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Abstract

The composite electroforming process of preparing nanometer alumina particle reinforced copper base composite material has phosphor copper plate as anode material, stainless steel sheet as cathode deposition body, nanometer level alumina particle as reinforcing particle, and fluorocarbide surfactant or formamide as co-deposition promoter. Through mixing alumina particle and co-deposition promoter solution through stirring, pouring the mixed solution into electroforming solution of copper sulfate, applying DC voltage while stirring the electroforming solution to make copper ion and reinforcing particle deposit together onto the cathode mother body and stripping the composite electroformed layer, integrated nanometer alumina particle reinforced copper base composite material is produced. The produced composite material has high strength, high ductibility and relatively great thickness, and may be used as functional structure material.

Description

technical field [0001] The invention relates to a method for preparing a copper-based composite material, in particular to a method for preparing copper-based composite materials reinforced by aluminum oxide particles with a nano-scale particle size by using a composite electroforming method, which belongs to the technical field of composite electroplating. Background technique [0002] Alumina particle reinforced metal matrix composites are a class of functional structural composites with excellent properties. The addition of second phase particles not only does not significantly reduce the conductivity of the copper matrix, but also improves the conductivity of the matrix copper due to the strengthening effect of the particles. Room temperature and high temperature performance, it is widely used in spot welding electrodes, motor brushes, electrical contacts and other fields. At present, there are many preparation methods, such as internal oxidation method, composite castin...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C25D15/00C25D1/00
Inventor 胡文彬朱建华刘磊赵海军沈彬
Owner SHANGHAI JIAOTONG UNIV
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