Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Compsn. and organic conductive membrane using same, and its mfg. method

A conductive film and manufacturing method technology, which is applied in chemical instruments and methods, semiconductor/solid-state device manufacturing, circuits, etc., can solve the problem of high-priced high-frequency generators or vacuum devices, the difficulty of obtaining thin films with uniform film thickness or film quality, Problems such as high cost of finished products, achieve the effect of improving flatness or surface appearance, improving ejection stability, and reducing manufacturing costs

Inactive Publication Date: 2008-11-19
SEIKO EPSON CORP
View PDF12 Cites 2 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] (1) Since the raw material is in the form of a gas, it is difficult to obtain a thin film with uniform film thickness or film quality on the substrate when there are, for example, unevenness on the surface of the substrate on which the thin film is deposited.
[0006] (2) Since the formation speed of the film is slow, the productivity is low
[0007] (3) In the case of the plasma CVD method, a complex and expensive high-frequency generator or vacuum device is required, and the introduction of manufacturing equipment and maintenance management require a lot of cost
[0008] (4) Since the process of photolithography is complicated and the use efficiency of raw materials is low, the manufacturing cost becomes high. In addition, since the resist or etching solution used in this process is formed into a large amount of waste, the processing cost also very high
[0010] (5) As a raw material, gaseous silicon hydride with high toxicity or reactivity is used, so there are difficulties in handling
[0011] (6) In addition, because the raw material is gaseous, it is necessary to seal the vacuum device or piping system, etc.
Generally, the equipment consisting of these vacuum devices or piping systems becomes large, and these equipment also require maintenance costs because they work in a clean room.
[0012] (7) The vacuum device or piping system itself is expensive, and at the same time, in order to form the required film while maintaining its vacuum environment or plasma environment, it consumes too much energy, so the cost of the finished product is high.
[0046] Therefore, it is difficult for conventional compositions to have a stable viscosity, which affects the formation of film patterns by the inkjet method and the resulting device characteristics.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Compsn. and organic conductive membrane using same, and its mfg. method
  • Compsn. and organic conductive membrane using same, and its mfg. method
  • Compsn. and organic conductive membrane using same, and its mfg. method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0096] The composition of the present invention will be described in detail below.

[0097] The composition of the present invention is characterized in that it is composed of an organic conductive material and at least one or more solvents, and the rate of change in viscosity is ±5% or less after 30 days of preparation.

[0098] The combination of the organic conductive material and the solvent constituting the composition may be any combination as long as the resulting composition has conductivity, regardless of the molecular weight of the organic conductive material.

[0099] Examples of polymer materials used in the above-mentioned organic conductive or organic semiconductor materials include a mixed system of polydioxythiophene and polystyrenesulfonic acid, a mixed system of polyaniline and polysulfonic acid, and polysulfonic acid. Phenylvinylidene precursors, polypyrrole, and their derivatives, etc. In addition, examples of low-molecular-weight materials include copper ...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
viscosityaaaaaaaaaa
rate of viscosity changeaaaaaaaaaa
diameteraaaaaaaaaa
Login to View More

Abstract

Provided is a composition in which the viscosity is hardly changed with the passage of time and an organic conductive layer including the composition in order to planarize the surface of a layer formed by an inkjet process and in order to stabilize the properties. A composition according to the present invention contains an organic conductive material and at least one species of solvent, wherein the changing rate of the viscosity thereof is within a range of +-5% when 30 days have passed after the preparation. The solvent preferably contains a glycol medium. An organic conductive layer according to the present invention includes the composition having the above configuration.

Description

technical field [0001] The present invention relates to a composition, an organic conductive film using the composition, a method for producing the same, an organic EL element having the organic conductive film, a method for producing the same, a semiconductor element having the organic conductive film, a method for producing the same, and an electronic device And electronic equipment, specifically, the above-mentioned conductive thin film is used as a conductive part constituting an electrode or a wiring in an electronic circuit or an integrated circuit. The composition of the present invention can be used as a raw material for various coating methods. Among them, when forming an organic conductive film from the composition, the inkjet method is preferably used. Background technique [0002] Conventionally, in the manufacture of wiring structures used in electronic circuits, integrated circuits, etc., photolithography is used, for example. This photolithography method is a...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): C09K11/06H05B33/14H05B33/10H01L51/50H01L51/00H05B33/22H10N10/856
CPCH01L51/0007H01L51/0078H01L51/0022H01L51/0038H01L51/0037H01L51/0034H01L51/5048H01L51/0081H01L51/5088H01L51/0035H01L51/0005H10K71/15H10K71/135H10K71/611H10K85/10H10K85/114H10K85/111H10K85/1135H10K85/311H10K85/324H10K50/14H10K50/17H05B33/14
Inventor 关俊一田边诚一桑城伸语木村秀之
Owner SEIKO EPSON CORP
Features
  • Generate Ideas
  • Intellectual Property
  • Life Sciences
  • Materials
  • Tech Scout
Why Patsnap Eureka
  • Unparalleled Data Quality
  • Higher Quality Content
  • 60% Fewer Hallucinations
Social media
Patsnap Eureka Blog
Learn More