Aluminum nitride/borosilicate glass low-temperature co-fired ceramic substrate material and preparation method thereof

A technology of low-temperature co-fired ceramics and borosilicate glass, applied in the direction of circuit substrate materials, printed circuit components, etc., can solve the problem of high cost, achieve low price, reduce cost, and reduce loss
CN100469730CActive Publication Date: 2009-03-18TSINGHUA UNIV
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
TSINGHUA UNIV
Publication Date
2009-03-18

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Abstract

This invention relates to electronic baseplate by low-temperature co-sintering of aluminium nitride / borosilicate glass. This baseplate is composed of: AlN 30-70%; oxides 30-70%. Said oxides are then composed (by mol percentages) of: SiO2 8-12%, B203 18-24%, ZnO 45-60%, Al203 3-8%, Li20 3-8%. This inventive product has excellent comprehensive properties, its heat conductivity is increased from that of prior art product 2-5 W / m.K to 10W / m.K. It can be used in more greater power devices with excellent dielectric property. This invention has also advantages of: easily available raw materials, low cost, simple process.
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Description

technical field

[0001] The invention belongs to the technical field of electronic substrate composite materials, and in particular provides an aluminum nitride / borosilicate glass low-temperature co-fired ceramic (LTCC) substrate material and a preparation method thereof. Background technique

[0002] Entering the 21st century, the development momentum of the microelectronics industry is becoming more and more rapid, and the products are rapidly moving towards the direction of light, thin, short, small, low power consumption and multi-function. For example, terminal systems such as mobile phones, PDAs, MP3s, and notebook computers have more and more functions, the volume is getting smaller and smaller, and the circuit assembly density is getting higher and higher; great progress has also been made in RF integrated circuits, monolithic microwave integrated circuits Some passive components have been successfully integrated into IC; other complete machines and circuit systems su...

Claims

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