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Device for producing small solder alloys welding balls

A technology for manufacturing devices and brazing filler metals, which is applied to welding media, manufacturing tools, and welding equipment. It can solve problems such as high manufacturing costs, low solder ball precision, and large equipment, and achieve bright surfaces, low oxygen content, and simplified structures. Effect

Inactive Publication Date: 2009-05-06
HARBIN INST OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] In order to solve the problems of large equipment, complex structure, high production cost, complex procedures, low efficiency and low precision of the solder balls produced in the existing solder ball manufacturing process, the present invention provides a micro solder Equipment for making alloy solder balls

Method used

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  • Device for producing small solder alloys welding balls
  • Device for producing small solder alloys welding balls

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specific Embodiment approach 1

[0014] Specific Embodiment 1: The present embodiment will be described in detail below in conjunction with FIG. 1 . This embodiment is composed of a gas supply device 1, a pressure controller 2, a droplet generator 3, a gas protection device 4, an elevating work platform 5 and a cooling and solidification device 6 , the gas output end of the gas supply device 1 is respectively connected to the input end of the pressure controller 2 and the top of the gas protection device 4, the output end of the pressure controller 2 is connected to the inlet end of the droplet generator 3, and the droplet generator 3 is fixed on the top of the gas protection device 4 by screws, the central part of the droplet generator 3 communicates with the inside of the gas protection device 4, and the lifting working platform 5 is set at the lower part of the gas protection device 4 and can move up and down, and is cooled and solidified The device 6 is installed on the lifting working platform 5 in the ga...

specific Embodiment approach 2

[0015] Specific embodiment two: below in conjunction with Fig. 2 specific description present embodiment, present embodiment drop generator 3 is made of stainless steel crucible 7, sleeve 8, heating wire 9, top cover 10, nozzle 11, gland 12 and thermocouple 13 Composition, the sleeve 8 is set on the outside of the stainless steel crucible 7, a heating wire 9 is arranged between the sleeve 8 and the stainless steel crucible 7, the sleeve 8 is fixed on the gas protection device 4 by fastening screws, and the top cover 10 is tightened by The solid screw is fixed on the top of the stainless steel crucible 7 and the sleeve 8. There is a gas inlet on the upper side of the top cover 10. The space between the top cover 10 and the stainless steel crucible 7 is sealed by a gasket 14. The bottom of the stainless steel crucible 7 is provided with a nozzle 11. The gland 12 passes through the nozzle 11 and is placed on the bottom of the stainless steel crucible 7. A thermocouple 13 is built ...

specific Embodiment approach 3

[0016] Specific implementation mode three: this implementation mode is completed by the following steps:

[0017] Step 1: Add solid solder into the stainless steel crucible 7 of the droplet generator 3, and fasten the top cover 10;

[0018] Step 2: Select the type of nozzle 11 and tighten the gland 12. The air in the gas protection device 4 is evacuated and filled with argon or nitrogen; using a reduced-diameter nozzle, the molten solder solution flows through the reduced diameter to force the diameter to be reduced. According to Lap Lars' theorem, the smaller the radius of curvature, the greater the additional pressure generated by surface tension; the smaller the radius of curvature at the constriction, the greater the downward additional pressure; and the larger the radius of curvature, the smaller the additional pressure, In this way, the solder flows from the place with high pressure to the place with low pressure, which intensifies the fracture of the liquid solder colum...

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Abstract

A making device and method of subtilis solder alloy solderball, which relates to a making device and method of the alloy solderball for electronic packaging industry, in order to settle the problems that the making device of existing solderball is large with complicated structure and high making cost and the making process of the solderball is miscellaneous with low efficiency and low precision of the made solderball. The gas output ends of gas supply device of the invention respectively connect to the input end of the pressure controller and the top end of the gas protection installation, a lifting work platform is provided on the lower part of the gas protection installation and can move vertically, a cooling solidification device is mounted on the lifting work platform in the gas protection installation; the method of the invention is that: adding the solder with solid state to the liquid droplet maker; filling argon gas or nitrogen in the gas protection installation; melting the solder; dispersing the melt drip; forming the solderball; completing the steps of collecting, cleaning, drying, packaging. The device of the invention has advantages of simple structure and low cost, the method of the invention has characteristic of good process flexibility.

Description

technical field [0001] The invention relates to a device for manufacturing alloy solder balls for electronic packaging industry. Background technique [0002] The development of ball grid array (BGA) and flip chip (Flip Chip) has created a huge demand for solder balls. At present, the methods of producing solder balls mainly include water, gas atomization, centrifugal atomization, shredded remelting and uniform droplet forming. Due to the scattered size of solder balls produced by the first three methods and low roundness, solder balls that meet the needs need to be screened and inspected many times to obtain solder balls that meet the needs; Accuracy is limited in practical applications. The uniform droplet forming method is widely used in production due to the uniform size of the solder balls, good surface quality, and high sphericity. It is divided into mechanical vibration method, piezoelectric vibration method, and electric field atomization method. However, these met...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B22F9/08B23K35/40
Inventor 王春青田德文孔令超田艳红
Owner HARBIN INST OF TECH
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