Nano metal fluid with high heat-transfer performance

A nano-metal and fluid technology, applied in the field of cooling flowing working fluid, can solve the problems of easy deposition of nano-fluid coolant, poor cooling performance of metal fluid, high price, small volume expansion, large surface tension, not easy to leak and effect of accident

Active Publication Date: 2009-09-09
TECHNICAL INST OF PHYSICS & CHEMISTRY - CHINESE ACAD OF SCI
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] In order to solve the problems existing in the prior art, the present invention provides a nano-metal fluid with high heat transfer performance, which solves the problem that the current metal fluid used as the cooling medium is too expensive, and the metal fluid with low price has poor cooling performance. When ordinary fluid is used as fast reactor coolant, it is easy to cause leakage, and the existing nanofluid coolant is prone to deposition problems

Method used

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Embodiment 1

[0031] The nano-metal fluid provided by the present invention uses liquid metal as a solvent, and the liquid metals that can be selected at normal temperature or at low temperature include: mercury, melting point-38.72°C; gallium, melting point 29.8°C; gallium-indium series alloys (such as 62.5wt% Ga, 21.5wt% In, 16wt% Sn), melting point 10.7°C; and other low melting point metals at medium or low temperature, including lead, 327.5°C, bismuth, 271.4°C, tin, 232.0°C; chromium, 321.1°C; The liquid solvent in the nano metal fluid includes alloys formed by one or more of the above metals, and alloys formed by the above metals and other metals. Liquid metals at high and medium temperatures include alkali metal series or their alloys, as well as alloys formed with other metals.

[0032] The metal nanoparticles used in the nano-metal fluid of the present invention include ordinary metal particles such as copper, aluminum, iron, etc. with a diameter ranging from 1 to 900 nm, and also i...

Embodiment 2

[0035] In addition to the above-mentioned metal nanoparticles, the solute of the nano-metal fluid of the present invention can also use particles of transition element materials such as boron, silicon, germanium, arsenic, etc. with a diameter in the range of 1 to 900 nm. And liquid metal solvent is identical with embodiment 1.

Embodiment 3

[0037] In addition to the metal nanoparticles and transition element material particles described above, the solute of the nano-metal fluid of the present invention can also use a material with a diameter in the range of 1 to 900 nm and a diameter in the range of 1 to 900 nm with high thermal conductivity. Carbon nanotubes, graphite material particles as part of the fluid.

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Abstract

Nano metal fluid with high heat transfer performance, it relates to a cooling flow working medium for ultra-high power density radiators, especially a kind of fluid suitable for high heat flux conditions such as computer chips and reactors, which require high-intensity heat exchange And the cooling fluid working medium used in the cooling environment. The invention is a fluid with liquid metal as solvent and nano particles as solute. The invention solves the problems that the current metal fluid is used as the cooling working medium, the price is too high, the cooling performance of the conventional metal fluid is limited, the ordinary fluid is used as the coolant, which is easy to cause leakage, and the existing nano coolant is easy to deposit.

Description

technical field [0001] The invention relates to a cooling fluid working medium for ultra-high power density radiators, in particular to a cooling fluid working fluid suitable for high heat flux conditions such as computer chips and reactors, which require high-intensity heat exchange and cooling environments . Background technique [0002] As we all know, the current heat dissipation of computer chips mainly uses forced air convection to cool heat-generating devices, but the heat dissipation of this method is limited. Therefore, people are gradually trying to use water cooling or other organic liquids to realize heat dissipation; the proposal of low melting point liquid metal chip heat dissipation technology (Liu Jing, Zhou Yixin, a heat dissipation device for chip heat dissipation, authorization number: 02257291.0), and liquid cooling way forward a big step forward. In this method, the heat dissipation working fluid is a metal whose thermal conductivity is much higher tha...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C09K5/12H01L23/34H05K7/20G06F1/20
Inventor 马坤全刘静
Owner TECHNICAL INST OF PHYSICS & CHEMISTRY - CHINESE ACAD OF SCI
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