Connecting terminal
A technology for connecting terminals and plating layers, which is applied in the field of terminals constituting connectors. It can solve the problems of short circuit, increased contact resistance of terminals, and decreased wettability of solder alloys, etc., and achieves short circuit prevention, reduced contact resistance, and excellent wettability. Effect
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
Embodiment 1
[0051] to have image 3 Copper base material of the shape shown (full length ( image 3 L) about 4 mm) were sequentially performed as follows to obtain connection terminals.
[0052] Electrolytic degreasing
[0053] Immerse the entire surface of the base material in a 5% alkaline cleaner for 10 seconds and dry it.
[0054] acid active treatment
[0055] The entire surface of the base material after the electrolytic degreasing treatment was immersed in a 5% sulfuric acid aqueous solution for 10 seconds, and dried.
[0056] Nickel plating
[0057] The entire surface of the base material after the acid activation treatment was subjected to nickel plating under the conditions in Table 1 (nickel layer thickness: 2 μm).
[0058] Tin plating
[0059] For both ends of the base metal after nickel plating (in detail, image 3 The X area and Y area) were sequentially tin-plated under the conditions in Table 1 (tin-plating thickness: 2 μm).
[0060] Table 1
[0061] proc...
Embodiment 2 and Embodiment 3、 comparative example 1 and 2
[0069] Connection terminals were obtained in the same manner as in Example 1 except that the reflow treatment conditions were changed to those described in Table 3.
[0070] table 3
[0071]
[0072] Physical property evaluation
[0073] The X area in the analyzed connection terminal (refer to image 3 ) plating layer structure.
[0074] Occupied area ratio
[0075] The area ratio (Sn:Ni—Sn) of the surface obtained by peeling off the surface tin oxide layer was measured.
[0076] Pure tin content
[0077] The pure tin content of the layer directly under the surface tin oxide layer was measured.
[0078] Layer structure and thickness
[0079] The layer structure and the thickness of each layer were measured (analytical conversion) by scanning Auger electron spectroscopy (manufactured by JEOL Ltd.). That is, measurement by Auger electron spectroscopy and argon ion etching (etching depth: about 1 nm) were repeated, and the layer structure and thickness were checked base...
PUM
| Property | Measurement | Unit |
|---|---|---|
| thickness | aaaaa | aaaaa |
| thickness | aaaaa | aaaaa |
| thickness | aaaaa | aaaaa |
Abstract
Description
Claims
Application Information
Login to View More 