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Array type ultra-thin submissive force sensor and preparation method thereof

An array type sensor technology, applied in the field of force sensors, to achieve linear output, reduce the number of gating switches, high force sensitivity accuracy and resolution

Inactive Publication Date: 2010-01-27
TSINGHUA UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

It can be used for on-line monitoring of contact force and extrusion force between surfaces in industrial production and human medical rehabilitation. However, in order to meet practical applications, the thickness, accuracy, resolution, linearity, stability and response speed of this sensor Indicators need to be further improved

Method used

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  • Array type ultra-thin submissive force sensor and preparation method thereof
  • Array type ultra-thin submissive force sensor and preparation method thereof
  • Array type ultra-thin submissive force sensor and preparation method thereof

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preparation example Construction

[0063] The preparation method of the array-type ultra-thin compliant force sensor proposed by the present invention includes two parts: the preparation of an ultra-thin compliant conductive polymer sensitive film and the preparation of an array-type compliant force sensor using the sensitive film. The ultra-thin compliant conductive polymer is sensitive The preparation of membrane comprises the following steps:

[0064] 11) Conductive carbon black powder with an average diameter of less than 1 μm, SiO with a diameter of 10-50 nm 2 Dispersant powder and liquid one-component silicone rubber are mixed in acetone organic solvent with a concentration of more than 95%; wherein, the volume concentration percentage of each component is: one-component silicone rubber: conductive carbon black powder: nano-SiO 2 Dispersant powder: acetone organic solvent = 100:10~15:1~3:300~500;

[0065] 12) Perform mechanical stirring under ultrasonic vibration, the temperature of the stirring environm...

Embodiment 1

[0079] 11) Conductive carbon black powder with an average diameter of less than 1 μm, SiO with a diameter of 10 nm 2 Dispersant powder and liquid one-component silicone rubber are mixed in acetone organic solvent with a concentration of more than 95%; wherein, the volume concentration percentage of each component is: one-component silicone rubber: conductive carbon black powder: nano-SiO 2 Dispersant powder: acetone organic solvent=100:10:1:300;

[0080] 12) Perform mechanical stirring under ultrasonic vibration, the temperature of the stirring environment is 40°C, and the stirring time is 2 hours, until the mixture is in a gel state;

[0081] 13) Add 3% butadiene rubber particles (10 μm) of the total volume of the mixture into the mixture, and continue mechanical stirring for 20 minutes to volatilize the acetone;

[0082] 14) Drop the volatilized mixture into the rotating platform, and spin-coat to form a conductive polymer film with a thickness of 70 μm;

[0083] 15) Vulca...

Embodiment 2

[0085] 11) Conductive carbon black powder with an average diameter of less than 1 μm, SiO of 50 nm 2 Dispersant powder and liquid one-component silicone rubber are mixed in acetone organic solvent with a concentration of more than 95%; wherein, the volume concentration percentage of each component is: one-component silicone rubber: conductive carbon black powder: nano-SiO 2 Dispersant powder: acetone organic solvent=100:15:3:500;

[0086] 12) Perform mechanical stirring under ultrasonic vibration, the temperature of the stirring environment is 60°C, and the stirring time is 4 hours, until the mixture is in a gel state;

[0087] 13) Add 5% butadiene rubber particles (30 μm) of the total volume of the mixture into the mixture, and continue mechanical stirring for 30 minutes to volatilize the acetone;

[0088] 14) Drop the volatilized mixture into the rotating platform, and spin-coat to form a conductive polymer film with a thickness of 100 μm;

[0089] 15) Vulcanize the conduc...

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Abstract

The invention relates to an array-type compliant force sensor and a method of preparation thereof, and belongs to the technical field of a force sensor. The sensor comprises upper and lower poles which are enclosed into one piece, and a conduction macromolecule sensitive film compressed between the poles, and a front end circuit connected with the upper and lower poles through signal lines. The conduction macromolecule sensitive film primarily adopts the conduction macromolecule sensitive film having the compressive resistance effect consisting of graphitized carbon black as the conduction phase, single-component silastic as the insulation phase, and nanometer SiO2 dispersant. The upper and lower poles are a plurality of poles made on the substrate of the film by making use of flexible printed circuit board process and signal lines connected with each strip-shaped pole. The upper and lower strip-shaped poles are crossed and constitute an N*N sensitive cell array with the conduction macromolecule sensitive film. The signal lines are gathered to form led-out closely spaced cables. The invention has the characteristics of fine and thin structure, good flexibility, large range, high precision and high resolution.

Description

technical field [0001] The invention belongs to the technical field of force sensors, and in particular relates to the structural design of an array type ultra-thin and compliant force sensor. Background technique [0002] The concept of "compliant sensor" can be traced back to the late 1980s. Many special structures in aerospace vehicles have brought great difficulties to the installation of traditional rigid sensors. People hope that the sensor has good flexibility, is not limited by the shape of the object to be measured, and can be attached to various regular or irregular surfaces to achieve normal sensing functions. After entering the 1990s, scientists in the United States, France, Japan, Switzerland, Portugal and other countries began to conduct research on compliant sensors, and many new sensor materials and structures were applied to this research field. [0003] The compliant force sensor is a kind of compliant sensor, which is mainly used in the measurement of ext...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G01L1/18C08L83/04C08K3/04C08K3/36C08J5/18C08J3/24
Inventor 丁天怀王鹏王璐珩王守利
Owner TSINGHUA UNIV
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