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Optical wiring resin composition and photo-electric composite wiring board

A resin composition and photoelectric composite technology, applied in the direction of optical waveguide light guide, optics, light guide, etc., can solve the problems of large light propagation loss and large Rayleigh scattering, and achieve stable light transmission characteristics, small light propagation loss, Durable and stable effect

Inactive Publication Date: 2007-08-08
TORAY IND INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, there is a problem that the particle size used is large and / or the refractive index of titanium dioxide and alumina is larger than that of the resin, so the Rayleigh scattering caused by the particles is large, and as a result, the light transmission loss tends to increase

Method used

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  • Optical wiring resin composition and photo-electric composite wiring board
  • Optical wiring resin composition and photo-electric composite wiring board
  • Optical wiring resin composition and photo-electric composite wiring board

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0099] Using a ball mill, in the volume ratio after curing, epoxy resin: silicon dioxide = 57: 43, the organosilica sol with an average particle diameter of 12 nm dispersed in γ-butyrolactone was mixed In liquid epoxy resin (Product#314 manufactured by Epotek). It was coated on a quartz substrate using a spin coater, dried in an oven at 80°C for 1 hour in the atmosphere, and then cured by heating at 150°C in nitrogen for 1 hour to obtain a 10 μm-thick refractive index and optical substrate. Propagation loss measurement samples. At room temperature, when the wavelength is 0.837 μm, the refractive index of the obtained sample is 1.484, and the light propagation loss is 0.49 dB / cm. In addition, the refractive index of the epoxy resin monomer produced similarly to the above was 1.51. From this, the refractive index of the silica particles was found to be 1.45.

[0100] Change the temperature from 25°C to 90°C to measure the film thickness change and refractive index change, and...

Embodiment 2～8

[0103] Preparation and evaluation of samples were carried out in the same manner as in Example 1 except that the compositions and conditions shown in Table 1 were used. The evaluation results are shown in Table 1.

Embodiment 9

[0105] In addition to using alumina slurry dispersed in methyl isobutyl ketone solvent instead of organosilica sol, and according to the volume ratio after curing, epoxy resin: alumina = 60:40, Others were performed in the same manner as in Example 1 to prepare samples. A measurement wavelength of 0.85 μm was used. The evaluation results are shown in Table 1.

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PUM

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Abstract

An optical wiring resin composition slightly different in thermal expansion coefficient from an electric wiring board, close in process temperature to it, small in light propagation loss, and suitable for combination with an electric wiring board; and a photo-electric composite wiring board. The optical wiring resin composition is a resin composition comprising inorganic fillers having an average particle size of 1nm through 100nm and resin, wherein the ratio nf / nr between the refractive index nf of the inorganic filler and the refractive index nr of the resin satisfies 0.8 through 1.2, the thermal expansion coefficient of the resin component is -1*10-5 / DEG C through 4*10-5 / DEG C, the true temperature dependency of its refractive index at -20 DEG C through 90 DEG C is -1*10-4 / DEG C through 1*10-4 / DEG C, and the resin layer is substantially free from light absorption at a wavelength of 0.6-0.9 m or at a wavelength of 1.2-1.6 m.

Description

technical field [0001] The present invention relates to an optical wiring material and a photoelectric composite wiring substrate suitable for being combined with an electric wiring board. This optical wiring realizes "optical wiring on board" (optical interconnection) that performs high-speed signal transmission between LSIs (Large Scale Integrated Circuit: Large Scale Integrated Circuit) using optical signals. Background technique [0002] LSI technology is advancing day by day, and its information processing speed and integration scale are gradually increasing. As a result, higher performance of microprocessors and higher capacity of memory chips are rapidly progressing. In addition, a variety of electronic devices such as information home appliances mainly using image information and high functions using these LSIs are entering the market. These include personal computers, hard disk recorders, DVD recorders, etc. [0003] Therefore, it has become difficult to further ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G02B6/12H05K1/02
CPCG02B6/1221H05K1/0274H05K2201/0209H05K2201/068C08K7/08
Inventor 野中敏央朝日升龙田佳子
Owner TORAY IND INC
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