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Method of preparing 3C-SiC nano particles by chemical corrosion method

A nanoparticle and chemical corrosion technology, which is applied in the field of preparation of 3C-SiC nanoparticles, can solve the problems of inability to prepare single-structure phase nanoparticles, expensive SiC multi-chips, difficulties in preparation and purchase, and achieve blue light emission and preparation. Simple method, easy to obtain effect

Inactive Publication Date: 2007-10-24
NANJING UNIV
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Problems solved by technology

The first method is to generate silicon carbide nanoparticles through various chemical reactions, such as carbon ion implantation into silicon wafers [L.S.Liao, X.M.Bao, Z.F.Yang, and N.B.Min, Appl.Phys.Lett.66, 2382(1995) ], Co-sputtering of silicon dioxide thin films by carbon ions and silicon ions [J.Zhao, D.S.Mao, Z.X.Lin, B.Y.Jiang, Y.H.Yu, X.H.Liu, H.Z.Wang, and G.Q.Yang, Appl.Phys.Lett.73, 1838 (1998)], C 60 Coupled porous silicon [X.L.Wu, G.G.Siu, M.J.Stokes, D.L.Fan, Y.Gu, and X.M.Bao, Appl.Phys.Lett.77, 1292 (2000)] and other preparation methods, but these methods cannot prepare a single structural phase , stable strong blue light-emitting nanoparticles
Another method is the electrochemical corrosion method, that is, the electrochemical method is used to corrode the 3C-SiC multi-chip, and then ultrasonically oscillated to obtain silicon carbide nanoparticles suspended in the solution, which can stably emit blue light with high intensity [X.L.Wu , J.Y.Fan, T.Qiu, X.Yang, G.G.Siu, and P.K.Chu, Phys.Rev.Lett.94, 026102 (2005)], but the preparation process of this method is relatively complicated, and more importantly, SiC multi-wafer Not only expensive, but also difficult to prepare and purchase

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  • Method of preparing 3C-SiC nano particles by chemical corrosion method
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[0011] The acid used for common chemical etching is 40% hydrofluoric acid and 65% nitric acid, with a volume ratio of 3:1. During preparation, weigh 10 g of 3C-SiC powder, add it to 100 ml of the above mixed acid, and heat in a constant temperature bath at 100° C. for 1 hour. After cooling, centrifuge the reacted acid solution and powder together in a high-speed centrifuge, pour off the upper layer of acid solution, take out the lower layer of powder, and dry it in an oven at about 80°C. Add deionized water or absolute ethanol to the dried powder, ultrasonically cavitate for 30 minutes, let stand for several hours or centrifuge, and take the supernatant. The deionized water or absolute ethanol clear solution contains 3C-SiC nanoparticles with a size smaller than 8nm. The average size of such nanoparticles is about 3.8 nm.

[0012] High resolution electron micrographs demonstrate that the size of the nanoparticles is less than 8.0 nm. The photoluminescence spectrum shows tha...

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Abstract

The invention discloses a making method of 3C-SiC nanometer particle, which comprises the following steps: adopting the composite liquid of fluohydric acid, nitric acid to etch common 3C-SiC powder; using the size of original powder more than micrometer magnitude's; making the density of etching acid at 35%-45% and the density of nitric acid at 60%-70% with bulk rate at 2. 0-3. 0:1. 0; heating to 80-100 deg. c for 0. 5-2. 0h; cooling; blending reated acid liquid and powder in the high-speed centrifuger to centrifuge; pouring the upper-layer acid liquid; fetching the lower-layer powder; drying in the baker at 70-90 deg. c; adding centrifugal or anhydrous alcohol in the powder; cavitating through ultrasound for 30-60min; fetching the upper supernatant layer with 3C-SiC nanometer particle with size less than 8nm in the deionized water and anhydrous alcohol.

Description

technical field [0001] The invention relates to a simple and cheap method for preparing 3C-SiC nanoparticles capable of emitting strong blue light, especially a method for preparing 3C-SiC nanoparticles with a particle diameter of less than 8 nanometers and strong blue light emitting performance. Background technique [0002] Silicon carbide is the third-generation wide-bandgap semiconductor material developed after the first element semiconductor material (Si) and the second-generation compound semiconductor materials GaAs, GaP, and InP. Silicon carbide not only has a large bandgap width (the bandgap widths of 3C, 4H, and 6H types of silicon carbide at room temperature are 2.24, 3.22, and 2.86eV, respectively), but also has a high critical breakdown electric field, high thermal conductivity, and high load. The characteristics of drift speed and other characteristics have great application potential in high temperature, high frequency, high power, optoelectronics and radiati...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09K11/65C09K11/56
Inventor 朱骏吴兴龙沈剑沧刘钊
Owner NANJING UNIV
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