Aluminum-base printing circuit board and its production

A printed circuit board and manufacturing method technology, applied in the directions of printed circuit manufacturing, printed circuits, printed circuit components, etc., can solve the problems such as the inability to effectively exert the superior performance of high-power semiconductor light-emitting diodes, and achieve excellent electromagnetic shielding performance, processing equipment Effect of simplicity, excellent dimensional stability and machinability

Inactive Publication Date: 2007-11-21
JIANGSU HANDSON INTELLIGENT TECH CO LTD
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Problems solved by technology

Such metal aluminum-based printed circuit boards cannot effectively utilize the superior performance of high-

Method used

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  • Aluminum-base printing circuit board and its production
  • Aluminum-base printing circuit board and its production
  • Aluminum-base printing circuit board and its production

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[0025] As we all know, various printed circuit boards are widely used in the electronics industry. These printed circuit boards have both "single-sided" and "double-sided". When they are used in circuit design, surface mount technology (SMT) is usually used to improve the mounting density of electronic components, reduce product volume, and reduce production and assembly costs. .

[0026] Aluminum-based printed circuit board is a unique metal-based copper clad laminate, which has good thermal conductivity, electrical insulation properties and mechanical processing properties. Aluminum substrates can replace fragile ceramic substrates for better mechanical durability; moreover, aluminum substrates can handle thermal diffusion extremely effectively, thereby reducing product operating temperature, improving product power density and reliability, and extending product use. life. Therefore, aluminum substrates are an important variety of printed circuit boards.

[0027] Figures ...

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Abstract

The bottom layer of invention uses aluminium baseboard; the intermediate layer is a heat conduction insulation layer; the surface layer is an electric conduction layer. It features the following: the heat insulation layer is a ceramic-like thin film layer with 10-400 micron thick and >=100Momega insulation resistance, which chemical composition is aluminium oxide. The preparation method comprises: making pretreatment, de-oiling and washing for the surface of the aluminium baseboard using mechanical method or chemical method to form a clean workpiece plane; using the microarc oxide treatment and the microplasma surface ceramic method to make a heat conduction insulation layer on the workpiece surface; finally, overlapping an electric conduction layer on the heat conduction insulation layer; etching circuit pattern.

Description

technical field [0001] The invention relates to a printed circuit board, in particular to an aluminum-based printed circuit board used when a high-power semiconductor light-emitting diode (LED) is used as an illumination light source, and a manufacturing method of the aluminum-based printed circuit board, belonging to the technical field of electronics and lighting. Background technique [0002] High-power semiconductor light-emitting diode (LED) lighting sources are mainly used on printed circuit boards based on metal aluminum materials. In recent years, with the continuous development of LED scientific research and the continuous improvement of chip technology production levels, high-power LED packaging technology is improving Mature, the luminous efficiency can be greatly improved, and its application fields continue to expand. However, during the process of converting electrical energy into light energy by LED light, due to resistance and non-radiative recombination, LED...

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Application Information

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IPC IPC(8): H05K1/03H05K1/00H05K3/02
Inventor 王劲梁秉文刘乃涛高泽山
Owner JIANGSU HANDSON INTELLIGENT TECH CO LTD
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