Laser cutting method for hard brittle non-metallic material

A non-metallic material and laser cutting technology, applied in laser welding equipment, metal processing equipment, welding/cutting media/materials, etc., can solve problems such as poor controllability, low probability of non-damage cutting, and difficulty in achieving no cracks, etc. To achieve the effect of simplifying the process flow and equipment, shortening the processing time and wide application range

Active Publication Date: 2007-11-28
BEIJING UNIV OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The controllability of guided crack propagation is poor, and dual-beam tracking is prone to superposition and accumulation of thermal effects. Therefore, this method has a low probability of achieving damage-free cutting, especially in curves and corners. It is difficult to achieve a crack-free effect
Laser composite cutting technology is the superposition and synthesis of existing laser cutting technology and some traditional cutting technologies. In terms of technology, there is no innovation, and the process flow and equipment system are also complicated. Most of them are composite designed for a specific processing object. Difficult to be popularized and applied

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0020] The focused laser beam is punched on the single crystal silicon wafer with a drilling time of 0.1s to make a through hole through which the laser can pass, and the cutting peak power is determined to be 1750W; the duty cycle of 4% is introduced, and the peak power of 1750W remains unchanged. Under the premise, the laser beam or the workpiece moves at a speed of 100mm / min, and according to the punching distance of 0.65mm, the laser drilled through holes are densely arranged and cut along the circular processing path, and the diameter of the through holes is 0.05mm; After the drilling program is arranged, the cut piece can be separated from the base material without damage, and there is no need to use laser for irradiation and quick scanning. The cutting process adopts a pressure of 1×10 5 The compressed air of Pa is used as the auxiliary gas, and the cutting surface of the processed single crystal silicon wafer and the surface of the silicon wafer are clean and free of sl...

Embodiment 2

[0022] The focused laser beam is drilled on the aluminum oxide plate with a drilling time of 0.05s to make a through hole through which the laser can pass, and the cutting peak power is determined to be 700W; a duty cycle of 10% is introduced, under the premise that the peak power of 700W remains unchanged , the laser beam or the workpiece moves at a speed of 200mm / min, according to the punching distance of 0.1mm, along the processing paths such as straight lines, curves, and circles, the laser drills through holes and cuts closely. The through hole diameter is 0.3mm, and the through holes are densely packed. After the completion, there is a little slag on the edge of the kerf, and the laser beam with an average power of 800W is used to scan and irradiate rapidly along the cut path at a speed of 1000mm / min in a continuous output mode. Pressure is 2×10 5 N of Pa 2 As an auxiliary gas; it realizes crack-free cutting including straight lines, curves, right angles, acute angles, ...

Embodiment 3

[0024] The focused laser beam is drilled on the fused silica with a drilling time of 0.1s to allow the laser to pass through, and the cutting peak power is determined to be 2000W; a duty cycle of 20% is introduced, under the premise that the peak power of 2000W remains unchanged , at a cutting speed of 500mm / min, according to the punching distance of 0.2mm, along the straight line, curve and other processing paths, the laser drilled through holes are densely packed and cut, and the diameter of the through holes is 0.65mm; The material is slightly stuck, and the laser beam with an average power of 2000W is used in a continuous output mode to scan and irradiate rapidly along the cut path at a speed of 2000mm / min, and the cut piece will be separated from the base material without damage; 5 Ar in Pa is used as the auxiliary gas; on the fused silica with a thickness of 8mm, the right angle, curve, acute angle and other non-damaging cutting with good verticality of the kerf edge are ...

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PUM

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Abstract

The present invention is non-destructive laser cutting process for hard brittle non-metal material, and belongs to the field of laser processing technology. The non-destructive laser cutting process includes focusing laser beam with peak power of 700-4000 W and duty ratio of 4-50 % onto the material to perforate one through hole under the cooperation of auxiliary gas in the pressure of (1-5)x10<5> Pa; and moving the laser beam or the workpiece in the speed of 100-500 mm/min to perforate serial through holes of 0.05-0.65 mm diameter in the interval of 0.05-0.2 mm along the machining path, with the adjacent through holes possessing edges connected mutually, so as to complete the cutting of the material. The non-destructive laser cutting process has less local heat effect.

Description

technical field [0001] The invention belongs to the field of laser material processing, in particular to the technical field of laser non-damage cutting of hard and brittle non-metallic materials. Background technique [0002] Hard and brittle non-metallic materials refer to substances, including single crystals, ceramics, glasses, etc., that are mostly bonded by covalent bonds, ionic bonds or mixed chemical bonds, and have the intrinsic characteristics of high hardness and high brittleness. At room temperature, this type of material has a great deformation resistance to shear stress, which increases the difficulty and cost of cutting the material without damage, and seriously hinders the further development and application of material properties. [0003] The traditional cutting methods of hard and brittle non-metallic materials include grinding method, etching method, electric machining method, microwave processing method and the newly developed laser cutting method. Amon...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K26/40B23K26/14B23K35/38B23K26/402
Inventor 季凌飞鲍勇闫胤洲蒋毅坚
Owner BEIJING UNIV OF TECH
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