Transparent epoxy nano composite material and its preparation method and use

A nano-composite material and nano-composite particle technology are applied in the field of transparent epoxy nano-composite materials and their preparation, which can solve the problems of decreased transmittance in the visible light region, increased viscosity of mixtures, and increased specific surface area of ​​fillers, etc.
CN101077923AInactive Publication Date: 2007-11-28广东中科顺威新材料科技发展有限公司
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
广东中科顺威新材料科技发展有限公司
Publication Date
2007-11-28
Estimated Expiration
Not applicable · inactive patent

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Abstract

The present invention relates to one kind of transparent composite epoxy material and its preparation process and use. The transparent composite epoxy material has nanometer composite inorganic stuffing comprising nanometer silica particle serving as core, titania serving as shell coating the silica particle core and outer silica layer coating the titania shell. The transparent composite epoxy material possesses high transparency, excellent ultraviolet ray shielding effect, high ultraviolet ray tolerance, low heat expansion coefficient, high heat conductivity and other advantages, and is suitable for use in pacing LED and other light emitting semiconductor devices.
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Description

technical field

[0001] The present invention relates to a kind of transparent epoxy nanocomposite material and its preparation method and application, more specifically, the present invention relates to a kind of transparent epoxy nanocomposite material whose filler is the composite nanoparticle with core-shell structure and its preparation method and uses. Background technique

[0002] At present, epoxy resins used for electronic packaging such as light emitting diodes (LEDs) are mainly bisphenol A type transparent epoxy resins, and transparent epoxy resins are very mature for digital tube packaging. However, the packaging of LED solid-state lighting devices is different from the packaging of ordinary digital tubes, especially the white LED based on ultraviolet light has higher requirements on various properties of epoxy resin. For example: it is difficult to realize the complete conversion of ultraviolet light to ultraviolet-excited white LEDs, and the impact of a large a...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
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