High performance water typed edge-rounding agent in use for processing semiconductor wafer

A wafer processing and semiconductor technology, applied in the field of chamfering liquid, can solve the problems of difficult cleaning, affecting tool life, poor heat dissipation, etc., to achieve the effects of easy operation, improved tool life, and efficient compounding

Inactive Publication Date: 2007-12-26
天津晶岭电子材料科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the existing chamfering liquid has disadvantages such as poor heat dissipation, difficult cleaning, and impact on tool life.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0012] A chamfering solution for silicon wafers, composed of fatty alcohol polyoxyethylene ether, polyethylene glycol, alkylphenol polyoxyethylene ether and deionized water, the weight percentage of various components is: fatty alcohol polyoxyethylene ether Oxyethylene ether 5.0%; Polyethylene glycol 30%; Alkylphenol polyoxyethylene ether 0.5%; Deionized water is the balance. The preparation method of the semiconductor chamfering liquid is as follows: firstly filter and purify the various components of the prepared chamfering liquid respectively, and then in the environment of a thousand-class clean room, put the various components under the power of vacuum negative pressure According to its weight percentage, it is input into the container tank through a mass flow meter and fully stirred until it is evenly mixed. Experiments show that the chamfering liquid has good heat dissipation and lubricity, and the tool life is more than doubled.

Embodiment 2

[0014] A chamfering solution for germanium wafers, composed of phosphoric acid ester, ethylene glycol, polyoxyethylene ester and deionized water, the weight percentages of various components are: phosphoric acid ester 7%; ethylene glycol 35%; Polyoxyethylene ester 1%; deionized water is the balance. The preparation method of the semiconductor chamfering liquid is as follows: firstly filter and purify the various components of the prepared chamfering liquid respectively, and then in the environment of a thousand-class clean room, put the various components under the power of vacuum negative pressure According to its weight percentage, it is input into the container tank through a mass flow meter and fully stirred until it is evenly mixed. Experiments show that the chamfering liquid has good heat dissipation and lubricity, and the wafer is complete and easy to clean.

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PUM

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Abstract

This invention discloses a high-efficiency waterborne edge-rounding solution for processing semiconductor wafer. The edge-rounding solution comprises: penetrant 0.1-10.0 wt.%, lubricant 10-40 wt.%, surfactant 0.1-1.0 wt.%, and deionized water as balance. The penetrant and surfactant are metal ion free, and thus can avoid chemical corrosion caused by metal ions. The edge-rounding solution has such advantages as high lubricity, high heat discharge performance, simple preparation, easy operation and low chemical corrosion, and can prolong the service life of cutters. The edge-rounding solution can solve the problems of impurity contamination, deep damage layer, high stress, and reduced service life faced by microelectronic process.

Description

(1) Technical field [0001] The invention relates to a chamfering liquid for semiconductor wafer processing, in particular to a high-efficiency water-based chamfering liquid for semiconductor wafer processing. (2) Background technology [0002] The processing of semiconductor wafers is the basis of VLSI production, and it plays a vital role in subsequent processes (epitaxy, oxidation, photolithography, etc.). Taking silicon wafers as an example, silicon wafer processing mainly includes processes such as rounding, slicing, crystal positioning, chamfering, and silicon wafer grinding. Chamfering is to use a grinding wheel with a specific blade profile to grind away the sharp edges and corners around the silicon wafer. Since the edge corners will bring harm to the surface processing and integrated circuit technology in the future, the cracking of the edge of the silicon wafer and the defects caused by thermal stress can be prevented by chamfering. During the chamfering process,...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C10M145/26C10M153/04H01L21/304C10N40/00
Inventor 仲跻和刘玉岭
Owner 天津晶岭电子材料科技有限公司
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