Cashew phenol modified phenolic resin and method for manufacturing paper-based laminated board

A technology of cashew nut phenol and phenolic resin, which is applied in the production of copper-clad laminates and paper-based laminates. It can solve the problems of not being suitable for lead-free reflow soldering and unsatisfactory performance, and achieve excellent punching and drilling processability. Excellent workability and low water absorption

Active Publication Date: 2008-01-02
SHANDONG JINBAO ELECTRONICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] Now, with the lightness, thinness, and miniaturization of civilian electronic devices, the performance requirements for paper-based copper-clad laminates are getting higher and higher. The performance of tung oil-modified phenolic resin copper-clad laminates currently used in production can no longer meet high-performance copper-clad laminates. The production of paper-based copper clad laminates, water absorption, punching and drilling processability, soldering resistance, etc. cannot meet the performance index requirements of industrial electrical power supplies, lighting facilities and other electronic products for circuit boards, and do not meet the requirements. More demanding lead-free reflow soldering

Method used

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Examples

Experimental program
Comparison scheme
Effect test

specific Embodiment 1

[0025] Put in a 1000 ml three-necked flask successively: 100 grams of phenol, 75 grams of cardanol, 120 grams of formaldehyde (37%), 1.5 grams of ammonia (25%), and 1 gram of triethylamine. Then the temperature is raised to 80-90°C to react for 1-2 hours, the gelation time is controlled to 100-160 seconds / 160±5°C, and then dehydration under reduced pressure. Add a proper amount of methanol to dissolve, and obtain a modified phenolic resin with a solid content of 50-52%. Then used to impregnate 127g / m 2 The bleached wood pulp paper is dried to obtain a prepreg with a glue content of 48-52%. Combine 8 prepregs and 1 rubber-coated copper foil, and press for 1 hour at a temperature of 155±5°C and a unit pressure of 10-12 mpa to obtain a 1.6mm paper-based copper clad laminate, which is used as sample 1. Then test according to the national standard GB / T4723-1992.

specific Embodiment 2

[0026] Put 100 grams of phenol, 100 grams of cashew phenol, 150 grams (37%) of formaldehyde, 1.5 grams (25%) of ammonia water, and 1 gram of triethylamine into a 1,000-ml three-necked flask, and operate according to the process of specific example 1. Get sample 2. Test according to the same standard.

specific Embodiment 3

[0027] Put 100 grams of phenol, 150 grams of cashew phenol, 180 grams (37%) of formaldehyde, 1.5 grams (25%) of ammonia water, and 1.2 grams of triethylamine into a 1,000-ml three-necked flask, and proceed according to the process of specific embodiment 1. Get sample 3. Test according to the same standard.

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PUM

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Abstract

The invention relates to a cashew phenol modified formaldehyde-phenol resin and a method for manufacturing paper basal layer clamping plate with the resin in the roofing copper production method technique field. The material of the cashew phenol modified linear formaldehyde-phenol resin is cashew phenol, phenol, formaldehyde, basic catalyst and the solvent. The method comprises the following steps: (1)proceeding with the reaction of cashew phenol, phenol, formaldehyde for 1-2 hours at 80-90Deg. C in the basic catalyst function; controlling the gel time at 100-160 s/160+-5Deg. C; reducing the pressure and dewatering; acquiring the cashew phenol modified formaldehyde-phenol resin; (2)getting 50-52% solid content cashew phenol modified formaldehyde-phenol resin by diluting with the solvent; (3)dipping the wood-pulp paper with the diluted modified formaldehyde-phenol resin; forming the semi-solid sheet by gluing and drying; formulating a gluing copper foil and a plurality of semi-solid sheets together; heating; increasing the pressure; manufacturing the paper basal roofing copper. The paper basal roofing copper is provided with low water absorption ratio, the low punching property and the good drilling hole processability; and the high-density wiring board is provided with the high soldering resistance, which is fit for leadless reflow soldering.

Description

1. Technical Field [0001] The invention relates to a cardan phenol modified phenolic resin and a paper-based laminate manufacturing method using the resin, and belongs to the technical field of copper clad laminate production methods. 2. Background technology [0002] Copper clad laminate is an important material in the printed circuit board industry. Paper-based copper clad laminates have excellent punching properties, excellent drilling processability, and low prices, so they are widely used in printed circuit boards for civil electronic devices. [0003] The manufacturing process of paper-based copper clad laminates is to modify phenolic resin with drying oils such as tung oil and linseed oil, or to modify phenolic resin with industrial resins such as xylene resin, and then impregnate and dry the wood pulp paper ,Get a prepreg. The semi-cured sheet is laminated according to the specified number of sheets and then compounded with the copper foil and then heated and pressurized ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08G8/24B32B15/12D21H21/18
Inventor 杨卫国刘雪萍王志英孙瑞珍
Owner SHANDONG JINBAO ELECTRONICS
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