Algae removing type polishing liquid

A polishing liquid and algae-type technology, applied in the field of polishing liquid, can solve problems affecting the properties and appearance of the polishing liquid, polluting the production equipment of the polishing liquid, etc., and achieve the effects of solving appearance problems, prolonging the quality assurance time, and reasonable industrialization

Inactive Publication Date: 2008-01-02
天津晶岭电子材料科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, since this SiO 2 The sol is easy to provide an environment suitable for the growth of algae: that is, sufficient moisture, oxygen and nutrients, so under certain temperature and pH conditions, it will cause the rapid growth and reproduction of algae, and cause irreversible transformation of the silica sol
These green algae are introduced into the polishing liquid along with the silica sol abrasive, and can still exist and grow and reproduce in the alkaline environment of the polishing liquid, thus affecting the properties and appearance of the polishing liquid and polluting the production of the polishing liquid equipment

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0041] Embodiment 1: a kind of algae-removing type polishing fluid is characterized in that it is made of SiO 2 Sol, pH adjuster, surfactant, bactericide and algaecide, chelating agent and water are mixed.

[0042] The above-mentioned algae-removing polishing liquid includes seven specific components:

[0043] Composition I: SiO 2 Sol;

[0044] Ingredient II: pH adjuster selects triethanolamine among organic bases, (HOCH 2 CH 2 )3 ;

[0045] Ingredient III: Select the hydroxyethyl-s-triazine fungicide and algaecide in the fungicide and algaecide;

[0046] Component III and component V are surfactants: component IIII selects the condensate (JFC) R-O(C) of ethylene oxide and higher fatty alcohols of polyoxyethylene ethers in the surfactant 2 h 4 O) n H; Component V: Select the fatty alcohol polyoxyethylene (20) ether (Pingping plus O-20) of the polyoxyethylene ether class in the surfactant, RO (CH 2 CH 2 O) 20 H R = C 12-18 h 25-37 ;

[0047] Ingredient VI: ethylen...

Embodiment 2

[0050] Embodiment 2: a kind of algae-removing type polishing fluid is characterized in that it is made of SiO 2 Sol, pH adjuster, surfactant, bactericide and algaecide, chelating agent and water are mixed.

[0051] The above-mentioned algae-removing polishing liquid includes seven specific components:

[0052] Composition I: SiO 2 Sol;

[0053] Ingredient II: pH adjuster selects tetramethylammonium hydroxide in organic base;

[0054] Ingredient III: Select the hydroxyethyl-s-triazine fungicide and algaecide in the fungicide and algaecide;

[0055] Component III and component V are surfactants: component IIII selects polyoxyethylene sorbitan monooleate (Tween-80) in the surfactant; component V selects polyoxyethylene in the surfactant Octyl alcohol polyoxyethylene ether diethylenediamine;

[0056] Ingredient VI: Tetrahydroxyethylethylenediamine tetraacetate in the selected chelating agent;

[0057] Component VII: H 2 O;

[0058] The proportions by weight of the seven co...

Embodiment 3

[0059] Embodiment 3: a kind of algae-removing type polishing fluid is characterized in that it is made of SiO 2 Sol, pH adjuster, surfactant, bactericide and algaecide, chelating agent and water are mixed.

[0060] The above-mentioned algae-removing polishing liquid includes seven specific components:

[0061] Composition I: SiO 2 Sol;

[0062] Ingredient II: the pH regulator is selected from hexahydroxyethylenediamine in the organic base;

[0063] Ingredient III: Dodecyldimethylbenzyl ammonium chloride bactericidal algaecide selected from the bactericidal algaecide;

[0064] Component III and component V are surfactants: component IIII selects polyoxyethylene nonylphenol polyoxyethylene ether in the surfactant; component V selects polyoxyethylene sorbitan monooleic acid in the surfactant Ester sorbitan oleate;

[0065] Ingredient VI: ethylenediaminetetraacetic acid disodium salt (EDTA) in the selected chelating agent;

[0066] Component VII: H 2 O;

[0067] The propor...

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Abstract

The invention discloses an algaecide typed polishing liquid, which comprises the following parts: 25%-45% SiO2 sol, 5%-10% pH value modifier, 1%-4% surface activator, 0.02-2% germicidal algaecide, 0.1-3% chelant and 30 %-65% water, wherein the scale of pH value is 9-13.5; the grain size is between 10nm and 130nm. The invention lengthens the preserving time obviously to solve the appearance and pollution problem, which simplifies the operation with reasonable industrialization.

Description

(1) Technical field: [0001] The invention relates to a polishing liquid, in particular to an algae-removing polishing liquid. (two) background technology: [0002] CMP is a semiconductor processing technology, that is, a polishing slurry is introduced between the wafer to be polished and the polishing pad, and mechanical polishing is performed while chemically etching the processed surface of the wafer. This technology was successfully developed by IBM Corporation of the United States in the 1980s. So far, this technology has become the most basic method for producing submicron semiconductor chips in the world. [0003] An important factor affecting the CMP polishing effect is the CMP polishing slurry. Polishing slurry can be roughly divided into three types according to the type of surface to be treated: oxide polishing slurry, metal polishing slurry and polysilicon wafer polishing slurry. Among them, the oxide polishing slurry is suitable for polishing the surface of th...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09G1/14H01L21/304
Inventor 仲跻和李家荣周云昌高如山
Owner 天津晶岭电子材料科技有限公司
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