Automatic welding ball packaging metal ball embedding method and apparatus

Abstract

The invention relates to a method and device for Ball Array of the soldered ball in BGA Ball Grid Array Package technology, which belongs to technical field of electronic packing. The invention is to inject the inert gases into the crucible and the vacuum gas tight chamber and makes the crucible and the vacuum gas tight chamber achieve the stable differential pressure by pressure control system, and makes the metal melt ejected from a tiny nozzle of the crucible in the form of laminar jet. The vibration generated from piezoelectric oscillator perturbates the metal jet and makes it fractured into the even liquid drop, and then obtains the real-time size parameters aided by the monitoring system and computer analysis to feedback control the frequency of the oscillator and reduce the difference in size between the generated molten drop and the preset molten drop. The invention can correctly place the even solder ball in the appropriate thermodynamic state on the substrate preconfigured with the positions of the solder ball, which has the advantages of short process flow, good quality of product and greatly lowering the equipment investment.

Description

technical field [0001] The invention belongs to the technical field of electronic packaging, and in particular relates to an automatic solder ball packaging ball planting method and device in the ball grid array packaging (Ball Grid Array, BGA) technology. Background technique [0002] In recent years, with the continuous improvement of circuit integration and the sharp increase in the number of I / O pins, ball grid array packaging technology has been widely used in electronic packaging. The most interesting focus of this packaging technology is how to position hundreds of solder balls on the solder joints of the substrate. At present, in the production of large-scale electronic products, the use of mechanical sucker ball planting technology has disadvantages such as missed planting, many ball planting steps, high cost and specific equipment can only be used for single-size solder balls. [0003] Patent application CN1899732 proposes a method and device for preparing precisi...

AI Technical Summary

Problems solved by technology

This patent application has the advantages of short process flow, less investment in equipment, and high production efficiency. However, due to the metal jet flow in the precision solder ball preparation process is easily affected by the environment in this solder ball preparation device and method, the resulting solder balls have certain problems. Particle size distribution, and cannot be adjusted and controlled in real time during the preparation process

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