Automatic welding ball packaging metal ball embedding method and apparatus

An automatic soldering and ball planting technology, which is applied in the manufacture of electrical components, semiconductor/solid-state devices, circuits, etc., can solve the problems of short process flow and inability to perform real-time adjustment and control, and achieve short process flow, high accuracy, and reliability. strong control effect

Inactive Publication Date: 2008-03-12
TIANJIN UNIV
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Problems solved by technology

This patent application has the advantages of short process flow, less investment in equipment, and high production efficiency. However, due to the metal jet flow in the precision solder ball preparation process is easily affected

Method used

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  • Automatic welding ball packaging metal ball embedding method and apparatus

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Embodiment Construction

[0025] The present invention mainly injects inert gas (such as nitrogen) into the crucible and the vacuum-sealed chamber, and utilizes the pressure control system to make the crucible and the vacuum-sealed chamber reach a stable pressure difference, so that the metal melt flows from the micro-nozzle at the bottom of the crucible to According to the principle of Rayleigh jet instability, the vibration generated by the piezoelectric oscillator is used to disturb the metal jet, so that the metal jet breaks into uniform droplets. The real-time size parameters of the generated droplets are obtained through the monitoring system combined with the computer analysis system, and then for the optimized parameters, the frequency of the oscillator is feedback-controlled to reduce the error between the generated metal droplets and the set droplet size. The metal droplet is electrified by the electrode plate, and the microcomputer control system controls the electric field parameters of the ...

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Abstract

The invention relates to a method and device for Ball Array of the soldered ball in BGA Ball Grid Array Package technology, which belongs to technical field of electronic packing. The invention is to inject the inert gases into the crucible and the vacuum gas tight chamber and makes the crucible and the vacuum gas tight chamber achieve the stable differential pressure by pressure control system, and makes the metal melt ejected from a tiny nozzle of the crucible in the form of laminar jet. The vibration generated from piezoelectric oscillator perturbates the metal jet and makes it fractured into the even liquid drop, and then obtains the real-time size parameters aided by the monitoring system and computer analysis to feedback control the frequency of the oscillator and reduce the difference in size between the generated molten drop and the preset molten drop. The invention can correctly place the even solder ball in the appropriate thermodynamic state on the substrate preconfigured with the positions of the solder ball, which has the advantages of short process flow, good quality of product and greatly lowering the equipment investment.

Description

technical field [0001] The invention belongs to the technical field of electronic packaging, and in particular relates to an automatic solder ball packaging ball planting method and device in the ball grid array packaging (Ball Grid Array, BGA) technology. Background technique [0002] In recent years, with the continuous improvement of circuit integration and the sharp increase in the number of I / O pins, ball grid array packaging technology has been widely used in electronic packaging. The most interesting focus of this packaging technology is how to position hundreds of solder balls on the solder joints of the substrate. At present, in the production of large-scale electronic products, the use of mechanical sucker ball planting technology has disadvantages such as missed planting, many ball planting steps, high cost and specific equipment can only be used for single-size solder balls. [0003] Patent application CN1899732 proposes a method and device for preparing precisi...

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Application Information

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IPC IPC(8): H01L21/60
Inventor 吴萍周伟刘立娟李宝凌王艺
Owner TIANJIN UNIV
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