Novel packaging device of organic EL device and its packaging method

A technology of electroluminescent devices and packaging devices, which is applied in the direction of electric solid devices, electrical components, semiconductor devices, etc., to achieve the effect of simple structure and easy operation

Active Publication Date: 2010-08-04
UNIV OF ELECTRONICS SCI & TECH OF CHINA +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, so far, there are certain problems in the packaging methods of OLED devices. The existing packaging devices for flat panel display and lighting devices cannot meet or be compatible with OLED device technology.

Method used

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  • Novel packaging device of organic EL device and its packaging method
  • Novel packaging device of organic EL device and its packaging method
  • Novel packaging device of organic EL device and its packaging method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment approach 1-5

[0032] The preparation method is as follows:

[0033] ①Use detergent, ethanol solution and deionized water in sequence to ultrasonically clean the transparent conductive substrate ITO glass, and dry it with dry nitrogen after cleaning. The ITO film on the glass substrate is used as the anode layer of the device, the square resistance of the ITO film is 10-15Ω / □, and the film thickness is 1500 ;

[0034] ②Put the treated transparent substrate on the glue spinner to spin-coat the doped film (hole transport layer) PS:TPD, and roughly control the spin-coated film by controlling different solution concentration ratios, speed and time of the glue spinner. thickness of;

[0035] ③ Move the spin-coated substrate into a high vacuum chamber, and pretreat the ITO glass with low-energy oxygen plasma for 10 minutes in an oxygen environment with a pressure of 20Pa, and the sputtering power is ~20W;

[0036] ④Transfer the substrate to the organic vacuum evaporation chamber, and wait for ...

Embodiment approach 6-14

[0045] The preparation method is as follows:

[0046] ①Use detergent, ethanol solution and deionized water to ultrasonically clean the transparent conductive substrate ITO glass, and dry it with dry nitrogen after cleaning. The ITO film on the glass substrate is used as the anode layer of the device, the square resistance of the ITO film is 10-15Ω / □, and the film thickness is 1500 ;

[0047] ② Move the dried substrate into a high vacuum chamber, and pretreat the ITO glass with low-energy oxygen plasma for 10 minutes in an oxygen and argon atmosphere with a pressure of 20Pa, and the sputtering power is 20w;

[0048] ③Transfer the treated substrate to the organic vacuum evaporation chamber, and wait for the air pressure in the chamber to be 4×10 -4 Pa, the vapor deposition of the organic thin film is started. The hole injection layer evaporated sequentially according to the above device structure: CuPc is 200 , transport layer: α-NPD is 600 , light-emitting layer: Alq3 (...

Embodiment approach 15-20

[0054] The fabrication process of the device is similar to Embodiments 6-14.

[0055] Specific embodiments 21-30

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Abstract

The invention discloses a novel packaging device for an organic electroluminescent device, comprising a cover plate, a locating plate and a packaging holding apparatus, wherein, a groove which corresponds to a substrate is arranged on the cover plate and the substrate contact face of the organic electroluminescent device; hygroscopic agents are arranged inside the groove; the locating plate is provided with a locating hole the size of which is consistent with that of the substrate and arranged above the cover plate; the side face of the substrate which is provided with an organic electroluminescent layer faces towards and passes through the locating hole and is led into the groove; the packaging holding apparatus is arranged above the substrate which is closely connected with the cover plate. The packaging device of the invention can solve substrate slippage and deviation due to unequal stress during the packaging process, thereby packaging precision is guaranteed; packaging efficiency is improved; equipment requirements and production cost are reduced. Particularly, the invention has strong maneuverability on packaging of small and medium-sized substrates and large-sized cover plates and meets actual requirements.

Description

technical field [0001] The invention relates to the technical field of organic electroluminescence in electronic components, in particular to a novel packaging device for an organic electroluminescent device and a packaging method based on the device. Background technique [0002] Organic light-emitting diode (OLED) is a device that directly converts electrical energy into light energy of organic molecules. , when the two charges reach the light-emitting layer and meet, an excited state (exciton) of the molecule may be formed. The excitons are radiatively deactivated from the excited state back to the ground state, and the energy difference is released in the form of photons. OLED has the advantages of low driving voltage, high luminous brightness and efficiency, wide viewing angle, fast response speed, low energy consumption, simple manufacturing process, and can easily realize full-color flat panel display and flexible display devices, so its application prospect is broa...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L51/52H01L51/54H01L51/56H01L51/50H01L25/03H01L21/50
Inventor 张磊于军胜孙力王玉林钟建蒋泉蒋亚东
Owner UNIV OF ELECTRONICS SCI & TECH OF CHINA
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