Diamond ultrathin saw bit with nickel aluminium alloy as base and manufacturing method thereof

A technology of nickel-aluminum alloy and artificial diamond, which is applied in the field of nickel-aluminum-aluminum-based diamond ultra-thin saw blades, can solve the problems that the manufacturing technology of nickel-aluminum-aluminum-based diamond ultra-thin saw blades has not been reported, and achieve long life and high rigidity. Effect

Inactive Publication Date: 2008-07-23
JIANGSU POLYTECHNIC UNIVERSITY
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] However, the current domestic diamond saw blade manufacturing technology is mainly aimed at thick diamond saw blades above 5...

Method used

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  • Diamond ultrathin saw bit with nickel aluminium alloy as base and manufacturing method thereof
  • Diamond ultrathin saw bit with nickel aluminium alloy as base and manufacturing method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0027] (1) Mixing

[0028] Select 70 parts of nickel powder with a purity of more than 99.9%, 10 parts of aluminum powder with a purity of more than 99.8% and 20 parts of titanium-coated artificial diamond particles (particle size is 5 microns to 10 microns) and fully mix them in a three-dimensional mixer.

[0029] (2) cold press forming

[0030] Put the mixed powder (1) into the mold and cold press it on a four-column hydraulic press with a pressure of 300kgf / cm 2 , hold the pressure for 10 minutes, and press it into a φ100mm×400μm disc.

[0031] (3) Put the saw blade blank (2) into the hot-press sintering furnace, first heat it to 670°C, keep it warm for 30 minutes, then continue to heat it to 800°C and keep it warm for 20 minutes, and the hot-pressing pressure is 300kgf / cm 2 .

[0032] (4) Slowly cool down to below 200°C with the furnace under pressure, and get out of the furnace to obtain a nickel-aluminum alloy diamond ultra-thin saw blade containing 70 parts of nickel...

Embodiment 2

[0035] Select 70 parts of nickel powder with a purity of more than 99.9%, 10 parts of aluminum powder with a purity of more than 99.8% and 20 parts of titanium-coated artificial diamond particles (particle size is 5 microns to 10 microns) and fully mix them in a three-dimensional mixer.

[0036] (2) cold press forming

[0037] Put the mixed powder (1) into the mold, and cold press it on a four-column hydraulic press with a pressure of 400kgf / cm 2 , hold the pressure for 10 minutes, and press it into a φ100mm×400μm disc.

[0038] (3) Put the saw blade blank (2) into the hot-press sintering furnace, heat it to 690°C, keep it warm for 30 minutes, then continue to heat it to 760°C and keep it warm for 20 minutes, and the hot-pressing pressure is 200kgf / cm 2 .

[0039] (4) Slowly cool down to below 200°C with the furnace under pressure, and get out of the furnace to obtain a nickel-aluminum alloy diamond ultra-thin saw blade containing 70 parts of nickel, 10 parts of aluminum and...

Embodiment 3

[0042] Select 50 parts of nickel powder with a purity of more than 99.9%, 20 parts of aluminum powder with a purity of more than 99.8%, and 30 parts of titanium-plated artificial diamond particles (with a particle size of 5 microns to 10 microns) and fully mix them in a three-dimensional mixer.

[0043] (2) cold press forming

[0044] Put the mixed powder (1) into the mold and cold press it on a four-column hydraulic press with a pressure of 300kgf / cm 2 , hold the pressure for 10 minutes, and press it into a φ100mm×400μm disc.

[0045] (3) Put the saw blade blank (2) into the hot-press sintering furnace, first heat it to 700°C, keep it warm for 10 minutes, then continue to heat it to 750°C and keep it warm for 60 minutes, and the hot-pressing pressure is 100kgf / cm 2 .

[0046] (4) Slowly cool under pressure with the furnace to below 200°C, and then get out of the furnace to obtain a nickel-aluminum alloy-based diamond ultra-thin saw blade containing 50 parts of nickel, 20 pa...

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Abstract

The invention relates to a ni-al alloy-based diamond ultra-thin saw blade used for precise cutting in single (multi) crystal silicon, glass, ceramic, gem processing, etc. industries and the preparation method of the diamond ultra-thin saw blade. 50-70 units (volume percentage) of the nickel (5-20 micro meters) with the purity more than 99.9%, 10-30 units of aluminium powder (5-20 micro meters) and 20-30 units of titanium-plated artificial diamond grains (5-10 micro meters) are uniformly mixed in a three dimensional material mixer, then arranged into a die and cold pressed to a biscuit with the diameter dimension of Phi 25-200mm multiplied by 100-400 Mum on a four-column hydraulic press under a forming pressure of 100-500kgf/cm<2>; after that, a hot pressing and sintering is achieved by two sections; the heating of the mixture is firstly achieved in a vacuum hot pressing sintering furnace till the temperature is increased to 670-700 DEG C, and the temperature is kept for 5-60 minutes; after that, the temperature is increased to 750-800 DEG C and kept for 5-60 minutes with the hot pressure of 100-400kgf/cm<2>; the temperature is then gradually cooled to below 200 DEG C with the pressure in the furnace and the diamond saw blade can be gained after a discharge. The invention has the advantages of high strength, high rigidity, high ductility, high density, long service life, etc.

Description

technical field [0001] The invention relates to a nickel-aluminum alloy based diamond ultra-thin saw blade used for precision cutting in single (poly) crystal silicon, glass, ceramics, gemstone processing and other industries and a manufacturing method of the diamond ultra-thin saw blade. Background technique [0002] Diamond has properties such as high hardness, high wear resistance, high compressive strength and excellent thermal conductivity, making it widely used in the field of metal and hard and brittle material processing, such as diamond saw blades, grinding wheels, drill bits, etc. Diamond ultra-thin saw blades made of metal and diamond are mainly used for precision cutting of high-tech materials such as silicon wafers for semiconductor integrated circuits, single crystal silicon wafers for solar cells, gemstones, artificial crystals, and information functional ceramics. In order to reduce the kerf loss as much as possible, the thickness of the saw blade is generall...

Claims

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Application Information

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IPC IPC(8): B22F7/00
Inventor 李海王芝秀曹大呼王强李坤
Owner JIANGSU POLYTECHNIC UNIVERSITY
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