Lead-free solder water-soluble soldering fluid

A lead-free solder, water-soluble technology, applied in the direction of welding/cutting media/materials, welding media, welding equipment, etc., can solve the problems of reliability and stability of electronic products, endangering human health, and potential safety hazards. Achieve good wetting and solderability, reliability and cleanliness, and shorten soldering time

Inactive Publication Date: 2008-09-17
太仓市首创锡业有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

At present, when packaging electronic products, active rosin core tin-lead solder wire and active rosin core lead-free solder wire are generally used. Since the active agent in the existing active rosin core tin-lead solder wire is an amine salt containing halogen, the flux after soldering There are more residues and more residual halogen ions, which bring hidden dangers to the reliability and stability of electronic products
In order to ensure the electrical insulation and reliability of electronic products, it is necessary to clean the flux residues on the printed boards.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0029] According to the lead-free solder water-soluble soldering flux of the present embodiment, be made up of the component of following weight ratio:

[0030] Polyoxyethylene sorbitan monolaurate 49%, coconut oil 3%, citric acid 3.5%, dimethylamine hydrochloride 2%, silicone oil 0.2%, deionized water.

[0031] The preparation method of this lead-free solder water-soluble flux:

[0032] Add 3.5kg of citric acid and 42.3kg of deionized water into a reactor with a stirrer and stir to dissolve evenly to form a saturated solution, then add 2.0kg of dimethylamine hydrochloride and 49kg of polyoxyethylene sorbitan monohydrate under stirring Lauric acid ester, after stirring evenly, add 3.0kg of non-drying oil and 0.2kg of organic silicon oil, until stirring evenly, obtains the described lead-free solder water-soluble flux.

Embodiment 2

[0034] According to the lead-free solder water-soluble soldering flux of the present embodiment, be made up of the component of following weight ratio:

[0035] Polyoxyethylene sorbitan monostearate 47%, palm oil 2%, malic acid 3%, dimethylamine hydrochloride 1%, diethylamine hydrochloride 1%, silicone oil 0.2%, deionized water.

[0036] The preparation method of the lead-free solder water-soluble flux is the same as that in Example 1.

[0037] To sum up, the water-soluble flux for lead-free solder of the present invention has scientific design, reasonable proportion, simple manufacturing process and good comprehensive performance.

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PUM

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Abstract

The invention relates to a lead-free solder water soluble flux; wherein, the weight proportions of the components are as follows: organic acid activator is 2 to 5%, amine halogen acid salt is 05 to 2.5%, nonionic surface-active material is 40 to 60%, nondrying oil is 2 to 5%, defoamer is 0.1 to 0.5%, and the rest is deionized water. The lead-free solder water soluble flux has the advantages of scientific design, reasonable ratio, and simple manufacturing technology, thus being applicable to Sn-Ag-Cu, Sn-Cu and Sn-Zn base lead-free solder, and providing a new welding material for electronic product encapsulation with no rosin, no toxin, no harms, no corrosiveness, while with good wettability and good welding performance, and safe and easy rinsing.

Description

technical field [0001] The invention relates to flux, in particular to a water-soluble flux for lead-free solder. Background technique [0002] Flux is widely used in the field of soldering materials for electronic information products. In response to the global environmental protection law and the development requirements of the electronic information industry, it is an inevitable trend for electronic information products and electrical products to be lead-free. At present, when packaging electronic products, active rosin core tin-lead solder wire and active rosin core lead-free solder wire are generally used. Since the active agent in the existing active rosin core tin-lead solder wire is an amine salt containing halogen, the flux after soldering There are more residues and more residual halogen ions, which bring hidden dangers to the reliability and stability of electronic products. In order to ensure the electrical insulation and reliability of electronic products, it i...

Claims

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Application Information

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IPC IPC(8): B23K35/36
Inventor 王文明徐菊英王国银
Owner 太仓市首创锡业有限公司
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