Lead-free solder water-soluble soldering fluid

Abstract

The invention relates to a lead-free solder water soluble flux; wherein, the weight proportions of the components are as follows: organic acid activator is 2 to 5%, amine halogen acid salt is 05 to 2.5%, nonionic surface-active material is 40 to 60%, nondrying oil is 2 to 5%, defoamer is 0.1 to 0.5%, and the rest is deionized water. The lead-free solder water soluble flux has the advantages of scientific design, reasonable ratio, and simple manufacturing technology, thus being applicable to Sn-Ag-Cu, Sn-Cu and Sn-Zn base lead-free solder, and providing a new welding material for electronic product encapsulation with no rosin, no toxin, no harms, no corrosiveness, while with good wettability and good welding performance, and safe and easy rinsing.

Description

technical field [0001] The invention relates to flux, in particular to a water-soluble flux for lead-free solder. Background technique [0002] Flux is widely used in the field of soldering materials for electronic information products. In response to the global environmental protection law and the development requirements of the electronic information industry, it is an inevitable trend for electronic information products and electrical products to be lead-free. At present, when packaging electronic products, active rosin core tin-lead solder wire and active rosin core lead-free solder wire are generally used. Since the active agent in the existing active rosin core tin-lead solder wire is an amine salt containing halogen, the flux after soldering There are more residues and more residual halogen ions, which bring hidden dangers to the reliability and stability of electronic products. In order to ensure the electrical insulation and reliability of electronic products, it i...

AI Technical Summary

Problems solved by technology

At present, when packaging electronic products, active rosin core tin-lead solder wire and active rosin core lead-free solder wire are generally used. Since the active agent in the existing active rosin core tin-lead solder wire is an amine salt containing halogen, the flux after soldering There are more residues and more residual halogen ions, which bring hidden dangers to the reliability and stability of electronic products

In order to ensure the electrical insulation and reliability of electronic products, it is necessary to clean the flux residues on the printed boards. For this reason, it is necessary to use chlorofluorocarbons or organic solvents as cleaning agents. The use of these chemical agents is harmful to the atmosphere. The depletion substances of the ozone layer are prohibited or eliminated ODS substances; and the use of organic solvents as cleaning agents not only increases production costs but also causes waste of resources, and these organic solvents are easy to volatilize into the atmosphere to pollute the environment and endanger human health; at the same time These organic solvents are flammable and pose a safety hazard