Radiation-sensed resin composition, layer insulation film, microlens and forming method thereof

A technology of resin composition and radiation, which is applied in the direction of lens, photosensitive material processing, photoplate making process of pattern surface, etc. It can solve the problems of developer penetration, low dielectric constant transmittance, easy peeling, etc.

Active Publication Date: 2013-01-02
JSR CORPORATIOON
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0009] The interlayer insulating film and microlens obtained in this way, in the development process when forming them, the development time slightly exceeds the optimal time, and the developer will penetrate between the pattern and the substrate and peel off easily, so the development time must be strictly controlled. There is a problem with the output of the product
[0010] In this way, when an interlayer insulating film or a microlens is formed from a radiation-sensitive resin composition, high sensitivity is required as a composition, and it is also required to show that even if the development time exceeds a predetermined time in the development process, no peeling of the pattern will occur. Adhesiveness, and the interlayer insulating film formed by the composition has high heat resistance, high solvent resistance, low dielectric constant, high transmittance, etc. On the other hand, when forming a microlens, it is required to be used as a Good melting shape (required radius of curvature), high heat resistance, high solvent resistance, high transmittance, etc., but radiation-sensitive resin compositions satisfying such requirements have not been known until now

Method used

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  • Radiation-sensed resin composition, layer insulation film, microlens and forming method thereof
  • Radiation-sensed resin composition, layer insulation film, microlens and forming method thereof
  • Radiation-sensed resin composition, layer insulation film, microlens and forming method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0209] Synthesis example of copolymer [A]

Synthetic example A-1

[0211] 7 parts by weight of 2,2'-azobis(2,4-dimethylvaleronitrile) and 220 parts by weight of diethylene glycol ethyl methyl ether were placed in a flask equipped with a condenser tube and a stirrer. Then load 20 parts by weight of methacrylic acid, tricyclic methacrylic acid [5.2.1.0 2，6 ] 15 parts by weight of decane-8-yl ester, 20 parts by weight of N-cyclohexylmaleimide, 30 parts by weight of glycidyl methacrylate, 15 parts by weight of styrene and α-methylstyrene dimer 3 parts by weight, after performing nitrogen substitution, stirring was started slowly. The temperature of the solution was raised to 70°C, and the temperature was maintained for 4 hours, whereby a polymer solution containing the copolymer [A-1] was obtained. The solid content concentration (referring to the ratio of the weight of the polymer to the total weight of the polymer solution; the same below) of the polymer solution was 32.0% by weight.

[0212] The polystyrene conversion weight average molecula...

Synthetic example A-2

[0214] 8 parts by weight of 2,2'-azobis(2,4-dimethylvaleronitrile) and 220 parts by weight of diethylene glycol ethyl methyl ether were placed in a flask equipped with a condenser tube and a stirrer. Then load 20 parts by weight of methacrylic acid, 45 parts by weight of 3,4-epoxycyclohexylmethyl methacrylate, 10 parts by weight of styrene, tricyclomethacrylic acid [5.2.1.0 2，6 ] 25 parts by weight of decan-8-yl ester and 3 parts by weight of α-methylstyrene dimer were replaced with nitrogen, and then stirring was started slowly. The temperature of the solution was raised to 70° C., and the temperature was maintained for 4 hours, whereby a polymer solution containing the copolymer [A-2] was obtained. The solid content concentration of this polymer solution was 31.9% by weight.

[0215] The polystyrene conversion weight average molecular weight (Mw) of copolymer [A-2] was 8,800, and molecular weight distribution (Mw / Mn) was 2.4.

[0216] Synthesis example of copolymer [C] ...

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Abstract

The invention relates to a radioactive ray sensibility resin composition, a layer insulating file and a lenticule and forming method thereof. The invention relates to a radioactive ray sensibility resin composition, be characterised in that containing: [A] a copolymer of the unsaturated compound selected from at least one of (a1) unsaturated carboxylic acid and unsaturated carboxylic acid anhydride and at least one radical selected from the epoxy ethanyl and oxygen heterocyclic ring butyl; [B] 1, 2-diazonium quinonoid compound; and [C] the compound with the ester ring epoxy ethanyl and without the carboxyl. The radioactive ray sensibility resin composition has a high sensibility, which can form a great pattern shape of the development even the developing procedure is over the optimal developing time; the invention can easily form the layer insulating film or the lenticule with a great tight.

Description

technical field [0001] The present invention relates to a radiation-sensitive resin composition, an interlayer insulating film, and a microlens, and methods for forming them. Background technique [0002] In electronic components such as thin-film transistor (hereinafter referred to as "TFT") type liquid crystal display elements, magnetic head elements, integrated circuit elements, and solid-state imaging elements, in order to insulate wirings arranged in layers, interlayer insulation is generally provided. membrane. As a material for forming an interlayer insulating film, it is preferable to obtain a desired pattern shape with a small number of steps and a material with sufficient flatness, so radiation-sensitive resin compositions are widely used (refer to Japanese Patent Laid-Open No. 2001-354822 and Japanese Patent Laid-Open 2001-343743). [0003] Among the above-mentioned electronic components, for example, a TFT-type liquid crystal display element is manufactured thr...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G03F7/028G03F7/00G02B3/00
CPCG03F7/0045G03F7/0047G03F7/022G03F7/0233G03F7/033G03F7/0382G03F7/0397G03F7/0755G03F7/40C08F220/325
Inventor 花村政晓内池千浩饭岛孝浩滨田谦一
Owner JSR CORPORATIOON
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