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Positive type radiation-sensitive resin composition, inter-layer insulating film and method for forming the same

A resin composition, radiation technology, applied in the directions of photosensitive materials, optics, and optomechanical equipment for optomechanical equipment, can solve the problem of not knowing the radiation sensitive resin composition, etc., and achieve high radiation sensitivity, light resistance and Excellent dry corrosion resistance and low dielectric properties

Active Publication Date: 2013-11-20
JSR CORPORATIOON
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, there is no known radiation-sensitive resin composition that fully satisfies such requirements

Method used

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  • Positive type radiation-sensitive resin composition, inter-layer insulating film and method for forming the same
  • Positive type radiation-sensitive resin composition, inter-layer insulating film and method for forming the same
  • Positive type radiation-sensitive resin composition, inter-layer insulating film and method for forming the same

Examples

Experimental program
Comparison scheme
Effect test

Synthetic example 1

[0191] In a flask with a condenser tube and a stirrer, 7 parts by mass of 2,2'-azobis(2,4-dimethylvaleronitrile) and 200 parts by mass of diethylene glycol ethyl methyl ether were added. Then add 18 parts by mass of methacrylic acid, 20 parts by mass of methacrylic acid tricyclic [5.2.1.0 2，6 ]decyl-8-yl ester, 12 parts by mass of tetrahydrofurfuryl methacrylate, 45 parts by mass of glycidyl methacrylate, 5 parts by mass of methacrylic acid-2,2,6,6-tetramethyl-4 -Piperidinyl ester and 3 parts by mass of α-methylstyrene dimer were replaced with nitrogen, and then slowly stirred. The temperature of the solution was raised to 70°C, and the temperature was maintained for 4 hours to obtain a polymer solution containing the copolymer [A-1]. The polystyrene equivalent weight average molecular weight (Mw) of copolymer [A-1] was 10,000, and molecular weight distribution (Mw / Mn) was 2.3. In addition, the solid content concentration (the ratio of the mass of the copolymer contained in ...

Synthetic example 2

[0193] In a flask with a condenser tube and a stirrer, 7 parts by mass of 2,2'-azobis(2,4-dimethylvaleronitrile) and 200 parts by mass of diethylene glycol ethyl methyl ether were added. Then add 18 parts by mass of methacrylic acid, 20 parts by mass of methacrylic acid tricyclic [5.2.1.0 2，6 ]decyl-8-yl ester, 12 parts by mass of tetrahydrofurfuryl methacrylate, 45 parts by mass of glycidyl methacrylate, 5 parts by mass of 2,5-di-tert-butyl-4-isopropenylphenol and 3 Parts by mass of α-methylstyrene dimer, after nitrogen replacement, start to stir slowly. The temperature of the solution was raised to 70°C, and the temperature was maintained for 4 hours to obtain a polymer solution containing the copolymer [A-2]. The polystyrene conversion weight average molecular weight (Mw) of copolymer [A-2] was 10,200, and molecular weight distribution (Mw / Mn) was 2.2. In addition, the solid content concentration of the obtained polymer solution was 33.5% by mass.

Synthetic example 3

[0195] In a flask with a condenser tube and a stirrer, 7 parts by mass of 2,2'-azobis(2,4-dimethylvaleronitrile) and 200 parts by mass of diethylene glycol ethyl methyl ether were added. Then add 18 parts by mass of methacrylic acid, 20 parts by mass of methacrylic acid tricyclic [5.2.1.0 2，6 ] Dec-8-yl ester, 12 parts by mass of tetrahydrofurfuryl methacrylate, 45 parts by mass of glycidyl methacrylate, 5 parts by mass of 2-tert-butyl-6-(3-tert-amyl-2- Hydroxy-5-methylbenzyl)-4-methylphenyl acrylate and 3 parts by mass of α-methylstyrene dimer were replaced with nitrogen, and then slowly stirred. The temperature of the solution was raised to 70° C., and the temperature was maintained for 4 hours to obtain a polymer solution containing the copolymer [A-3]. The polystyrene conversion weight average molecular weight (Mw) of copolymer [A-3] was 9,900, and molecular weight distribution (Mw / Mn) was 2.2. In addition, the solid content concentration of the obtained polymer solution...

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Abstract

The invention provides a positive type radiation-sensitive resin composition, an inter-layer insulating film and a method for forming the same. The positive type radiation-sensitive resin composition is high in radiation sensitivity and developing margin, wherein an inter-layer insulating film of heat resistance, solvent resistance, low dielectric, low light transmittance and high dry etching resistance can be formed. The positive type radiation-sensitive resin composition comprises binder polymers (A) having a hindered amine or hindered phenol structure, and 1, 2 - benzoquinone diazoimido compounds (B).The component (A) preferably comprises more than one monomers (a1) selected from unsaturated carboxylic acids or unsaturated carboxylic acid anhydrides, and a copolymer (a2) obtained from the reaction of more than one monomers selected from the compounds represented by the formula (1), (2) or (3).Besides (a1) and (a2), the component (A) also comprises a copolymer (a3) obtained from the reaction of the monomer of epoxy group-containing unsaturated compounds.

Description

technical field [0001] The present invention relates to a positive radiation-sensitive resin composition, an interlayer insulating film formed from the composition, and a method for forming the interlayer insulating film. The positive radiation-sensitive resin composition is suitable as a liquid crystal display element. (LCD) and other interlayer insulating film material. Background technique [0002] In electronic components such as thin film transistor (hereinafter referred to as "TFT") liquid crystal display elements, magnetic head elements, integrated circuit elements, and image sensors, an interlayer insulating film is generally provided to insulate interconnections arranged in layers. As a material for forming an interlayer insulating film, it is preferable that the number of steps required to obtain a required pattern shape is small and that it has sufficient planarity, so positive radiation-sensitive resin compositions are widely used (see Patent Document 1). [000...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G03F7/039G03F7/008G03F7/00
Inventor 村田惠荒井雅史花村政晓
Owner JSR CORPORATIOON
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