Radiation-sensitive resin composition, interlayer insulating film and microlens, and method for forming the same

A resin composition and ray-sensing technology, which are applied in the photoengraving process of lenses, pattern surfaces, and photosensitive materials for opto-mechanical equipment, etc., can solve the problem of not involving acrylates, etc. Effects of dielectric constant, excellent solvent and heat resistance, high radiation sensitivity

Active Publication Date: 2010-06-09
JSR CORPORATIOON
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, this gazette refers to technology specific to acrylates having a dipentaerythritol skeleton, and does not relate to compositions containing acrylates having other skeletons.

Method used

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  • Radiation-sensitive resin composition, interlayer insulating film and microlens, and method for forming the same
  • Radiation-sensitive resin composition, interlayer insulating film and microlens, and method for forming the same
  • Radiation-sensitive resin composition, interlayer insulating film and microlens, and method for forming the same

Examples

Experimental program
Comparison scheme
Effect test

preparation example Construction

[0073] Among the solvents used in the preparation of the copolymer [A], ethylene glycol alkyl ether acetate, diethylene glycol dialkyl ether, propylene glycol monoalkyl ether, propylene glycol alkyl ether acetate, 3-methanol Methyl oxypropionate. Among these solvents, diethylene glycol dimethyl ether, diethylene glycol ethyl methyl ether, propylene glycol methyl ether, propylene glycol ethyl ether, propylene glycol methyl ether acetate, methyl 3-methoxypropionate .

[0074] As the polymerization initiator used in the preparation of the copolymer [A], a polymerization initiator generally known as a radical polymerization initiator can be used. Specific examples of the polymerization initiator include 2,2'-azobisisobutyronitrile, 2,2'-azobis-(2,4-dimethylvaleronitrile), 2,2'-azobis Azo compounds such as bis-(4-methoxy-2,4-dimethylvaleronitrile); benzoyl peroxide, lauroyl peroxide, tert-butyl peroxypivalate, 1,1'- organic peroxides such as bis(tert-butylperoxy)cyclohexane; and...

Synthetic example 1

[0141] Synthesis of Synthesis Example 1 Copolymer [A-1]

[0142] Into a flask equipped with a cooling tube and a stirrer, 7 parts by mass of 2,2'-azobis(2,4-dimethylvaleronitrile) and 200 parts by mass of diethylene glycol ethyl methyl ether were added. Continue to add 16 mass parts of methacrylic acid, 16 mass parts of methacrylic acid tricyclic [5.2.1.0 2，6 ]decane-8-yl ester, 20 parts by mass of 2-methylcyclohexyl acrylate, 40 parts by mass of glycidyl methacrylate, 10 parts by mass of styrene and 3 parts by mass of α-methylstyrene dimer, After replacing with nitrogen, stirring was started slowly. The temperature of the solution was raised to 70° C., and the temperature was maintained for 4 hours to obtain a polymer solution containing copolymer [A-1]. The polystyrene conversion weight average molecular weight (Mw) of copolymer [A-1] was 8000, and molecular weight distribution (Mw / Mn) was 2.3. In addition, the solid content concentration of the polymer solution prepared ...

Synthetic example 2

[0143] Synthesis of Synthesis Example 2 Copolymer [A-2]

[0144]Into a flask equipped with a cooling tube and a stirrer, 8 parts by mass of 2,2'-azobis(2,4-dimethylvaleronitrile) and 220 parts by mass of diethylene glycol ethyl methyl ether were added. Continue to add 11 parts by mass of methacrylic acid, 12 parts by mass of tetrahydrofurfuryl methacrylate, 40 parts by mass of glycidyl methacrylate, 15 parts by mass of N-cyclohexylmaleimide, 10 parts by mass of methacrylic acid Lauryl ester, 10 parts by mass of α-methyl-p-hydroxystyrene, and 3 parts by mass of α-methylstyrene dimer were replaced with nitrogen, and then slowly stirred. The temperature of the solution was raised to 70° C., and the temperature was maintained for 5 hours to obtain a polymer solution containing the copolymer [A-2]. The polystyrene equivalent weight average molecular weight (Mw) of copolymer [A-2] was 8000, and molecular weight distribution (Mw / Mn) was 2.3. In addition, the solid content concentra...

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Abstract

The present invention relates to a radiation-sensitive resin composition, an interlayer insulating film and microlens, and a method for producing the same. The aim of the invention is to provide a radiation-sensitive resin composition which has high sensitivity for ray and has developing allowance that can form excellent pattern shape when an optimal developing time is exceeded in the developing step. The radiation-sensitive is a compound which contains [A] alkali-soluble resin, [B] 1,2-quinondiazide compound and [C] a compound which comprises at least one ethylene unsaturated bond and has a frame that comes from trimethylolpropane or pentaerythritol or a frame that comes from isocyanurate. The [A] alkali-soluble resin is the copolymer of the following unsaturated compounds: (a1) unsaturated carboxylic acid and / or unsaturated carboxylic acid anhydride, and (a2) unsaturated compound with epoxy group.

Description

technical field [0001] The present invention relates to a radiation-sensitive resin composition, an interlayer insulating film, and a microlens, and methods for producing them. Background technique [0002] Electronic components such as thin-film transistor (hereinafter referred to as "TFT") liquid crystal display elements, magnetic head elements, integrated circuit elements, and solid-state image sensor elements generally have an interlayer insulating film for insulation between layered wiring. Since as a material for forming an interlayer insulating film, it is preferable to obtain a required pattern shape with few steps and a material having sufficient flatness, a radiation-sensitive resin composition is widely used (see Japanese Patent Application Laid-Open No. 2001-354822 Publication No. 2001-343743, Japanese Patent Application Laid-Open No. 2001-343743). [0003] Among the above-mentioned electronic components, for example, a TFT liquid crystal display element is manu...

Claims

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Application Information

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IPC IPC(8): G03F7/012G03F7/00G02B3/00
Inventor 木下芳德花村政晓土井贵史高濑英明
Owner JSR CORPORATIOON
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