Process for manufacturing high temperature fluent metal return circuit with composite material of SiC/SiC

A technology of liquid metal and composite materials, which is applied in the field of preparing high-temperature liquid metal circuits with SiCf/SiC composite materials, can solve the problems of long preparation period, low matrix densification rate, and large fiber damage, and achieves reduction of yield and radioactivity level, Improved energy conversion efficiency and less thermal damage

Active Publication Date: 2008-12-10
NAT UNIV OF DEFENSE TECH
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  • Claims
  • Application Information

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Problems solved by technology

[0006] Currently preparing SiC f The main process technologies of / SiC composite materials include precursor impregnation pyrolysis (PIP), chemical vapor infiltration (CVI), reaction sintering (RS), hot pressing (HP), etc., among which PIP and CVI are mature and widely used , while RS, HP due to their prepared SiC f The impurity content of SiC composite material is relatively high, the preparation temperature is high, the damage to the fiber is large, the comprehensive performance of the composite material is not high, it is difficult to prepare complex shape composite material components, and there are few applications
The main disadvantages of the CVI process are: low densification rate of the matrix, long preparation period, and high manufacturing cost; 10-15% of pores in the composite material are used as escape channels for a large number of deposition by-product molecules, thereby affecting the mechanical properties and resistance of the composite material. Oxidation performance; the concentration of gas near the pore entrance of the porous preform is high, and the deposition rate is greater than the internal deposition rate, which can easily lead to the closure of the entrance, resulting in density gradients and higher material porosity; corrosive by-products are produced during the preparation process, these deficiencies Seriously limit its application in fusion reactors

Method used

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  • Process for manufacturing high temperature fluent metal return circuit with composite material of SiC/SiC
  • Process for manufacturing high temperature fluent metal return circuit with composite material of SiC/SiC
  • Process for manufacturing high temperature fluent metal return circuit with composite material of SiC/SiC

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Embodiment

[0026] Such as Figure 2 ~ Figure 3 The high-temperature liquid metal circuit shown is prepared by the following method steps:

[0027] 1. Purchasing and customizing quartz core molds for preparing high-temperature liquid metal circuits. The shape of the core molds is as follows: figure 1 As shown, the silicon dioxide (SiO 2 ) mass fraction is 99.9%, and its surface roughness is less than 1nm;

[0028] 2. Using SiC fiber as raw material and using three-dimensional weaving technology, SiC fiber woven parts are prepared on the above-mentioned quartz mandrel. After weaving, the outer surface is bound with SiC fiber to ensure that the fiber is tightly attached to the mandrel. The thread ends generated during the weaving process are not Stay on the inner surface to ensure the smoothness of the inner surface;

[0029] 3. Preparation of SiC by impregnation and pyrolysis of organic precursors f / SiC composite material circuit: the precursor used is polycarbosilane, polycarbosilane...

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Abstract

The invention discloses a method for preparing a high-temperature liquid metal circuit made from SiCfSiC composite material. The method comprises the following steps of: (1) preparing a quartz mandrel; (2) preparing a SiC fiber weaving piece on the quartz mandrel through a three-dimensional weaving technology; (3) Mixing polycarbosilane and dimethyl benzene, taking the mixed solution as impregnation liquid, carrying out high-pressure impregnation of the SiC fiber weaving piece in the impregnation liquid, then carrying out pyrolysis, and repeating the process from the high-pressure impregnation to the pyrolysis for 5 to 25 times to obtain a rough mould of the high-temperature liquid metal circuit; (4) using a hydrofluoric acid solution to corrode and remove the quartz mandrel in the rough mould, and then using absolute ethyl alcohol to wash and dry; (5) carrying out chemical vapor deposition with the coating thickness of between 3 and 20 mu m, and obtaining a finished product of the high-temperature liquid metal circuit after coating. The circuit prepared through the method has a good compatibility with molten metal and little damage of reinforcing material. Thus, the liquid metal circuit has excellent comprehensive performance.

Description

technical field [0001] The invention relates to the preparation of parts of a thermonuclear fusion reactor, in particular to a method for preparing a high-temperature liquid metal loop in the reactor. Background technique [0002] As an economical, safe, reliable and clean new energy source, nuclear fusion energy is of great significance for fundamentally solving the energy shortage and reducing environmental pollution, and it also has a very good application prospect in the military. The fusion reactor is the core component for obtaining and using nuclear fusion energy. Therefore, fusion reactor technology has attracted great attention from countries all over the world. Currently, the United States, Russia, France, China, Japan, South Korea, and India are cooperating on the International Thermonuclear Experimental Reactor (ITER) project to jointly develop fusion reactor technology and plan to use fusion energy for power generation in 2050 . [0003] Material technology i...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C04B35/66
Inventor 周新贵吴宜灿王军张长瑞黄群英刘荣军王洪磊于海蛟赵爽王志毅黄泽兰
Owner NAT UNIV OF DEFENSE TECH
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