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Polypropylene acid imide foam material and preparation thereof

A technology of polyacrylimide and foam materials, which is applied in the field of polyacrylimide foam materials and its preparation, and can solve the problems of decreased foam performance stability, increased foam brittleness, and difficulty in the uniformity of free radical polymerization reaction systems, etc. problems, to achieve the effect of improving heat resistance, increasing strength and modulus

Active Publication Date: 2008-12-24
CASHEM ADVANCED MATERIALS HI TECH CO LTD ZHEJIANG
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In 1979, U.S. Patent (US Pat.4139685) disclosed a method for increasing foam strength by adding styrene as the third component of the foam, but since styrene is a chemical harmful to the human body, it should not be used in large quantities; in 1986 The U.S. Patent (US Pat.4576971) of 1991 and the U.S. Patent (USPat.4996109) of 1991 disclose the method for improving foam strength by adding maleic acid or maleic anhydride, but, introduce maleic acid / anhydride causes the foam precursor-copolymer board and the brittleness of the foam to increase; someone adds metal oxides to the polymerization system to improve the mechanical properties of the foam (US Pat.6670405B1, 2003), but the addition of metal oxides makes free radicals The reaction uniformity of the polymerization reaction system is difficult to control, resulting in a decrease in the performance stability of the foam

Method used

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  • Polypropylene acid imide foam material and preparation thereof
  • Polypropylene acid imide foam material and preparation thereof
  • Polypropylene acid imide foam material and preparation thereof

Examples

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preparation example Construction

[0034] The preparation method reference of maleimide (Zhu Yulong etc., the synthesis of novel bismaleimide containing ether bond, insulating material, No.5, 2005) is carried out: aromatic diamine is dissolved in electric stirring In the three-neck flask of the device, thermometer and condenser tube, after it is completely dissolved, add maleic anhydride and stir at room temperature for 4 to 5 hours to obtain a bismaleimide solution. In the above-mentioned bismaleimide solution, add a certain amount of acetic anhydride and sodium acetate respectively, stir at room temperature for about 15 minutes, then heat to 60-65°C, continue to react for about 3 hours, after cooling, pour into water , a large number of yellow precipitates were produced, filtered, soaked in acetone, rinsed several times, and dried to obtain maleimide resin powder. The reaction formula is as follows:

[0035]

[0036] Among them, some fluorine-containing diamines can be synthesized according to the method ...

Embodiment 1

[0040]50 parts of methacrylic acid, 50 parts of methacrylonitrile, 25 parts of methacrylamide, 25 parts of bismaleimide resin whose -R- group is a C structure, 10 parts of allyl methacrylate, 10 parts Add formamide, 5 parts of dibenzoyl peroxide, 5 parts of tert-butyl peroxypivalate, 15 parts of isopropanol, 5 parts of INT-PS125, and 3 parts of benzoquinone into a 3000mL three-necked glass flask, Under stirring at room temperature for 2 hours, a homogeneous solution was formed.

[0041] Transfer the above homogeneous solution to a closed system formed by two glass plates and a sealed frame, and polymerize under the following conditions: 50°C / 24h, 60°C~90°C / 58h, 100°C / 1h to obtain the foam precursor Copolymer resin sheet.

[0042] The foam precursor copolymer resin sheet obtained above was foamed at 185°C / 1h to obtain a polymethacrylimide foam sheet blank.

[0043] The polymethacrylimide foam plate blank obtained above is machined to obtain a polymethacrylimide foam material ...

Embodiment 2

[0045] 55 parts of methacrylic acid, 45 parts of methacrylonitrile, 5 parts of bismaleimide resin with C structure in the -R- group, 1.5 parts of formamide, 3 parts of tert-butyl peroxypivalate, 2 parts tert-butyl peroxybenzoate, 1 part of tert-butyl peroxy 2-ethylhexanoate, 5 parts of isopropanol, 3 parts of INT-PS125, and 0.3 part of benzoquinone were sequentially added to a 3000 mL three-necked glass flask, and the Under nitrogen protection, stir at room temperature for 2 hours to form a homogeneous solution.

[0046] Transfer the above homogeneous solution to a closed system formed by two glass plates and a sealed frame, and polymerize under the following conditions: 50°C / 24h, 60°C~90°C / 96h, 100°C~120°C / 3h, to obtain Foam precursor copolymer resin sheet.

[0047] The foam precursor copolymer resin sheet obtained above was foamed at 190° C. / 1 h to obtain a polymethacrylimide foam sheet blank.

[0048] The polymethacrylimide foam plate blank obtained above is machined to o...

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Abstract

The invention discloses a polypropylene imide foam material and a preparation method thereof. The polypropylene imide foam material provided by the invention is prepared by the following raw material compositions by weight portion: 1 to 100 portions of propylene monomer containing carboxyl groups or ester groups, 1 to 100 portions of propylene monomer containing nitrile groups and 1 to 100 portions of bismaleimide resin. The method comprises the following steps that: the bismaleimide resin, acrylic acid monomer and acrylonitrile monomer undergo radical copolymerization to form a foam precursor copolymer, and then the polypropylene imide foam material with high strength, high modulus and high heat resistance is formed through the thermal foaming process. The polypropylene imide foam material can be widely used for manufacturing foam interlayer structural members of astronavigation, avigation and space shuttles, ships, high-speed trains and wind power generating equipment.

Description

technical field [0001] The invention relates to a polyacrylimide foam material and a preparation method thereof. Background technique [0002] Poly(meth)acrylimide foam (DE-C2726260) has excellent mechanical properties, high temperature resistance, heat and humidity resistance, high temperature creep resistance and dimensional stability, etc. Compared with other polymer foams, it has the same Under the condition of density, its strength and rigidity are high, and its compression resistance is good. Its outstanding heat resistance and excellent creep resistance at high temperatures enable this type of foam to withstand the high-temperature curing process conditions of carbon fiber / epoxy, carbon fiber / Shuangma and other resin-based composite materials, and realize foam sandwich and prepreg One-time co-curing is widely used in the manufacture of composite foam sandwich structures (DE-C2822885, DE-A3304882, US Pat.4316934). In addition, the poly(meth)acrylimide foam is prepare...

Claims

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Application Information

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IPC IPC(8): C08F220/52C08J9/00
Inventor 杨士勇胡爱军王志媛余奎范琳
Owner CASHEM ADVANCED MATERIALS HI TECH CO LTD ZHEJIANG
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