Deposition technique of arc ion plating enhanced by magnetic field

Abstract

The invention relates to the field of film preparation, in particular to a magnetic field enhanced arc ion plating deposition technology for improving the deposition rate and the deposition uniformity of the film, reducing large particle emission of a target material and improving the etching uniformity of the target material. An arc ion plating deposition device is provided with two sets of magnetic field generating devices, wherein, one set of the device is put at the back of the target material, and the other set is put inside a vacuum chamber, and deposition is carried out on a matrix by means of a coupling magnetic field generated by the two sets of coupling magnetic field generating devices. By virtue of the coupling magnetic field generated by the two sets of coupling magnetic field generating devices, the technology solves the non-uniformity of plasma distribution in a transmission space in the conventional technology, improves the deposition rate and the deposition uniformity of the film, reduces the large particle emission of the target material and the large particle content of the film, improves the film quality, expands the range of the process parameters and provides conditions for preparing films with different properties.

Description

technical field [0001] The invention relates to the field of film preparation, in particular to a magnetic field-enhanced arc ion plating deposition process, which is used to increase the deposition rate and deposition uniformity of the film, reduce the emission of large particles of the target material, and improve the etching uniformity of the target material. Background technique [0002] Arc ion plating is one of the most important technologies in industrial coating production and scientific research. Due to its simple structure, high ionization rate (70%-80%), high energy of incident particles, good diffraction, it can realize low temperature deposition, etc. A series of advantages have enabled the arc ion plating technology to develop rapidly and be widely used, showing great economic benefits and industrial application prospects. [0003] Vacuum arc discharge is a low-voltage high-current discharge, and the behavior of the vacuum arc is controlled by many fast-moving,...

AI Technical Summary

Problems solved by technology

Since arc ion plating mainly depends on the discharge of cathode spots on the target surface to deposit the required film, it is a point source. Although these traditional methods of simply applying a magnetic field near the target surface can effectively control the arc spot on the target surface movement, but it does not solve the inhomogeneity of the plasma distribution in the transmission space. At the same time, with the increase of the magnetic field strength, some ions are lost with the distribution of the magnetic field around the target, resulting in the ion density at the substrate. decline

Moreover, long-term etching is easy to form etching tracks on the target surface, resulting in uneven etching of the target.

[0005] Although arc ion plating technology has many advantages, due to the existence of large particles in arc ion plating, it seriously affects the performance and life of coatings and films.

Therefore, how to solve the problem of large particles in cathodic arc plating has a great influence on the development of cathodic arc, which has become the main topic of later development and the main factor limiting the application range of arc ions.

At present, the magnetic filtration technology is widely used, but the magnetic filtration technology reduces the transmission efficiency of the plasma, reduces the deposition rate, and requires additional equipment at the same time, and the cost is high

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