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High temperature resistant, high strength modified epoxy resin adhesive and preparation thereof

An epoxy resin, high-strength technology, applied in the direction of epoxy resin glue, adhesive, adhesive type, etc., can solve the problems of brittleness and poor temperature resistance, and achieve excellent high temperature resistance, outstanding heat resistance, excellent The effect of high temperature resistance

Inactive Publication Date: 2009-04-15
CENT SOUTH UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] The invention overcomes the disadvantages of brittleness and poor temperature resistance of ordinary epoxy resin adhesives, and is suitable for the preparation of high-strength and high-toughness epoxy resin adhesives resistant to high temperatures

Method used

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  • High temperature resistant, high strength modified epoxy resin adhesive and preparation thereof
  • High temperature resistant, high strength modified epoxy resin adhesive and preparation thereof
  • High temperature resistant, high strength modified epoxy resin adhesive and preparation thereof

Examples

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Embodiment

[0033] Preparation of polyurethane prepolymer: the polyether diol used has a number average molecular weight of 1000. Add 50g of polyether diol into a clean and dry four-necked flask, heat and keep stirring to 120°C for reflux dehydration for 1h, then cool it down to 50°C, add 17.4g of TDI, then slowly raise the temperature to 70°C, keep warm and Stir at a constant speed and react for 2 hours.

[0034] Adhesive configuration: Add 1.68g 1,4-butanediol and 0.56g trimethylolpropane to the prepared polyurethane prepolymer, stir well and then add 366.5g TDE-85 and E-51 to mix (mass ratio 1:1) epoxy resin, reacted at 100°C for 1 hour. Take 54.52g each of m-phenylenediamine and diaminodiphenylmethane, mix them uniformly in a beaker, keep the temperature at 110°C for 15 minutes, and cool to room temperature to make a supercooled liquid. Finally, the supercooled liquid was mixed with polyurethane epoxy resin at room temperature, and then 13.08 g of 2-ethyl-4-methylimidazole accelerat...

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Abstract

The invention discloses a high-temperature-resistant and high-strength modified epoxy resin structured adhesive. First, polyether diols and 2, 4-tolylene diisocyanate are reacted to prepare polyurethane prepolymer (PUP); 1, 4-butanediol and trimethylolpropane are added into the prepared PUP and, after agitation, the mixture is added into TDE-85 / E-51 epoxy resin; then, a curing agent is added into the TDE-85 / E-51 epoxy resin and, and finally, a curing accelerator is added. The prepared adhesive has high tenacity, excellent high-temperature resistance and high reaction activity. After curing, the tensile and shear strength of the adhesive reach 22.81MPa at room temperature and 12.85MPa at high temperature of 160 DEG C, and the peel strength reaches 51.68N / cm, therefore, the adhesive can be widely applied to the adhesion of metals, porcelain, plastics and wood and the like.

Description

technical field [0001] The invention relates to the field of polymer material synthesis and processing, in particular to a high-temperature-resistant, high-strength polyurethane-modified epoxy resin adhesive and a preparation method thereof. Background technique [0002] Epoxy resin adhesive is a kind of adhesive with good bonding performance and is widely used. Adhesives synthesized from epoxy resin have been widely used in aerospace, aviation, machinery, electronics, medical and other fields. However, epoxy resin has defects such as poor toughness, high brittleness of the cured product, poor impact resistance and vibration resistance, and easy cracking. As an adhesive for structural bonding, epoxy resin must be modified and toughened to meet its special technical requirements. There are many kinds of epoxy resin toughening technologies at present, among which the elastomer toughening technology represented by polyurethane and nitrile rubber is the epoxy resin toughening t...

Claims

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Application Information

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IPC IPC(8): C09J163/00
Inventor 李芝华丑纪能卢健体
Owner CENT SOUTH UNIV
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