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Photocurable/thermosetting resin composition, cured product thereof and printed wiring board obtained by using same

A resin composition and photocurable technology, applied in the field of layered and useful photocurable thermosetting resin composition and its cured product, can solve the problem of inability to obtain deep curability and surface curability, and high photopolymerization speed , Copper circuit peeling and other problems, to achieve the effect of excellent deep curing, high sensitivity resolution, high reliability

Inactive Publication Date: 2009-04-15
TAIYO INK MFG CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, it is true that these technologies can exhibit sufficient photopolymerization ability only with a 405nm bright line, but because the photopolymerization speed is very high, sufficient deep curing and surface curing cannot be obtained, and photopolymerization on the circuit after heat treatment is triggered. The inactivation of the agent leads to a significant decrease in sensitivity, and there is a problem of peeling on the copper circuit

Method used

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  • Photocurable/thermosetting resin composition, cured product thereof and printed wiring board obtained by using same
  • Photocurable/thermosetting resin composition, cured product thereof and printed wiring board obtained by using same
  • Photocurable/thermosetting resin composition, cured product thereof and printed wiring board obtained by using same

Examples

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Embodiment

[0096] The present invention will be specifically described below by showing examples and comparative examples, but the present invention is of course not limited to the following examples.

Synthetic example 1

[0098] Add 660 g of cresol novolak type epoxy resin (manufactured by Nippon Kayaku Co., Ltd., EOCN-104S, soften Point 92°C, epoxy equivalent is 220g), 421.3g carbitol acetate and 180.6g solvent naphtha, heated to 90°C and stirred to dissolve. Then, it was cooled to 60° C., 216 g of acrylic acid, 4.0 g of triphenylphosphine, and 1.3 g of methylhydroquinone were added, and reacted at 100° C. for 12 hours to obtain a reaction product having an acid value of 0.2 mgKOH / g. 241.7 g of tetrahydrophthalic anhydride was added thereto, heated to 90° C., and reacted for 6 hours. Thus, a solution of a carboxylic acid-containing resin (A) having an acid value of 50 mgKOH / g, a double bond equivalent (g weight of resin per mol of unsaturated group) of 400, and a weight average molecular weight of 7000 was obtained. Hereinafter, this carboxylic acid resin-containing solution is referred to as A-1 varnish.

Synthetic example 2

[0100] Add 430g of o-cresol novolak type epoxy resin (epoxy equivalent 215, 1 molecule has 6 on average in 2 liters of detachable flasks equipped with stirrer, thermometer, reflux condenser, dropping funnel and nitrogen inlet tube phenol core) and 144 g (2 moles) of acrylic acid. It was heated to 120°C while stirring, and the reaction was continued for 10 hours while maintaining 120°C. The reaction product was temporarily cooled to room temperature, 190 g (1.9 moles) of succinic anhydride was added, and the mixture was heated to 80° C. for 4 hours to react. The reaction product was cooled to room temperature again. The acid value of the solid content of this product was 139 mgKOH / g.

[0101] To this solution, 85.2 g (0.6 mol) of glycidyl methacrylate and 45.9 g of propylene glycol methyl ether acetate were added, heated to 110°C while stirring, and the reaction was continued for 6 hours while maintaining 110°C. The reaction product was cooled to room temperature, resulting ...

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Abstract

Disclosed is a photocurable / thermosetting resin composition developable with a diluted alkali solution, which resin composition is characterized by containing (A) an ethylenically unsaturated group-containing carboxylic acid-containing resin, (B) a sensitizer containing a coumarin backbone represented by the formula (I) below and having a maximum absorption wavelength at 360-410 nm, (C) a photopolymerization initiator, (D) a compound having two or more ethylenically unsaturated groups in a molecule, (E) a filler and (F) a thermosetting component.

Description

technical field [0001] The present invention relates to a photocurable thermosetting resin composition, a cured product thereof, and a printed wiring board obtained using the same, which are useful as insulating resin layers for printed wiring boards requiring solder resist, etc., and various electronic components. That is, it relates to a photocurable thermosetting resin composition curable by laser light having a wavelength of 400 to 410 nm, a cured product thereof, and a printed circuit board obtained by using the same. Background technique [0002] A solder resist film is formed on the outermost layer of a printed circuit board of an electronic device. Solder resist is a protective coating material that covers the surface of a printed circuit board and prevents unnecessary solder from adhering to the circuit surface when coating with solder and mounting components. Furthermore, as a permanent protective mask, it is a protective film as follows: while protecting the copp...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G03F7/031G03F7/004G03F7/033G03F7/038
CPCG03F7/031H05K3/287G03F7/038Y10T428/31678C08K5/15C08L33/02G03F7/004G03F7/0045G03F7/027G03F7/033
Inventor 柴崎阳子加藤贤治伊藤信人有马圣夫
Owner TAIYO INK MFG CO LTD
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